Patents by Inventor Yin Cheng
Yin Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12288510Abstract: An LED display screen configuration system for improving the gray scale recognition effect of human eyes used in a direct-view LED display screen sets a first current matched with a selected gamma value to output light to define a first brightness range, then uses a brightness X˜100% in the first brightness range to form a first modulation interval and a brightness Y % as a minimum allowable value, and sets the next current to form the next modulation interval, and so on and so forth. In any two adjacent modulation intervals, the maximum brightness outputted from the latter modulation interval is equal to or slightly greater than the brightness X % of the previous modulation interval, so that the respective current outputs of the 1st to the Nth modulation intervals show a power decreasing relationship, so as to set or switch to the most suitable modulation interval for the practical brightness requirements.Type: GrantFiled: April 19, 2024Date of Patent: April 29, 2025Assignee: STARLIGHT DISPLAY CORPORATIONInventors: Yi-Yu Tsai, Shao-Wei Chiu, Yin-Cheng Huang
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Publication number: 20250130067Abstract: A map service providing method and a map service providing system based on autonomous driving simulation testing is disclosed.Type: ApplicationFiled: October 16, 2024Publication date: April 24, 2025Inventors: Anping Mao, Yin Cheng, Shaokun Sui, Yue Li
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Patent number: 12281849Abstract: A heat dissipation device is configured for a working fluid to flow therethrough. The heat dissipation device includes a base, at least one heat dissipation fin, and at least one fluid replenisher. The base has at least one internal channel configured for the working fluid to flow therethrough. The at least one heat dissipation fin having an extension channel and an inlet and an outlet is in fluid communication with the extension channel. The at least one heat dissipation fin is inserted into one side of the base, and the extension channel is communicated with the at least one internal channel through the inlet and the outlet. The at least one fluid replenisher is connected to at least one internal channel.Type: GrantFiled: November 8, 2022Date of Patent: April 22, 2025Assignee: COOLER MASTER CO., LTD.Inventors: Kui-Yen Chen, Shan-Yin Cheng
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Publication number: 20250112122Abstract: Integrated circuit (IC) devices and systems with backside power gates, and methods of forming the same, are disclosed herein. In one embodiment, an integrated circuit die includes a device layer with one or more transistors, a first interconnect over the device layer, a second interconnect under the device layer, and one or more power gates under the device layer.Type: ApplicationFiled: September 29, 2023Publication date: April 3, 2025Applicant: INTEL CORPORATIONInventors: Kevin P. O'Brien, Paul Gutwin, David L. Kencke, Mahmut Sami Kavrik, Daniel Chanemougame, Ashish Verma Penumatcha, Carl Hugo Naylor, Kirby Maxey, Uygar E. Avci, Tristan A. Tronic, Chelsey Dorow, Andrey Vyatskikh, Rachel A. Steinhardt, Chia-Ching Lin, Chi-Yin Cheng, Yu-Jin Chen, Tyrone Wilson
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Publication number: 20250052511Abstract: A vapor chamber heatsink assembly, under vacuum, having a working fluid therein, comprising a plurality of heatsink fins and a vapor chamber is provided. The vapor chamber comprises an upper and lower casing having an upper and lower chamber surface, respectively. The upper and lower chamber surfaces define a plurality of obstructers forming a plurality of braided channels therearound. When heat from a greater temperature heat source and a lower temperature heat source is applied to respective contact surfaces of the lower casing, via the plurality of obstructers and braided channels, respectively, the working fluid and liquid vapor slugs/bubbles travel therethrough, providing an effective phase change mechanism to the greater temperature heat source, while concurrently, hindering agglomeration of working fluid thereto. An effective phase change mechanism is also concurrently provided to the lower temperature heat source due to the non-agglomeration of working fluid to the greater temperature heat source.Type: ApplicationFiled: October 24, 2024Publication date: February 13, 2025Inventors: Chia yu Lin, Shan yin Cheng, Chien ting Liu
