Abstract: The present invention relates to a process for preparing a thin film on a substrate in which a first precursor composition (FPC) and a second precursor composition (SPC) are combined, a thin layer of the combined first precursor composition (FPC) and second precursor composition (SPC) is formed on a substrate and the thin layer is cured, an article comprising said thin layer, a composition comprising said first precursor composition (FPC) and said second precursor composition (SPC), a kit-of-parts comprising said first precursor composition (FPC) and said second precursor composition (SPC) in two vessels and the use of said composition or kit-of-parts for preparing a thin film on a substrate and for preparing an optical or electrical coating.

Abstract: Methods, systems, and apparatus, including computer programs encoded on computer storage media, for generating speech from text. One of the systems includes one or more computers and one or more storage devices storing instructions that when executed by one or more computers cause the one or more computers to implement: a sequence-to-sequence recurrent neural network configured to: receive a sequence of characters in a particular natural language, and process the sequence of characters to generate a spectrogram of a verbal utterance of the sequence of characters in the particular natural language; and a subsystem configured to: receive the sequence of characters in the particular natural language, and provide the sequence of characters as input to the sequence-to-sequence recurrent neural network to obtain as output the spectrogram of the verbal utterance of the sequence of characters in the particular natural language.

Abstract: The present disclosure relates to a CMOS image sensor, and an associated method of formation. In some embodiments, the CMOS image sensor comprises a substrate and a transfer gate disposed from a front-side surface of the substrate. The CMOS image sensor further comprises a photo detecting column disposed at one side of the transfer gate within the substrate. The photo detecting column comprises a doped sensing layer comprising one or more recessed portions along a circumference of the doped sensing layer in parallel to the front-side surface of the substrate. By forming the photo detecting column with recessed portions, a junction interface is enlarged compared to a previous p-n junction interface without recessed portions, and thus a full well capacity of the photodiode structure is improved.

Abstract: It is presented a method performed by a network node of a wireless communication network for scheduling a wireless device in uplink. An uplink signal structure is configured to be used by the wireless device and the network node, wherein the uplink signal structure defines transmission subframes divided into symbol periods. The network node applies a short Transmission Time Interval, sTTI, scheduling interval, wherein each sTTI is shorter in time than a subframe and each sTTI comprises at least one symbol period. The method comprises: transmitting a control information message to the wireless device for an sTTI scheduling interval, the control information message comprising uplink scheduling information assigned to the wireless device, the uplink scheduling information indicating a position and a length for at least one of a reference signal and data in the uplink sTTI.

Abstract: A water supply device (10) and a tube connector structure (2) thereof, which are used for an electronic device (100) having a water inlet (101) and a water outlet (102), are disclosed. The tube connector structure (2) includes a connecting plate (21) and two tube connector plugs (22) passing through and fixed to the connecting plate (21). One of the tube connector plugs (22) is connected with the water inlet (101), and the other one of the tube connector plugs (22) is connected with the water outlet (102). Therefore, advantages of rapid connection and disconnection between the water supply device (10) and the tube connector structure (2) and saving time and labor in assembling may be accomplished.

Abstract: Systems and methods for adjusting light emitted from a display of a device are provided. The adjusting includes obtaining, from light of an environment detected by at least one sensor, a measured color of light of the environment, and obtaining, from light of the environment detected by at least one sensor, a measured brightness of light of the environment. In response to the obtaining the measured color and the measured brightness of light, a color of light emitted from the display is adjusted from an initial color to a target color. A brightness of light emitted from the display is adjusted from an initial brightness to a target brightness.

Abstract: In an embodiment, an apparatus includes: an amplifier to compare a reference voltage to a feedback voltage and to output a comparison signal based on the comparison; a first loop circuit coupled to the amplifier to receive the comparison signal and output a first feedback voltage for the amplifier to use as the feedback voltage in a first mode of operation; and a second loop circuit coupled to the amplifier. The second loop circuit may be configured to receive the comparison signal and output a second feedback voltage for the amplifier to use as the feedback voltage in a second mode of operation. The second feedback voltage may be greater than the first feedback voltage, and the second loop circuit may output a regulated voltage based on the comparison signal.

Abstract: A static random access memory device is provided and includes a first gate of a first pass-gate transistor extending to cross a first number of fins in a first threshold voltage region of a substrate and a second gate of a second pass-gate transistor extending to cross a second number of fins in a second threshold voltage region of a substrate. A boundary of the first threshold voltage region between the first and second gates is arranged closer to one, which crosses a smaller number of fins, of the first and second gates.

Abstract: The present invention relates to novel monooxygenases which are useful in the hydroxylation of aromatic hydrocarbons. They are particularly useful for the production of 1-naththol and 7-hydroxycoumarin from naphthol and 7-Ethoxycoumarin, respectively.

Abstract: An auto white balance adjusting method includes determining a local white pixel area and a global white pixel area, selecting a plurality of pixels of an image according to the local white pixel area for generating a local average color value in a first color space, selecting a plurality of pixels of the image according to the global white pixel area for generating a global average color value in the first color space, converting the local average color value into three primary color gains in a second color space, generating three primary color target gains according to the three primary color gains and a color temperature curve in the second color space, and adjusting a white balance of the image frame by frame to meet the three primary color target gains according to the local average color value and the three primary color gains.

