Patents by Inventor Yin Cheng
Yin Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12259865Abstract: One embodiment of the present invention sets forth a technique for sampling from a dataset. The technique includes determining a plurality of embeddings for a plurality of data points included in the dataset. The technique also includes populating a tree structure with the plurality of embeddings by generating a first node that stores a first set of embeddings included in the plurality of embeddings and generating a first plurality of nodes as children of the first node, where each node in the first plurality of nodes stores a different subset of embeddings in the first set of embeddings. The technique further includes sampling a subset of embeddings from the plurality of embeddings via a traversal of the tree structure, and generating a sampled dataset that includes a subset of data points corresponding to the subset of embeddings.Type: GrantFiled: December 14, 2022Date of Patent: March 25, 2025Assignee: Scale AI, Inc.Inventors: Jihan Yin, Chiao-Lun Cheng
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PACKAGE STRUCTURE INCLUDING A PACKAGE LID HAVING A PLURALITY OF FINS AND METHODS OF FORMING THE SAME
Publication number: 20250096062Abstract: A package structure includes a package substrate, an interposer module on the package substrate, a thermal interface material (TIM) layer on the interposer module, and a package lid on the TIM layer, including a package lid foot portion attached to the package substrate, a package lid plate portion connected to the package lid foot portion, and a plurality of fins extending from the package lid plate portion into the TIM layer over the interposer module.Type: ApplicationFiled: September 20, 2023Publication date: March 20, 2025Inventors: Ping-Yin Hsieh, Chih-Hao Chen, Li-Hui Cheng, Ying-Ching Shih -
Publication number: 20250084465Abstract: Methods and systems described herein involve using long cell-free DNA fragments to analyze a biological sample from a pregnant subject. The status of methylated CpG sites and single nucleotide polymorphisms (SNPs) is often used to analyze DNA fragments of a biological sample. A CpG site and a SNP are typically separated from the nearest CpG site or SNP by hundreds or thousands of base pairs. Finding two or more consecutive CpG sites or SNPs on most cell-free DNA fragments is improbable or impossible. Cell-free DNA fragments longer than 600 bp may include multiple CpG sites and/or SNPs. The presence of multiple CpG sites and/or SNPs on long cell-free DNA fragments may allow for analysis than with short cell-free DNA fragments alone. The long cell-free DNA fragments can be used to identify a tissue of origin and/or to provide information on a fetus in a pregnant female.Type: ApplicationFiled: September 11, 2024Publication date: March 13, 2025Inventors: Yuk-Ming Dennis Lo, Rossa Wai Kwun Chiu, Kwan Chee Chan, Peiyong Jiang, Suk Hang Cheng, Cheuk Yin Yu, Yee Ting Cheung, Wenlei Peng
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Publication number: 20250052511Abstract: A vapor chamber heatsink assembly, under vacuum, having a working fluid therein, comprising a plurality of heatsink fins and a vapor chamber is provided. The vapor chamber comprises an upper and lower casing having an upper and lower chamber surface, respectively. The upper and lower chamber surfaces define a plurality of obstructers forming a plurality of braided channels therearound. When heat from a greater temperature heat source and a lower temperature heat source is applied to respective contact surfaces of the lower casing, via the plurality of obstructers and braided channels, respectively, the working fluid and liquid vapor slugs/bubbles travel therethrough, providing an effective phase change mechanism to the greater temperature heat source, while concurrently, hindering agglomeration of working fluid thereto. An effective phase change mechanism is also concurrently provided to the lower temperature heat source due to the non-agglomeration of working fluid to the greater temperature heat source.Type: ApplicationFiled: October 24, 2024Publication date: February 13, 2025Inventors: Chia yu Lin, Shan yin Cheng, Chien ting Liu
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Publication number: 20250054824Abstract: A package structure including a packaging substrate, a semiconductor device, passive components, a lid, and a dam structure is provided. The semiconductor device is disposed on and electrically connected to the packaging substrate. The passive components are disposed on the packaging substrate, wherein the semiconductor device is surrounded by the passive components. The lid is disposed on the packaging substrate, and the lid covers the semiconductor device and the passive components. The dam structure is disposed between the packaging substrate and the lid, wherein the dam structure covers the passive components and laterally encloses the semiconductor device.Type: ApplicationFiled: August 8, 2023Publication date: February 13, 2025Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yi Wen Huang, Chih-Hao Chen, Ping-Yin Hsieh, Yi-Huan Liao, Li-Hui Cheng