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Publication number: 20240428745Abstract: A processing system for simultaneously presenting brightness performance of different areas on a single display screen includes: a detection processor and a control processor. The detection processor performs a multi-point photometry of a pre-imaging area to find out the difference in ambient light intensity distribution among the points on the display screen after a display device is installed, where the pre-imaging area refers to an area of a display device set up or projected for viewing. The control processor connected to the detection processor for correspondingly cutting a screen range of the display device into multiple modulation areas based on the ambient light intensity difference of the pre-imaging area. In this way, the display screen can be adjusted to adapt to various environments with differences in brightness or position.Type: ApplicationFiled: June 12, 2024Publication date: December 26, 2024Inventors: YI-YU TSAI, SHAO-WEI CHIU, YIN-CHENG HUANG
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Patent number: 12178018Abstract: A back cover heat dissipation structure of a laptop includes a radio frequency tag module, a back cover, and a metal foil. The radio frequency tag module includes a circuit board with a component region and an antenna region. The component region and the antenna region are disposed on a bottom side and a top side of the circuit board, respectively. The back cover includes a plating region and a receiving chamber. The receiving chamber receives the radio frequency tag module. The top side of the circuit board is attached to the bottom of the receiving chamber. The metal foil not only covers the bottom side of the circuit board but also extends to cover the plating region. Therefore, not only is heat dissipation achieved, the impedance of components on the circuit board can also be adjusted to optimize the sensing capability of the radio frequency tag module.Type: GrantFiled: January 13, 2023Date of Patent: December 24, 2024Assignee: Getac Technology CorporationInventor: Yin-Cheng Tsai
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Publication number: 20240398072Abstract: A coil-type fluid-impervious zipper including: a left chain connected with a left supporting fabric tape, and a right chain connected with a right supporting fabric tape; where a left filler structure made of a first thermoplastic elastomer is formed within the left chain, a right filler structure made of the first thermoplastic elastomer is formed within the right chain, a left attachment strip made of a second thermoplastic elastomer is connected to a right side of the left filler structure, a right attachment strip made of the second thermoplastic elastomer is connected to a left side of the right filler structure, and when the coil-type fluid-impervious zipper is zipped up, the left attachment strip and the right attachment strip are compressed to engage with each other within a first gap formed between the left filler structure and the right filler structure.Type: ApplicationFiled: May 17, 2024Publication date: December 5, 2024Inventors: Chao-Mu CHOU, Shiu-Yin CHENG
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Publication number: 20240373993Abstract: A slider capable of minimizing scratching on zipper, which includes a top side plate, a bottom side plate opposing the top side plate, and a link part connecting the top side plate and the bottom side plate, the bottom side plate having two side walls extending from two side edges thereof, the top side plate having a top inner surface and a top outer surface, the bottom side plate having a bottom inner surface and a bottom outer surface, and an internal passage being formed by the top inner surface, the bottom inner surface, the side walls and the link part; and the slider being characterized in that a pair of parallel longitudinal grooves are formed in the top inner surface and/or the bottom inner surface during a molding process to accommodate at least a part of a set of border lines of a combination mold.Type: ApplicationFiled: May 7, 2024Publication date: November 14, 2024Inventors: Chao-Mu CHOU, Shiu-Yin CHENG
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Publication number: 20240347532Abstract: A heterogeneous integration capacitor and a metal-oxide-metal (MoM) capacitor are provided. The heterogeneous integration capacitor has a first electrode and a second electrode, and includes a substrate, a semiconductor capacitor, the MoM capacitor, and a metal-insulator-metal (MiM) capacitor. These capacitors are sequentially formed on the substrate, and are formed as connected in parallel.Type: ApplicationFiled: June 29, 2023Publication date: October 17, 2024Applicant: National Tsing Hua UniversityInventors: Ho-Chun Wu, Yin-Cheng Chang, Shuo-Hung Hsu
