Patents by Inventor Yin Meng

Yin Meng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11291135
    Abstract: A chassis includes a receiving member, a bracket, and a sliding assembly. The bracket is configured to be mounted in a cabinet. The sliding assembly is configured to slidably mount the receiving member on the bracket.
    Type: Grant
    Filed: November 18, 2020
    Date of Patent: March 29, 2022
    Assignee: HONGFUJIN PRECISION ELECTRONICS(TIANJIN)CO., LTD.
    Inventors: Han-Yu Li, Xiang-Hui Zeng, Fan-Yin Meng
  • Publication number: 20220015257
    Abstract: A chassis includes a receiving member, a bracket, and a sliding assembly. The bracket is configured to be mounted in a cabinet. The sliding assembly is configured to slidably mount the receiving member on the bracket.
    Type: Application
    Filed: November 18, 2020
    Publication date: January 13, 2022
    Inventors: HAN-YU LI, XIANG-HUI ZENG, FAN-YIN MENG
  • Patent number: 10721833
    Abstract: A server which can be connected from the back or from the front includes a case and a compute node disposed in the case. The case has a front board and an opposite rear board. The compute node has a plurality of ports for connecting to external cables. The front board has a first opening defined thereon, the rear board has a second opening defined thereon, and the second opening faces the first opening. The compute node is capable of being loaded into the case facing a first direction, such that the plurality of ports are exposed from the first opening. The compute node is also capable of being loaded into the case facing a second direction, opposite to the first direction, such that the plurality of ports are exposed from the second opening.
    Type: Grant
    Filed: May 14, 2019
    Date of Patent: July 21, 2020
    Assignee: HONGFUJIN PRECISION ELECTRONICS (TIANJIN) CO., LTD.
    Inventors: Fan-Yin Meng, Han-Yu Li, Ge Liu, Cheng Yang, Xin Chen
  • Patent number: 8080995
    Abstract: A device housing comprises a main body and a three-dimensional antenna. The main body comprises a first molded body and a second molded body formed on the first molding body. The first molded body is made of plastic, the second molded body is made of plastic mixed with laser activatable additives. The second molded body has a predefined activating region formed by laser activation. The three-dimensional antenna is an electroplated coating and is formed on the predefined activating region of the second molding body.
    Type: Grant
    Filed: June 8, 2010
    Date of Patent: December 20, 2011
    Assignees: Shenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
    Inventors: Yong Yan, Zhan Li, Yong-Fa Fan, Zhi-Guo Zhao, Yin Meng
  • Publication number: 20110057858
    Abstract: A device housing comprises a main body and a three-dimensional antenna. The main body comprises a first molded body and a second molded body formed on the first molding body. The first molded body is made of plastic, the second molded body is made of plastic mixed with laser activatable additives. The second molded body has a predefined activating region formed by laser activation. The three-dimensional antenna is an electroplated coating and is formed on the predefined activating region of the second molding body.
    Type: Application
    Filed: June 8, 2010
    Publication date: March 10, 2011
    Applicants: SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD., FIH (HONG KONG) LIMITED
    Inventors: YONG YAN, ZHAN LI, YONG-FA FAN, ZHI-GUO ZHAO, YIN MENG