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Patent number: 12219320Abstract: A MEMS device and a method of manufacturing the same are provided. A semiconductor device includes a substrate; and a membrane over the substrate and configured to generate charges in response to an acoustic wave, the membrane being in a polygonal shape including vertices. The membrane includes a via pattern includes: first lines that partition the membrane into slices and extend to the vertices of the membrane such that the slices are separated from each other near an anchored region of the membrane and connected to each other around a central region; and second lines extending from the anchored region of the membrane toward the central region of the membrane, each of the first lines or each of the second lines including non-straight lines.Type: GrantFiled: July 21, 2023Date of Patent: February 4, 2025Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.Inventors: Chun-Wen Cheng, Chun Yin Tsai, Chia-Hua Chu
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Publication number: 20250031357Abstract: A bonding tool with a decoupling mechanism includes a shaft, a rotary module coupled to a first portion of the shaft, a rotary motion actuator operatively connected to the rotary module and operative to drive the rotary module and the shaft to rotate about a rotary axis extending substantially along a central axis of the shaft, a linear motion module coupled to a second portion of the shaft separate from the first portion, and a linear motion actuator operatively connected to the linear motion module and operative to drive the linear motion module and the shaft to move in directions parallel to the rotary axis.Type: ApplicationFiled: July 19, 2023Publication date: January 23, 2025Inventors: Chi Wah CHENG, Wan Yin YAU, Hok Man WAN
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Publication number: 20250028036Abstract: A positioning method and a multi-radar positioning system are provided. In the positioning method, a first object and a second object are detected by a first radar to obtain a first coordinate and a second coordinate on a first coordinate system respectively. The first object and the second object are detected by a second radar to obtain a third coordinate and a fourth coordinate on a second coordinate system respectively. A first candidate coordinate and a second candidate coordinate of the second radar on the first coordinate system are estimated according to the third coordinate and the fourth coordinate. The first candidate coordinate is selected from the first candidate coordinate and the second candidate coordinate as a first radar coordinate of the second radar according to the first coordinate and the second coordinate. The first radar coordinate is output.Type: ApplicationFiled: September 7, 2023Publication date: January 23, 2025Applicant: Wistron CorporationInventors: Yin-Yu Chen, Yu-Wen Huang, Kaijen Cheng, Tsung-Yin Tsou, Yao-Tsung Chang
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Publication number: 20240428745Abstract: A processing system for simultaneously presenting brightness performance of different areas on a single display screen includes: a detection processor and a control processor. The detection processor performs a multi-point photometry of a pre-imaging area to find out the difference in ambient light intensity distribution among the points on the display screen after a display device is installed, where the pre-imaging area refers to an area of a display device set up or projected for viewing. The control processor connected to the detection processor for correspondingly cutting a screen range of the display device into multiple modulation areas based on the ambient light intensity difference of the pre-imaging area. In this way, the display screen can be adjusted to adapt to various environments with differences in brightness or position.Type: ApplicationFiled: June 12, 2024Publication date: December 26, 2024Inventors: YI-YU TSAI, SHAO-WEI CHIU, YIN-CHENG HUANG
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Patent number: 12178018Abstract: A back cover heat dissipation structure of a laptop includes a radio frequency tag module, a back cover, and a metal foil. The radio frequency tag module includes a circuit board with a component region and an antenna region. The component region and the antenna region are disposed on a bottom side and a top side of the circuit board, respectively. The back cover includes a plating region and a receiving chamber. The receiving chamber receives the radio frequency tag module. The top side of the circuit board is attached to the bottom of the receiving chamber. The metal foil not only covers the bottom side of the circuit board but also extends to cover the plating region. Therefore, not only is heat dissipation achieved, the impedance of components on the circuit board can also be adjusted to optimize the sensing capability of the radio frequency tag module.Type: GrantFiled: January 13, 2023Date of Patent: December 24, 2024Assignee: Getac Technology CorporationInventor: Yin-Cheng Tsai
