Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a spacer adjacent to the MTJ, a liner adjacent to the spacer, and a first metal interconnection on the MTJ. Preferably, the first metal interconnection includes protrusions adjacent to two sides of the MTJ and a bottom surface of the protrusions contact the liner directly.

Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.

Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.

Abstract: A thermoplastic vulcanizate and a method for preparing the same are provided. The thermoplastic vulcanizate includes a thermoplastic, a cross-linked rubber particle, and a compatibilizer, wherein the cross-linked rubber particle is dispersed in the thermoplastic serving as a continuous phase, wherein the cross-linked rubber particle is a product of a composition via a cross-linking reaction. The composition includes an ethylene copolymer and a cross-linking agent, wherein the weight ratio of the thermoplastic to the ethylene copolymer is 3:17 to 1:1.

Abstract: A lamination forming system includes a melt extruder, a nozzle head and a carrier unit. The melt extruder is configured to melt a plastic raw material into a plastic melt and to deliver the same. The nozzle head includes a sprue channel that has an inlet connected to the melt extruder for entry of the melt plastic into the sprue channel, and an outlet disposed distally from the inlet to deliver the plastic melt from the sprue channel. The carrier unit includes a slide table controllable to move relative to the nozzle head. The slide table is configure to carry the plastic melt outputted from the nozzle head.

Abstract: A lamination forming system includes a melt extruder, a nozzle head and a carrier unit. The melt extruder is configured to melt a plastic raw material into a plastic melt and to deliver the same. The nozzle head includes a sprue channel that has an inlet connected to the melt extruder for entry of the melt plastic into the sprue channel, and an outlet disposed distally from the inlet to deliver the plastic melt from the sprue channel. The carrier unit includes a slide table controllable to move relative to the nozzle head. The slide table is configure to carry the plastic melt outputted from the nozzle head.