Patents by Inventor Yin-Lin Lee

Yin-Lin Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conductive polymeric composition and fiber yarn
    Patent number: 11578182
    Abstract: A conductive polymeric composition includes, based on a total weight of the conductive polymeric composition, 0.1 wt % to 10 wt % of carbon nanotubes, 0.2 wt % to 4 wt % of a first component, 0.1 wt % to 4 wt % of a second component made by esterification of a C16-C30 fatty acid with a polyol compound, and the balance being a polymeric component. When the first component is a first polymer obtained from polycondensation of an aromatic diacid compound and an aliphatic glycol compound, the polymeric component is a polyester. When the first component is a second polymer obtained from polycondensation of a lactam compound, a diamine compound and a dicarboxylic acid compound, the polymeric component is a polyamide.
    Type: Grant
    Filed: December 9, 2020
    Date of Patent: February 14, 2023
    Assignee: Wendell Industrial Co., Ltd.
    Inventors: Chih-Hung Kao, Tzu-Chung Lu, Yin-Lin Lee, Chih-Hua Lin, Ya-Yu Huang
  • CONDUCTIVE POLYMERIC COMPOSITION AND FIBER YARN
    Publication number: 20210253824
    Abstract: A conductive polymeric composition includes, based on a total weight of the conductive polymeric composition, 0.1 wt % to 10 wt % of carbon nanotubes, 0.2 wt % to 4 wt % of a first component, 0.1 wt % to 4 wt % of a second component made by esterification of a C16-C30 fatty acid with a polyol compound, and the balance being a polymeric component. When the first component is a first polymer obtained from polycondensation of an aromatic diacid compound and an aliphatic glycol compound, the polymeric component is a polyester. When the first component is a second polymer obtained from polycondensation of a lactam compound, a diamine compound and a dicarboxylic acid compound, the polymeric component is a polyamide.
    Type: Application
    Filed: December 9, 2020
    Publication date: August 19, 2021
    Inventors: Chih-Hung Kao, Tzu-Chung Lu, Yin-Lin Lee, Chih-Hua Lin, Ya-Yu Huang