Abstract: The present invention relates to an active measuring probe for EMI detection comprising a first connecting member, an impedance element, an amplifier and a second connecting member. The first connecting member is coupled to one terminal of the impedance element and an input terminal of the amplifier. The other terminal of the impedance element is coupled to a ground terminal. The second connecting member is coupled to an output terminal of the amplifier.

Abstract: The present invention relates to an active measuring probe for EMI detection comprising a first connecting member, an impedance element, an amplifier and a second connecting member. The first connecting member is coupled to one terminal of the impedance element and an input terminal of the amplifier. The other terminal of the impedance element is coupled to a ground terminal. The second connecting member is coupled to an output terminal of the amplifier.

Abstract: A conducted type current probe is provided herein and comprises a plurality of first resistors, at least one second resistor, a first connective port, and a second connective port. The first resistors are connected in parallel to form a resistor with 1? resistance value, and the resistance value of the second resistor is 49?. The first resistors and the second resistor are connected. The first connective port is connected with a test end of a test Integrated Circuit (IC), and the second connective port is connected with a test receiver by a coaxial cable.

Abstract: The present invention provides a package framework for a photoelectric conversion module, in which a photoelectric device is mounted on a printed circuit board such as a rigid-flex PCB and a HDI (High Density Interconnect) PCB, and then is connected, via a flexible printed circuit board, to a traditional printed circuit board having a driver chip or a digital signal processing integrated circuit disposed thereon. The present invention can prevent signal transmission interference caused by using bond wire, and can also maintain the stability of mechanical structure.

Abstract: The present invention provides a package framework for a photoelectric conversion module, in which a photoelectric device is mounted on a printed circuit board such as a rigid-flex PCB and a HDI (High Density Interconnect) PCB, and then is connected, via a flexible printed circuit board, to a traditional printed circuit board having a driver chip or a digital signal processing integrated circuit disposed thereon. The present invention can prevent signal transmission interference caused by using bond wire, and can also maintain the stability of mechanical structure.

Abstract: A conducted type current probe is provided herein and comprises a plurality of first resistors, at least one second resistor, a first connective port, and a second connective port. The first resistors are connected in parallel to form a resistor with 1? resistance value, and the resistance value of the second resistor is 49?. The first resistors and the second resistor are connected. The first connective port is connected with a test end of a test Integrated Circuit (IC), and the second connective port is connected with a test receiver by a coaxial cable.

Abstract: The present invention discloses a semiconductor chip probe for measuring conducted electromagnetic emission (EME) of a bare die and a conducted EME measurement apparatus with the semiconductor chip probe. The semiconductor chip probe comprises a substrate, a dielectric layer, an impedance unit, a measuring unit and a connection unit. The measurement apparatus comprises a semiconductor chip probe, a high frequency probe, a signal cable and a test receiver. The integrated passive component network designed and embedded inside the semiconductor chip probe forms the 1? or 150? impedance network. And the semiconductor chip probe is able to directly couple the EME conducted current or voltage from the test pin of the flipped chip under test to the test receiver for measurement.

Abstract: The present invention discloses a semiconductor chip probe for measuring conducted electromagnetic emission (EME) of a bare die and a conducted EME measurement apparatus with the semiconductor chip probe. The semiconductor chip probe comprises a substrate, a dielectric layer, an impedance unit, a measuring unit and a connection unit. The measurement apparatus comprises a semiconductor chip probe, a high frequency probe, a signal cable and a test receiver. The integrated passive component network designed and embedded inside the semiconductor chip probe forms the 1? or 150? impedance network. And the semiconductor chip probe is able to directly couple the EME conducted current or voltage from the test pin of the flipped chip under test to the test receiver for measurement.