Patents by Inventor Yin-Huang KUNG

Yin-Huang KUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Stacked semiconductor package and packaging method thereof
    Patent number: 11670622
    Abstract: A stacked semiconductor package has a substrate, a first chip, at least one spacer, a second chip and an encapsulation. The first chip and the second chip are intersecting stacked on the substrate. The at least one spacer is stacked on the substrate to support the second chip. The encapsulation is formed to encapsulate the substrate, the first chip, the at least one spacer and the second chip. The at least one spacer is made of the material of the encapsulation. Therefore, the adhesion between the at least one spacer and the encapsulation is enhanced to avoid the delamination during the reliability test and enhances the reliability of the stacked semiconductor package.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: June 6, 2023
    Assignee: Powertech Technology Inc.
    Inventors: Yin-Huang Kung, Chia-Hung Lin, Fu-Yuan Yao, Chun-Wu Liu
  • STACKED SEMICONDUCTOR PACKAGE AND PACKAGING METHOD THEREOF
    Publication number: 20220165709
    Abstract: A stacked semiconductor package has a substrate, a first chip, at least one spacer, a second chip and an encapsulation. The first chip and the second chip are intersecting stacked on the substrate. The at least one spacer is stacked on the substrate to support the second chip. The encapsulation is formed to encapsulate the substrate, the first chip, the at least one spacer and the second chip. The at least one spacer is made of the material of the encapsulation. Therefore, the adhesion between the at least one spacer and the encapsulation is enhanced to avoid the delamination during the reliability test and enhances the reliability of the stacked semiconductor package.
    Type: Application
    Filed: March 23, 2021
    Publication date: May 26, 2022
    Applicant: Powertech Technology Inc.
    Inventors: Yin-Huang KUNG, Chia-Hung LIN, Fu-Yuan YAO, Chun-Wu LIU