Abstract: A package structure includes a thermal dissipation structure including a substrate, a first encapsulant laterally covering the substrate, a die disposed on the substrate and including a sensing region, a second encapsulant laterally covering the die, and a redistribution structure disposed on the die and the second encapsulant. An outer sidewall of the second encapsulant is laterally offset from an outer sidewall of the first encapsulant. The die is electrically coupled to the substrate through the redistribution structure, and the redistribution structure includes a hollow region overlying the sensing region of the die.

Abstract: A method for fabricating a semiconductor device having a substantially undoped channel region includes forming a plurality of fins extending from a substrate. In various embodiments, each of the plurality of fins includes a portion of a substrate, a portion of a first epitaxial layer on the portion of the substrate, and a portion of a second epitaxial layer on the portion of the first epitaxial layer. The portion of the first epitaxial layer of each of the plurality of fins is oxidized, and a liner layer is formed over each of the plurality of fins. Recessed isolation regions are then formed adjacent to the liner layer. The liner layer may then be etched to expose a residual material portion (e.g., Ge residue) adjacent to a bottom surface of the portion of the second epitaxial layer of each of the plurality of fins, and the residual material portion is removed.

Abstract: A multi-gate semiconductor device is formed that provides a first fin element extending from a substrate. A gate structure extends over a channel region of the first fin element. The channel region of the first fin element includes a plurality of channel semiconductor layers each surrounded by a portion of the gate structure. A source/drain region of the first fin element is adjacent the gate structure. The source/drain region includes a first semiconductor layer, a dielectric layer over the first semiconductor layer, and a second semiconductor layer over the dielectric layer.

Abstract: An optical device includes an optical component and an electrical component. The optical component has a sensing surface and a backside surface opposite to the sensing surface. The electrical component is disposed adjacent to the backside surface of the optical component and configured to support the optical component. A portion of the backside surface of the optical component is exposed from the electrical component.

Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.

Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.

Abstract: A multi-domain liquid crystal display (LCD) includes multiple effective pixel electrodes, dummy pixel electrodes and auxiliary electrodes. The effective pixel electrodes are regularly arranged in an array of row and column, and the array of effective pixel electrodes constitute an active display area of the multi-domain LCD. The dummy pixel electrodes are provided outside the active display area and arranged at least on the side of an outermost row or outermost column of the array of effective pixel electrodes. Each auxiliary electrode is positioned next to one side of an effective pixel electrode or a dummy pixel electrode to produce fringe fields and is connected to another effective pixel electrode controlled by a preceding or a succeeding signal line to allow all effective pixel electrodes to have substantially the same coupling capacitance.

Abstract: A multi-domain liquid crystal display includes a plurality of first and second picture elements having polarities opposite to each other under the same frame of an inversion drive scheme. Each first picture element has an extension part positioned next to at least one side of the adjacent second picture element, and each second picture element has an extension part positioned next to at least one side of the adjacent first picture element.

Abstract: A multi-domain liquid crystal display includes a first and a second substrates, and a liquid crystal layer is interposed between the first and the second substrates. A first common electrode is formed on an entire surface of the first substrate. A first dielectric layer is formed on the second substrate and covers first signal lines, and a second dielectric layer is formed on the first dielectric layer and covers second signal lines. A plurality of pixel electrodes are formed on the second dielectric layer, and a plurality of second common electrodes are formed on the second substrate, where a voltage difference existing between the second common electrodes and the pixel electrode produces fringe fields.

Abstract: A multi-domain liquid crystal display (LCD) includes multiple effective pixel electrodes, dummy pixel electrodes and auxiliary electrodes. The effective pixel electrodes are regularly arranged in an array of row and column, and the array of effective pixel electrodes constitute an active display area of the multi-domain LCD. The dummy pixel electrodes are provided outside the active display area and arranged at least on the side of an outermost row or outermost column of the array of effective pixel electrodes. Each auxiliary electrode is positioned next to one side of an effective pixel electrode or a dummy pixel electrode to produce fringe fields and is connected to another effective pixel electrode controlled by a preceding or a succeeding signal line to allow all effective pixel electrodes to have substantially the same coupling capacitance.

Abstract: A multi-domain liquid crystal display includes a plurality of first and second picture elements having polarities opposite to each other under the same frame of an inversion drive scheme. Each first picture element has an extension part positioned next to at least one side of the adjacent second picture element, and each second picture element has an extension part positioned next to at least one side of the adjacent first picture element.

Abstract: A multi-domain liquid crystal display includes a first and a second substrates, and a liquid crystal layer is interposed between the first and the second substrates. A first common electrode is formed on an entire surface of the first substrate. A first dielectric layer is formed on the second substrate and covers first signal lines, and a second dielectric layer is formed on the first dielectric layer and covers second signal lines. A plurality of pixel electrodes are formed on the second dielectric layer, and a plurality of second common electrodes are formed on the second substrate, where a voltage difference existing between the second common electrodes and the pixel electrode produces fringe fields.