Abstract: An electronic apparatus including an image capturing device, a storage device and a processor and an operation method thereof are provided. The image capturing device captures an image for a user, and the storage device records a plurality of modules. The processor is coupled to the image capturing device and the storage device and is configured to: configure the image capturing device to capture a head image of a user; perform a face recognition operation to obtain a face region; detect a plurality of facial landmarks within the face region; estimate a head posture angle of the user according to the facial landmarks; calculate a gaze position where the user gazes on the screen according to the head posture angle, a plurality of rotation reference angle, and a plurality of predetermined calibration positions; and configure the screen to display a corresponding visual effect according to the gaze position.

Abstract: The invention provides an operation method for multi-monitor applicable to an electronic system including a plurality of monitors. The operation method for multi-monitor includes capturing a current image including a user by using a camera, calculating a current gaze direction of the user according to the current image, and determining a target monitor according to the current gaze direction of the user. After the target monitor is determined, the operation method for multi-monitor further includes moving an object to a display area of the target monitor. In addition to the operation method for multi-monitor, an electronic system using the operation method is also provided.

Abstract: An electronic apparatus including an image capturing device, a storage device and a processor and an operation method thereof are provided. The image capturing device captures an image for a user, and the storage device records a plurality of modules. The processor is coupled to the image capturing device and the storage device and is configured to: configure the image capturing device to capture a head image of a user; perform a face recognition operation to obtain a face region; detect a plurality of facial landmarks within the face region; estimate a head posture angle of the user according to the facial landmarks; calculate a gaze position where the user gazes on the screen according to the head posture angle, a plurality of rotation reference angle, and a plurality of predetermined calibration positions; and configure the screen to display a corresponding visual effect according to the gaze position.

Abstract: A test system including an image capturing apparatus, a server apparatus, and a behavior actuation apparatus is provided. The server apparatus is coupled to the image capturing apparatus, drives the image capturing apparatus to take an image of an application of a device under test, analyzes the image to obtain object information in the image, and obtains a corresponding test procedure based on the object information. The behavior actuation apparatus is coupled to the server apparatus, receives the test procedure from the server apparatus, generates a control signal based on the test procedure, and transmits the control signal to the device under test as an inputting signal of the application.

Abstract: A piezoelectric ceramic speaker includes a conductive plate and a round piezoelectric ceramic sheet. The conductive plate has notches and sound delivering holes. The round piezoelectric ceramic plate is stacked on a central region of the conductive plate. The notches are opened on a periphery region of the conductive plate and partly extended toward the central region. The notches are equiangularly arranged on the conductive plate with respect to the center of the conductive plate. Accordingly, auxiliary fixtures can pass through the notches to position the conductive plate. Hence, the conductive plate can be positioned by the fixtures during manufacturing processes. Consequently, the piezoelectric ceramic speaker can be mass produced with good yield rates. Additionally, since the round piezoelectric ceramic plate and the conductive plate are coaxially arranged, a dual-band earphone having the piezoelectric ceramic speaker can provide a better sound resolution performance.

Abstract: The earphone with inverse sound waves includes an earphone housing, a high frequency driver, and a low frequency driver. The earphone housing includes an inner space, a sound output portion, and a reflecting portion. The reflecting portion receives a passive diaphragm. The high frequency driver produces high frequency sound waves and has a sound output direction toward the sound output opening. The low frequency driver is mounted in the inner space of the earphone housing by a mounting brace. The low frequency driver is located between the high frequency driver and the passive diaphragm. A sound transmitting portion is formed between the mounting brace and the earphone housing. The low frequency driver produces low frequency sound waves and has a sound output direction toward the passive diaphragm. The passive diaphragm reflects the low frequency sound waves to the sound output opening via the sound transmitting portion.

Abstract: A piezoelectric ceramic speaker includes a conductive plate and a round piezoelectric ceramic sheet. The conductive plate has notches and sound delivering holes. The round piezoelectric ceramic plate is stacked on a central region of the conductive plate. The notches are opened on a periphery region of the conductive plate and partly extended toward the central region. The notches are equiangularly arranged on the conductive plate with respect to the center of the conductive plate. Accordingly, auxiliary fixtures can pass through the notches to position the conductive plate. Hence, the conductive plate can be positioned by the fixtures during manufacturing processes. Consequently, the piezoelectric ceramic speaker can be mass produced with good yield rates. Additionally, since the round piezoelectric ceramic plate and the conductive plate are coaxially arranged, a dual-band earphone having the piezoelectric ceramic speaker can provide a better sound resolution performance.

Abstract: The earphone with inverse sound waves includes an earphone housing, a high frequency driver, and a low frequency driver. The earphone housing includes an inner space, a sound output portion, and a reflecting portion. The reflecting portion receives a passive diaphragm. The high frequency driver produces high frequency sound waves and has a sound output direction toward the sound output opening. The low frequency driver is mounted in the inner space of the earphone housing by a mounting brace. The low frequency driver is located between the high frequency driver and the passive diaphragm. A sound transmitting portion is formed between the mounting brace and the earphone housing. The low frequency driver produces low frequency sound waves and has a sound output direction toward the passive diaphragm. The passive diaphragm reflects the low frequency sound waves to the sound output opening via the sound transmitting portion.

