Patents by Inventor Yin-Tien Yeh

Yin-Tien Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface mount resistor
    Patent number: 8310334
    Abstract: A surface mount resistor includes a resistance body, a first protective layer, a heat-transfer layer, a second protective layer and two electrode layers. The resistance body has a first end portion, a second end portion and a central portion between the first end portion and the second end portion. The first protective layer is disposed on the central portion of the resistance body, and the first end portion and the second end portion are exposed. The heat-transfer layer is plated on at least part of the resistance body. The second protective layer is disposed on at least part of the heat-transfer layer. The electrode layers are respectively arranged on the first end portion and the second end portion, and electrically connected with the heat-transfer layer.
    Type: Grant
    Filed: May 4, 2010
    Date of Patent: November 13, 2012
    Assignee: Cyntec, Co., Ltd.
    Inventors: Ching-Feng Chen, Kun-Hong Shih, Yen-Ting Lin, Yin-Tien Yeh
  • SURFACE MOUNT RESISTOR
    Publication number: 20110057766
    Abstract: A surface mount resistor includes a resistance body, a first protective layer, a heat-transfer layer, a second protective layer and two electrode layers. The resistance body has a first end portion, a second end portion and a central portion between the first end portion and the second end portion. The first protective layer is disposed on the central portion of the resistance body, and the first end portion and the second end portion are exposed. The heat-transfer layer is plated on at least part of the resistance body. The second protective layer is disposed on at least part of the heat-transfer layer. The electrode layers are respectively arranged on the first end portion and the second end portion, and electrically connected with the heat-transfer layer.
    Type: Application
    Filed: May 4, 2010
    Publication date: March 10, 2011
    Inventors: Ching-Feng CHEN, Kun-Hong SHIH, Yen-Ting LIN, Yin-Tien YEH