Patents by Inventor Ying-Chang Chia

Ying-Chang Chia has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for forming a conducting structure layer that can reduce metal etching residue
    Publication number: 20020013049
    Abstract: A process for forming a conducting structure layer that can reduce metal etching residues, in which a pre in-situ metal layer is added before a metal layer is deposited. The pre in-situ metal layer enables the crystalloid of the metal layer to grow more 5 evenly, and thus reduces the etching residues of the conducting structure layer. A structure of a conducting structure layer is also provided.
    Type: Application
    Filed: May 4, 2001
    Publication date: January 31, 2002
    Inventors: Teng-Tang Yang, Kun-Yi Lu, Ying-Chang Chia, Jiin-Shiarng Wen