Abstract: An electric-warming moxibustion device includes a casing having a long pen-like structure; an inner side of the casing being hollowed and a foremost end of the casing being opened; a battery box received in a hollowed portion of the casing; the battery box including at least one slot for receiving a battery; a circuit board received within the casing and in front of the battery box; a massage portion protruding from the front opening of the casing; the massage portion being a hollow tube with a closed front end and an opened rear end; the opening space of the massage portion being communicated to the hollow portion of the casing; an inner hollow space of the massage portion being received with a heating light; and a size of the front end of the massage portion being equal to a size of an acupuncture point of the human body.

Abstract: An image measuring apparatus with an automated control of variable-power nose wheel rotation and 3D displacement includes a base on a work table on a floor, a platform on the base and having first and second moving parts for controlling the platform moving along X-axis and Y-axis respectively, an upright column on the base and a side of the platform and having a third moving part capable of moving along Z-axis, and a measuring lens group disposed on and displaced with the third moving part. The control device includes a control program for controlling the displacement of the first and second moving parts to change the position of the platform, controlling the displacement of the third moving part to change the position of the measuring lens group, and controlling the measuring lens group to switch to an objective microscope to a different magnification to achieve a fully automated measurement.

Abstract: The invention related gas recovering system contains at least one gas supply system, a gas treatment system, and a gas separation system. The gas supply system includes a gas supply unit and a supply source. The gas treatment system includes a gas reactor and a gas reduction device. Also, the gas separation system includes a first exhaust unit, a purifying unit, a second exhaust unit and a heating evaporation unit. The gas recovering system can avoid the unnecessary waste of gas to form hazardous waste. Therefore, gas can make more effective use to reduce cost.

Abstract: The heat treating furnace for the gas reaction includes an outer body, an inner body, a heating mechanism, gas supplying mechanism, and a controller. Using the controller to control the amount of gas supply effectively keeps the first pressure (P1) in the gas circulation chamber outside the inner body greater than the second pressure (P2) in the reaction chamber inside the inner body all the time. In this way, the flow rate of gas inlet, reaction rate, cooling rate can be facilitated, and the uniformity of the thin film and the operational safety can be improved.

Abstract: A substrate surface treatment equipment includes a chamber, a ultraviolet ray lamp, an infrared heating element, a blackbody radiation plate and a vacuum extractor. The equipment can do the substrate surface treatment. The substrate surface treatment equipment can wash or modify the substrate surface. Therefore, after the washing and modifying of the substrate surface, the substrate surface can include a better adhesion when processing a thin film deposition or a colloid suspension coating.

Abstract: The vertical heat treating furnace for the gas reaction includes an outer body, an inner body, a heating mechanism, gas supplying mechanism, and a controller. Using the controller to control the amount of gas supply effectively keeps the first pressure (P1) in the gas circulation chamber outside the inner body greater than the second pressure (P2) in the reaction chamber inside the inner body all the time. In this way, the flow rate of gas inlet, reaction rate, cooling rate can be facilitated, and the uniformity of the thin film and the operational safety can be improved.

Abstract: The heat treating furnace for the gas reaction includes an outer body, an inner body, a heating mechanism, gas supplying mechanism, and a controller. Using the controller to control the amount of gas supply effectively keeps the first pressure (P1) in the gas circulation chamber outside the inner body greater than the second pressure (P2) in the reaction chamber inside the inner body all the time. In this way, the flow rate of gas inlet, reaction rate, cooling rate can be facilitated, and the uniformity of the thin film and the operational safety can be improved.

Abstract: A chip package structure including a carrier, a chip and a molding compound is provided. The chip is disposed on the carrier. The molding compound encapsulates a portion of the carrier and the chip. The top surface of the molding compound has a pin one dot and a pin gate contact. The pin one dot is located at a first corner on the top surface. The pin gate contact is located at a second corner except the first corner. The invention further provides a chip package mold chase and a chip package process using to form the chip package structure.

Abstract: This invention discloses a thin film process equipment for depositing a film on a substrate and a process of forming the film using the same. The thin film process apparatus comprises a reaction chamber, a gas supplying mechanism, and a transferring mechanism. The film processing equipment is characterized in that the gas supplying mechanism is formed by a plurality of gas supplying ports in form of the concentric-circle structure for spraying down different kinds of gas, so that the mixing of different kinds of gas become uniform, thus facilitate the gas reaction and the formation of films.

Abstract: This invention discloses a thin film processing equipment for depositing a film on a substrate and a process for depositing a film on a substrate using the same. The thin film processing equipment comprises a reaction chamber, a gas supplying mechanism, and a transferring mechanism. The thin film processing equipment is characterized in that a gas supplying mechanism is capable of moving up-and-down or left-and-right, and a tray is capable of moving up-and-down, thereby the distance between the gas supplying mechanism and the substrate can be adjusted.

Abstract: A chip package structure including a carrier, a chip and a molding compound is provided. The chip is disposed on the carrier. The molding compound encapsulates a portion of the carrier and the chip. The top surface of the molding compound has a pin one dot and a pin gate contact. The pin one dot is located at a first corner on the top surface. The pin gate contact is located at a second corner except the first corner. The invention further provides a chip package mold chase and a chip package process using to form the chip package structure.

Abstract: In an orientation optimization, at least one signal chain path starting from a signal source and passing through a series of M 2-pin logic cells is located according to a netlist. An output of the Nth 2-pin logic cell in the series of M 2-pin logic cells, where N<M, is set as a gravity point to attract an input of the (N+1)th 2-pin logic cell, thereby optionally flipping the (N+1)th 2-pin logic cell.