Abstract: The present disclosure provides a semiconductor structure, including a first semiconductor device having a first surface and a second surface, the second surface being opposite to the first surface, a semiconductor substrate over the first surface of the first semiconductor device, and a III-V etch stop layer in contact with the second surface of the first semiconductor device. The present disclosure also provides a manufacturing method of a semiconductor structure, including providing a temporary substrate having a first surface, forming a III-V etch stop layer over the first surface, forming a first semiconductor device over the etch stop layer, and removing the temporary substrate by an etching operation and exposing a surface of the III-V etch stop layer.

Abstract: An injection mould and an injection moulding method are provided. The injection mould includes: a base plate, configured to place a package chip to be injection-moulded, the package chip including a substrate and at least one chip fixed on a surface of the substrate by a flip chip process, the substrate having a through hole, a glue injection channel being formed in the base plate and configured to inject a moulding compound, and the glue injection channel being connected with the through hole on the substrate. The above-mentioned injection mould can improve the reliability of the package chip after injection moulding.

Abstract: Embodiments include methods, systems, devices, instructions, and media for limiting hot-cold swap wear leveling in memory devices. In one embodiment, wear metric values are stored and monitored using multiple wear leveling criteria. The multiple wear leveling criteria include a hot-cold swap wear leveling criteria, which may make use of a write count offset value. Based on a first wear metric value of a first management group and a second wear metric value of a second management group, the first management group and the second management group are selected for a wear leveling swap operation. The wear leveling swap operation is performed with a whole management group read operation of the first management group to read a set of data, and a whole management group write operation to write the set of data to the second management group.

Abstract: Disclosed is a vacuum chuck and a method for securing a warped semiconductor substrate during a semiconductor manufacturing process so as to improve its flatness during a semiconductor manufacturing process. For example, a semiconductor manufacturing system includes: a vacuum chuck configured to hold a substrate, wherein the vacuum chuck comprises, a plurality of vacuum grooves located on a top surface of the vacuum chuck, wherein the top surface is configured to face the substrate; and a plurality of flexible seal rings disposed on the vacuum chuck and extending outwardly from the top surface, wherein the plurality of flexible seal rings are configured to directly contact a bottom surface of the substrate and in adjacent to the plurality of vacuum grooves so as to form a vacuum seal between the substrate and the vacuum chuck, and wherein each of the plurality of flexible seal rings has a zigzag cross section.

Abstract: Systems and methods for implementing robotic process automation (RPA) in the cloud are provided. An instruction for managing an RPA robot is received at an orchestrator in a cloud computing environment from a user in a local computing environment. In response to receiving the instruction, the instruction for managing the RPA robot is effectuated.

Abstract: A device is disclosed. The device includes a plurality of pixels disposed over a first surface of a semiconductor layer. The device includes a device layer disposed over the first surface. The device includes metallization layers disposed over the device layer. One of the metallization layers, closer to the first surface than any of other ones of the metallization layers, includes at least one conductive structure. The device includes an oxide layer disposed over a second surface of the semiconductor layer, the second surface being opposite to the first surface, the oxide layer also lining a recess that extends through the semiconductor layer. The device includes a spacer layer disposed between inner sidewalls of the recess and the oxide layer. The device includes a pad structure extending through the oxide layer and the device layer to be in physical contact with the at least one conductive structure.

Abstract: The present disclosure described herein provides, inter alia, an expansion method for expanding mDAPs and a culture medium and a coating matrix combination used in the expansion method, as well as a maturation method for maturing mDAPs and a culture medium used in the maturation method. The present disclosure also provides a substantially homogeneous population of mDAPs and a substantially homogeneous population of mDANs.

Abstract: A method for forming a semiconductor structure and the semiconductor structure are provided. The method for forming the semiconductor structure includes: providing a substrate, wherein a separate bit line structure is formed on the substrate; forming a first sacrificial layer on the side wall of the bit line structure; forming a first dielectric layer filling gap between the bit line structures; patterning the first dielectric layer and the first sacrificial layer to form a through hole, wherein the through hole and the remaining first dielectric layer and first sacrificial layer are alternately arranged; forming a second sacrificial layer on the side wall of the through hole, and filling the through hole to form a contact plug; forming a contact structure on the contact plug; and removing the first sacrificial layer to form a first air gap, and removing the second sacrificial layer to form a second air gap.

Abstract: An electronic device includes a transparent substrate, a number of pixel structures and a first trace structure. The transparent substrate includes a transparent region and a trace region. Each of the pixel structures has a sub-pixel structure of first color and a sub-pixel structure of second color. The sub-pixel structure of first color has a light emitting element of first color. The sub-pixel structure of second color has a light emitting element of second color. The first trace structure includes a first main trace, a first auxiliary trace and a second auxiliary trace. The first main trace is disposed in the trace region and surrounds a portion of the transparent region. The first auxiliary trace and the second auxiliary trace are electrically connected to the first main trace, and are electrically connected to the corresponding sub-pixel structure of first color and the corresponding sub-pixel structure of second color, respectively.