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Publication number: 20240398072Abstract: A coil-type fluid-impervious zipper including: a left chain connected with a left supporting fabric tape, and a right chain connected with a right supporting fabric tape; where a left filler structure made of a first thermoplastic elastomer is formed within the left chain, a right filler structure made of the first thermoplastic elastomer is formed within the right chain, a left attachment strip made of a second thermoplastic elastomer is connected to a right side of the left filler structure, a right attachment strip made of the second thermoplastic elastomer is connected to a left side of the right filler structure, and when the coil-type fluid-impervious zipper is zipped up, the left attachment strip and the right attachment strip are compressed to engage with each other within a first gap formed between the left filler structure and the right filler structure.Type: ApplicationFiled: May 17, 2024Publication date: December 5, 2024Inventors: Chao-Mu CHOU, Shiu-Yin CHENG
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Publication number: 20240373993Abstract: A slider capable of minimizing scratching on zipper, which includes a top side plate, a bottom side plate opposing the top side plate, and a link part connecting the top side plate and the bottom side plate, the bottom side plate having two side walls extending from two side edges thereof, the top side plate having a top inner surface and a top outer surface, the bottom side plate having a bottom inner surface and a bottom outer surface, and an internal passage being formed by the top inner surface, the bottom inner surface, the side walls and the link part; and the slider being characterized in that a pair of parallel longitudinal grooves are formed in the top inner surface and/or the bottom inner surface during a molding process to accommodate at least a part of a set of border lines of a combination mold.Type: ApplicationFiled: May 7, 2024Publication date: November 14, 2024Inventors: Chao-Mu CHOU, Shiu-Yin CHENG
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Publication number: 20240347532Abstract: A heterogeneous integration capacitor and a metal-oxide-metal (MoM) capacitor are provided. The heterogeneous integration capacitor has a first electrode and a second electrode, and includes a substrate, a semiconductor capacitor, the MoM capacitor, and a metal-insulator-metal (MiM) capacitor. These capacitors are sequentially formed on the substrate, and are formed as connected in parallel.Type: ApplicationFiled: June 29, 2023Publication date: October 17, 2024Applicant: National Tsing Hua UniversityInventors: Ho-Chun Wu, Yin-Cheng Chang, Shuo-Hung Hsu
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Patent number: 12053851Abstract: A vacuum hole for suction holding a processing target object through vacuum is formed on a stage surface of a vacuum suction holding stage, and a hole corresponding to the vacuum hole is formed on an elastic pad. A jig includes a first projecting portion configured to be insertable into the vacuum hole on the vacuum suction holding stage, a support portion configured to come into contact with the stage surface with the first projecting portion inserted in the vacuum hole, and a second projecting portion projecting toward an opposite side to the first projecting portion with respect to the support portion and configured to be insertable into the hole on the elastic pad.Type: GrantFiled: June 27, 2019Date of Patent: August 6, 2024Assignee: EBARA CORPORATIONInventors: Lien Yin Cheng, Akira Imamura, Mitsuru Miyazaki, Junji Kunisawa
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Publication number: 20240151479Abstract: A vapor chamber heatsink assembly, under vacuum, having a working fluid therein, comprising a plurality of heatsink fins and a vapor chamber is provided. The vapor chamber and the plurality of heatsink fins each comprise a plurality of obstructers defining a plurality of braided channels therein. Thus, the condenser regions of the vapor chamber are expanded to the plurality of heatsink fins. When heat from a greater temperature heat source and a lower temperature heat source is applied to the vapor chamber, via the plurality of obstructers and braided channels, the working fluid and liquid vapor travel therethrough, providing an effective phase change mechanism to the greater temperature heat source, while concurrently, hindering agglomeration of working fluid thereto. An effective phase change mechanism is also concurrently provided to the lower temperature heat source due to the non-agglomeration of working fluid to the greater temperature heat source.Type: ApplicationFiled: January 16, 2024Publication date: May 9, 2024Inventors: Yuanlong Wen, Meiping Fan, Shan yin Cheng
