Patents by Inventor Ying-Chen Chiu

Ying-Chen Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9165880
    Abstract: A method for controlling device feature sizes produced by polishing operations such as chemical mechanical polishing (CMP) is provided. The method includes instituting process controls to control the processing operations used in combination to produce features of a metal layer with a desired thickness, based on the thickness of the previous metal layer or layers. A target thickness for first and second metal layers is established. After the first metal layer is produced and the difference between the first metal target thickness and the actual first metal thickness is determined, the target thickness for the second metal features is adjusted. Once the target thickness for the second metal features is adjusted, each of the processing operations used to produce the second metal layer is controlled in combination to produce the second metal features with the adjusted target thickness.
    Type: Grant
    Filed: March 14, 2012
    Date of Patent: October 20, 2015
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Po-Jen Wang, Hsiang-Hui Tsai, Ying-Chen Chiu
  • Publication number: 20130244544
    Abstract: A method for controlling device feature sizes produced by polishing operations such as chemical mechanical polishing (CMP) is provided. The method includes instituting process controls to control the processing operations used in combination to produce features of a metal layer with a desired thickness, based on the thickness of the previous metal layer or layers. A target thickness for first and second metal layers is established. After the first metal layer is produced and the difference between the first metal target thickness and the actual first metal thickness is determined, the target thickness for the second metal features is adjusted. Once the target thickness for the second metal features is adjusted, each of the processing operations used to produce the second metal layer is controlled in combination to produce the second metal features with the adjusted target thickness.
    Type: Application
    Filed: March 14, 2012
    Publication date: September 19, 2013
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Po-Jen Wang, Hsiang-Hui Tsai, Ying-Chen Chiu
  • Publication number: 20100087250
    Abstract: A global positioning system (GPS)-based method for playing an electronic game is disclosed. The method is implemented using a game apparatus that includes a portable electronic device having a GPS receiver. The method includes obtaining location information of the portable electronic device from a satellite signal received through the GPS receiver, and generating a virtual item on the basis of the location information. The virtual item is used by a user to enhance play of the electronic game using the portable electronic device. A GPS-based game apparatus, and a computer program product including a computer-readable storage medium that stores a game program for causing the GPS-based game apparatus to execute steps of the GPS-based method are also disclosed.
    Type: Application
    Filed: January 28, 2009
    Publication date: April 8, 2010
    Inventor: Ying-Chen Chiu