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Patent number: 12053851Abstract: A vacuum hole for suction holding a processing target object through vacuum is formed on a stage surface of a vacuum suction holding stage, and a hole corresponding to the vacuum hole is formed on an elastic pad. A jig includes a first projecting portion configured to be insertable into the vacuum hole on the vacuum suction holding stage, a support portion configured to come into contact with the stage surface with the first projecting portion inserted in the vacuum hole, and a second projecting portion projecting toward an opposite side to the first projecting portion with respect to the support portion and configured to be insertable into the hole on the elastic pad.Type: GrantFiled: June 27, 2019Date of Patent: August 6, 2024Assignee: EBARA CORPORATIONInventors: Lien Yin Cheng, Akira Imamura, Mitsuru Miyazaki, Junji Kunisawa
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Publication number: 20240151479Abstract: A vapor chamber heatsink assembly, under vacuum, having a working fluid therein, comprising a plurality of heatsink fins and a vapor chamber is provided. The vapor chamber and the plurality of heatsink fins each comprise a plurality of obstructers defining a plurality of braided channels therein. Thus, the condenser regions of the vapor chamber are expanded to the plurality of heatsink fins. When heat from a greater temperature heat source and a lower temperature heat source is applied to the vapor chamber, via the plurality of obstructers and braided channels, the working fluid and liquid vapor travel therethrough, providing an effective phase change mechanism to the greater temperature heat source, while concurrently, hindering agglomeration of working fluid thereto. An effective phase change mechanism is also concurrently provided to the lower temperature heat source due to the non-agglomeration of working fluid to the greater temperature heat source.Type: ApplicationFiled: January 16, 2024Publication date: May 9, 2024Inventors: Yuanlong Wen, Meiping Fan, Shan yin Cheng
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Patent number: 11913726Abstract: A vapor chamber heatsink assembly, under vacuum, having a working fluid therein, comprising a plurality of heatsink fins and a vapor chamber is provided. The vapor chamber and the plurality of heatsink fins each comprise a plurality of obstructers defining a plurality of braided channels therein. Thus, the condenser regions of the vapor chamber are expanded to the plurality of heatsink fins. When heat from a greater temperature heat source and a lower temperature heat source is applied to the vapor chamber, via the plurality of obstructers and braided channels, the working fluid and liquid vapor travel therethrough, providing an effective phase change mechanism to the greater temperature heat source, while concurrently, hindering agglomeration of working fluid thereto. An effective phase change mechanism is also concurrently provided to the lower temperature heat source due to the non-agglomeration of working fluid to the greater temperature heat source.Type: GrantFiled: December 22, 2020Date of Patent: February 27, 2024Assignee: Cooler Master Co., Ltd.Inventors: Yuanlong Wen, Meiping Fan, Shan yin Cheng
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Patent number: 11908371Abstract: In an automatic gamma adjustment system with environmental adaptability, the system is installed in a display device and an image signal source is selected, such that an image signal is received and converted into first YUV signals, while detecting the surrounding situation to obtain at least one environmental data, and obtaining a gamma control parameter of a display screen of the display device according to the environmental data. When the environmental data is calculated to obtain a maximum brightness current value, the gamma control parameter is used to calculate the first YUV signals as second YUV signals, and the maximum brightness current value and the second YUV signals are sent to the display device for displaying the image. Therefore the grayscale layering effect of an image presented to people can be adjusted by automatically correcting the gamma value according to the surrounding situation at any time.Type: GrantFiled: May 23, 2023Date of Patent: February 20, 2024Assignee: STARLIGHT DISPLAY CORPORATIONInventors: Shao-Wei Chiu, Yi-Yu Tsai, Yin-Cheng Huang