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Patent number: 11913726Abstract: A vapor chamber heatsink assembly, under vacuum, having a working fluid therein, comprising a plurality of heatsink fins and a vapor chamber is provided. The vapor chamber and the plurality of heatsink fins each comprise a plurality of obstructers defining a plurality of braided channels therein. Thus, the condenser regions of the vapor chamber are expanded to the plurality of heatsink fins. When heat from a greater temperature heat source and a lower temperature heat source is applied to the vapor chamber, via the plurality of obstructers and braided channels, the working fluid and liquid vapor travel therethrough, providing an effective phase change mechanism to the greater temperature heat source, while concurrently, hindering agglomeration of working fluid thereto. An effective phase change mechanism is also concurrently provided to the lower temperature heat source due to the non-agglomeration of working fluid to the greater temperature heat source.Type: GrantFiled: December 22, 2020Date of Patent: February 27, 2024Assignee: Cooler Master Co., Ltd.Inventors: Yuanlong Wen, Meiping Fan, Shan yin Cheng
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Patent number: 11908371Abstract: In an automatic gamma adjustment system with environmental adaptability, the system is installed in a display device and an image signal source is selected, such that an image signal is received and converted into first YUV signals, while detecting the surrounding situation to obtain at least one environmental data, and obtaining a gamma control parameter of a display screen of the display device according to the environmental data. When the environmental data is calculated to obtain a maximum brightness current value, the gamma control parameter is used to calculate the first YUV signals as second YUV signals, and the maximum brightness current value and the second YUV signals are sent to the display device for displaying the image. Therefore the grayscale layering effect of an image presented to people can be adjusted by automatically correcting the gamma value according to the surrounding situation at any time.Type: GrantFiled: May 23, 2023Date of Patent: February 20, 2024Assignee: STARLIGHT DISPLAY CORPORATIONInventors: Shao-Wei Chiu, Yi-Yu Tsai, Yin-Cheng Huang
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Publication number: 20230410712Abstract: In an automatic gamma adjustment system with environmental adaptability, the system is installed in a display device and an image signal source is selected, such that an image signal is received and converted into first YUV signals, while detecting the surrounding situation to obtain at least one environmental data, and obtaining a gamma control parameter of a display screen of the display device according to the environmental data. When the environmental data is calculated to obtain a maximum brightness current value, the gamma control parameter is used to calculate the first YUV signals as second YUV signals, and the maximum brightness current value and the second YUV signals are sent to the display device for displaying the image. Therefore the grayscale layering effect of an image presented to people can be adjusted by automatically correcting the gamma value according to the surrounding situation at any time.Type: ApplicationFiled: May 23, 2023Publication date: December 21, 2023Inventors: SHAO-WEI CHIU, YI-YU TSAI, YIN-CHENG HUANG
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Publication number: 20230400898Abstract: A back cover heat dissipation structure of a laptop includes a radio frequency tag module, a back cover, and a metal foil. The radio frequency tag module includes a circuit board with a component region and an antenna region. The component region and the antenna region are disposed on a bottom side and a top side of the circuit board, respectively. The back cover includes a plating region and a receiving chamber. The receiving chamber receives the radio frequency tag module. The top side of the circuit board is attached to the bottom of the receiving chamber. The metal foil not only covers the bottom side of the circuit board but also extends to cover the plating region. Therefore, not only is heat dissipation achieved, the impedance of components on the circuit board can also be adjusted to optimize the sensing capability of the radio frequency tag module.Type: ApplicationFiled: January 13, 2023Publication date: December 14, 2023Inventor: Yin-Cheng Tsai
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Patent number: 11840037Abstract: A fluid-impervious slide fastener is disposed; an covering abutting member is formed in a central slit of a pair of support tapes, the covering abutting member has a first covering body having a covering layer and a second covering body having a covering layer; when the fluid-impervious slide fastener is in a coupled status, the first covering body and the second covering body are able to elastically abut against each other so as to form a tightening deformation, thus the central slit is provided with a fluid-impervious function against a fluid, for example a liquid, of capable of bearing a hydrostatic pressure of 30 gf/cm2.Type: GrantFiled: October 27, 2022Date of Patent: December 12, 2023Inventors: Chao-Mu Chou, Shiu-Yin Cheng