Patents by Inventor Yinbo XIAN

Yinbo XIAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Display panel and method for manufacturing the same, display device
    Patent number: 11513647
    Abstract: A display panel, a method for manufacturing the same and a display device are provided. The display panel includes a substrate and a packaging layer. An edge of a first side of the packaging layer has a first slope. Touch lines are disposed on a side of the packaging layer away from the substrate, an extending direction of at least a portion of the touch lines is crossed with an extending direction of the edge of the packaging layer with the first slope. The touch lines include first lines, second lines and a first insulating layer. The second lines are electrically coupled to the first lines through vias in the first insulating layer. An orthographic projection of at least a portion of the first lines on the substrate is not overlapped with an orthographic projection of a portion of the packaging layer with the first slope on the substrate.
    Type: Grant
    Filed: April 30, 2021
    Date of Patent: November 29, 2022
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BEIJING BOE TECHNOLOGY DEVELOPMENT CO., LTD.
    Inventors: Guoyi Cui, Tao Gao, Yulin Wang, Rui Hou, Yinbo Xian
  • DISPLAY PANEL AND METHOD FOR MANUFACTURING THE SAME, DISPLAY DEVICE
    Publication number: 20220035485
    Abstract: A display panel, a method for manufacturing the same and a display device are provided. The display panel includes a substrate and a packaging layer. An edge of a first side of the packaging layer has a first slope. Touch lines are disposed on a side of the packaging layer away from the substrate, an extending direction of at least a portion of the touch lines is crossed with an extending direction of the edge of the packaging layer with the first slope. The touch lines include first lines, second lines and a first insulating layer. The second lines are electrically coupled to the first lines through vias in the first insulating layer. An orthographic projection of at least a portion of the first lines on the substrate is not overlapped with an orthographic projection of a portion of the packaging layer with the first slope on the substrate.
    Type: Application
    Filed: April 30, 2021
    Publication date: February 3, 2022
    Inventors: Guoyi CUI, Tao GAO, Yulin WANG, Rui HOU, Yinbo XIAN