Patents by Inventor Ying-Cheng Lin

Ying-Cheng Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210278771
    Abstract: Integrated circuits and methods for overlap measure are provided. In an embodiment, an integrated circuit includes a plurality of functional cells including at least one gap disposed adjacent to at least one functional cell of the plurality of functional cells and a first overlay test pattern cell disposed within the at least one gap, wherein the first overlay test pattern cell includes a first number of patterns disposed along a first direction at a first pitch. The first pitch is smaller than a smallest wavelength on a full spectrum of humanly visible lights.
    Type: Application
    Filed: May 24, 2021
    Publication date: September 9, 2021
    Inventors: Tseng Chin Lo, Bo-Sen Chang, Yueh-Yi Chen, Chih-Ting Sun, Ying-Jung Chen, Kung-Cheng Lin, Meng Lin Chang
  • Publication number: 20210280511
    Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.
    Type: Application
    Filed: May 10, 2021
    Publication date: September 9, 2021
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
  • Publication number: 20210269765
    Abstract: A temperature-sensitive cell culture composition is provided. The temperature-sensitive cell culture composition includes a hydrogel, a cellulose, a gelatin and a collagen. Based on 1 part by weight of the collagen, a content of the hydrogel is between 0.03 parts by weight and 60 parts by weight, a content of the cellulose is between 150 parts by weight and 360 parts by weight, and a content of the gelatin is between 21 parts by weight and 12 parts by weight. In addition, a method for using the temperature-sensitive cell culture composition, a method for forming the temperature-sensitive cell culture composition, and a use of the temperature-sensitive cell culture composition are also provided.
    Type: Application
    Filed: December 18, 2020
    Publication date: September 2, 2021
    Applicant: Industrial Technology Research Institute
    Inventors: Chia-Jung LU, Jing-En HUANG, Liang-Cheng SU, Hsin-Hsin SHEN, Yuchi WANG, Ying-Hsueh CHAO, Li-Hsin LIN, Hsiu-Hua HUANG
  • Publication number: 20210261853
    Abstract: The disclosure is directed to low molecular weight polyelectrolyte complex nanoparticles that can be used to deliver agents deep into hydrocarbon reservoirs. Methods of making and using said polyelectrolyte complex nanoparticles are also provided.
    Type: Application
    Filed: April 19, 2021
    Publication date: August 26, 2021
    Inventors: Stephen J JOHNSON, Cory BERKLAND, Ahmad MORADI-ARAGHI, Jenn-Tai LIANG, Terry M. CHRISTIAN, Riley B. NEEDHAM, Min CHENG, Ying-Ying LIN, Andrew B. WOODSIDE
  • Patent number: 11031936
    Abstract: A hybrid transmitter includes a current-mode driver, a voltage-mode driver and an auxiliary driver. The current-mode driver is configured to perform a current transmission. The voltage-mode driver is configured to perform a voltage transmission. The auxiliary driver, coupled to the current-mode driver and the voltage-mode driver, is configured to cooperate with the current-mode driver to enhance a driving capability of the current transmission and cooperate with the voltage-mode driver to enhance a driving capability of the voltage transmission.
    Type: Grant
    Filed: April 19, 2020
    Date of Patent: June 8, 2021
    Assignee: NOVATEK Microelectronics Corp.
    Inventors: Ren-Hong Luo, Kun-Jui Shen, Ying-Cheng Lin