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Publication number: 20230410712Abstract: In an automatic gamma adjustment system with environmental adaptability, the system is installed in a display device and an image signal source is selected, such that an image signal is received and converted into first YUV signals, while detecting the surrounding situation to obtain at least one environmental data, and obtaining a gamma control parameter of a display screen of the display device according to the environmental data. When the environmental data is calculated to obtain a maximum brightness current value, the gamma control parameter is used to calculate the first YUV signals as second YUV signals, and the maximum brightness current value and the second YUV signals are sent to the display device for displaying the image. Therefore the grayscale layering effect of an image presented to people can be adjusted by automatically correcting the gamma value according to the surrounding situation at any time.Type: ApplicationFiled: May 23, 2023Publication date: December 21, 2023Inventors: SHAO-WEI CHIU, YI-YU TSAI, YIN-CHENG HUANG
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Publication number: 20230400898Abstract: A back cover heat dissipation structure of a laptop includes a radio frequency tag module, a back cover, and a metal foil. The radio frequency tag module includes a circuit board with a component region and an antenna region. The component region and the antenna region are disposed on a bottom side and a top side of the circuit board, respectively. The back cover includes a plating region and a receiving chamber. The receiving chamber receives the radio frequency tag module. The top side of the circuit board is attached to the bottom of the receiving chamber. The metal foil not only covers the bottom side of the circuit board but also extends to cover the plating region. Therefore, not only is heat dissipation achieved, the impedance of components on the circuit board can also be adjusted to optimize the sensing capability of the radio frequency tag module.Type: ApplicationFiled: January 13, 2023Publication date: December 14, 2023Inventor: Yin-Cheng Tsai
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Patent number: 11840037Abstract: A fluid-impervious slide fastener is disposed; an covering abutting member is formed in a central slit of a pair of support tapes, the covering abutting member has a first covering body having a covering layer and a second covering body having a covering layer; when the fluid-impervious slide fastener is in a coupled status, the first covering body and the second covering body are able to elastically abut against each other so as to form a tightening deformation, thus the central slit is provided with a fluid-impervious function against a fluid, for example a liquid, of capable of bearing a hydrostatic pressure of 30 gf/cm2.Type: GrantFiled: October 27, 2022Date of Patent: December 12, 2023Inventors: Chao-Mu Chou, Shiu-Yin Cheng
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Patent number: 11773118Abstract: A new process to synthesis of compound OBI-3424 R-form and S-form products is provided. The “R-form” compound OBI-3423 was first synthesized with 48% overall yield from compound OBI-3424-5 by installation of the labile phosphate motif at later stage. The stereo chemistry is established by 5 steps chemo-enzyme combination synthesis to afford 99% optical purity. After then, the “S-form” compound OBI-3424 is prepared with improving overall yield of 54% from compound OBI-3424-5. The stereo chemistry is established by 4 steps combination of chemo-enzyme synthesis with excellent optical purity of 99%.Type: GrantFiled: February 21, 2020Date of Patent: October 3, 2023Assignee: OBI PHARMA, INC.Inventors: Cheng-Der Tony Yu, Yih-Huang Hsieh, Shu-Yi Lin, Chin-Sheng Chao, Yin-Cheng Hsieh, Ming-Tain Lai
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Publication number: 20230289552Abstract: Tracker tags, smart tags, locator tags, and the like are provided. A portable tracker device, according to one implementation, includes a housing having a front cover and a back cover. The portable tracker device also includes Radio Frequency (RF) circuitry configured to operate within at least one of a Bluetooth (BT) frequency range and an Ultra-Wideband (UWB) frequency range. Also, the portable tracker device includes a piezoelectric device having a first conductive plate and a second conductive plate. The RF circuitry utilizes at least one of the front cover, the back cover, the first conductive plate, and the second conductive plate as one or more antennas.Type: ApplicationFiled: May 23, 2023Publication date: September 14, 2023Inventors: Miroslav SAMARDZIJA, Hsiang Yin CHENG, Ming-Tsung SU, Liem Hieu Dinh VO
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Publication number: 20230272980Abstract: The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.Type: ApplicationFiled: May 5, 2023Publication date: August 31, 2023Applicant: COOLER MASTER CO., LTD.Inventors: Chi-Chuan WANG, Chang-Yu HSIEH, Shan-Yin CHENG, Hsiang-Fen CHOU