Patents by Inventor Yin-Ku CHANG

Yin-Ku CHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit device
    Patent number: 9443843
    Abstract: The invention provides an integrated circuit device. The integrated circuit device includes a substrate. A first capacitor is disposed on the substrate. A first metal pattern is coupled to a first electrode of the first capacitor. A second metal pattern is coupled to a first electrode of the second capacitor. A third metal pattern is disposed over the first and second metal patterns. The third metal pattern covers the first capacitor, the first metal pattern and the second metal pattern. The third metal pattern is electrically grounding. An inductor is disposed over the third metal pattern.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: September 13, 2016
    Assignee: VIA TECHNOLOGIES, INC.
    Inventors: Sheng-Yuan Lee, Yin-Ku Chang
  • Integrated circuit device
    Patent number: 9443842
    Abstract: The invention provides an integrated circuit device. The integrated circuit device includes a substrate. A first capacitor is disposed on the substrate. A first metal pattern is coupled to a first electrode of the first capacitor. A second metal pattern is coupled to a first electrode of the second capacitor. A third metal pattern is disposed over the first and second metal patterns. The third metal pattern covers the first capacitor, the first metal pattern, and the second metal pattern. The third metal pattern is electrically grounded. An inductor is disposed over the third metal pattern.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: September 13, 2016
    Assignee: VIA TECHNOLOGIES, INC.
    Inventors: Sheng-Yuan Lee, Yin-Ku Chang
  • INTEGRATED CIRCUIT DEVICE
    Publication number: 20160148926
    Abstract: The invention provides an integrated circuit device. The integrated circuit device includes a substrate. A first capacitor is disposed on the substrate. A first metal pattern is coupled to a first electrode of the first capacitor. A second metal pattern is coupled to a first electrode of the second capacitor. A third metal pattern is disposed over the first and second metal patterns. The third metal pattern covers the first capacitor, the first metal pattern and the second metal pattern. The third metal pattern is electrically grounding. An inductor is disposed over the third metal pattern.
    Type: Application
    Filed: October 29, 2015
    Publication date: May 26, 2016
    Inventors: Sheng-Yuan LEE, Yin-Ku CHANG
  • INTEGRATED CIRCUIT DEVICE
    Publication number: 20160148929
    Abstract: The invention provides an integrated circuit device. The integrated circuit device includes a substrate. A first capacitor is disposed on the substrate. A first metal pattern is coupled to a first electrode of the first capacitor. A second metal pattern is coupled to a first electrode of the second capacitor. A third metal pattern is disposed over the first and second metal patterns. The third metal pattern covers the first capacitor, the first metal pattern, and the second metal pattern. The third metal pattern is electrically grounded. An inductor is disposed over the third metal pattern.
    Type: Application
    Filed: October 29, 2015
    Publication date: May 26, 2016
    Inventors: Sheng-Yuan LEE, Yin-Ku CHANG