Patents by Inventor Yin Fun Ng

Yin Fun Ng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die bonder providing a large bonding force
    Patent number: 8651159
    Abstract: A die bonder is provided comprising a bond head including a collet for picking up a die and bonding the die at a bonding site. The die bonder further comprises a first motor which is connected to the collet by a shaft for driving the collet in driving directions towards and away from the bonding site and a second motor which is connected to the bond head for driving the bond head in directions parallel to the driving directions of the first motor. A rotary motor is also operatively connected to the collet for rotating the collet about a rotational axis that is parallel to the driving directions of the first motor. The shaft is slidably connected to the rotary motor and is slidable relative to the rotary motor when it is driven by the first motor to move.
    Type: Grant
    Filed: June 12, 2009
    Date of Patent: February 18, 2014
    Assignee: ASM Assembly Automation Ltd
    Inventors: Sun Kuen Wong, Hon Chiu Hui, Yin Fun Ng
  • Rotary bonding tool which provides a large bond force
    Patent number: 8016010
    Abstract: A die bonder comprises a bond head having a load shaft which passes through the bond head and a collet located at one end of the load shaft for holding a die to be bonded. A bond force motor is operative to drive the load shaft along a travel axis in directions towards and away from a die bonding position. A rotary motor is operative to rotate the load shaft about a rotational axis parallel to the travel axis. A coupler which comprises a bearing couples the load shaft to the bond force motor to allow the load shaft to rotate about the rotational axis relative to the bond force motor.
    Type: Grant
    Filed: September 2, 2009
    Date of Patent: September 13, 2011
    Assignee: ASM Assembly Automation Ltd
    Inventors: Yin Fun Ng, Gary Peter Widdowson, Hon Chiu Hui
  • ROTARY BONDING TOOL WHICH PROVIDES A LARGE BOND FORCE
    Publication number: 20110048648
    Abstract: A die bonder comprises a bond head having a load shaft which passes through the bond head and a collet located at one end of the load shaft for holding a die to be bonded. A bond force motor is operative to drive the load shaft along a travel axis in directions towards and away from a die bonding position. A rotary motor is operative to rotate the load shaft about a rotational axis parallel to the travel axis. A coupler which comprises a bearing couples the load shaft to the bond force motor to allow the load shaft to rotate about the rotational axis relative to the bond force motor.
    Type: Application
    Filed: September 2, 2009
    Publication date: March 3, 2011
    Inventors: Yin Fun NG, Gary Peter WIDDOWSON, Hon Chiu HUI
  • DIE BONDER PROVIDING A LARGE BONDING FORCE
    Publication number: 20100314050
    Abstract: A die bonder is provided comprising a bond head including a collet for picking up a die and bonding the die at a bonding site. The die bonder further comprises a first motor which is connected to the collet by a shaft for driving the collet in driving directions towards and away from the bonding site and a second motor which is connected to the bond head for driving the bond head in directions parallel to the driving directions of the first motor. A rotary motor is also operatively connected to the collet for rotating the collet about a rotational axis that is parallel to the driving directions of the first motor. The shaft is slidably connected to the rotary motor and is slidable relative to the rotary motor when it is driven by the first motor to move.
    Type: Application
    Filed: June 12, 2009
    Publication date: December 16, 2010
    Inventors: Sun Kuen WONG, Hon Chiu HUI, Yin Fun NG