Patents by Inventor Ying-Cheng WENG

Ying-Cheng WENG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240074328
    Abstract: A semiconductor device includes a magnetic tunneling junction (MTJ) on a substrate, a first spacer on one side of the of the MTJ, a second spacer on another side of the MTJ, a first metal interconnection on the MTJ, and a liner adjacent to the first spacer, the second spacer, and the first metal interconnection. Preferably, each of a top surface of the MTJ and a bottom surface of the first metal interconnection includes a planar surface and two sidewalls of the first metal interconnection are aligned with two sidewalls of the MTJ.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicant: United Microelectronics Corp.
    Inventors: Hui-Lin Wang, Chen-Yi Weng, Yi-Wei Tseng, Chin-Yang Hsieh, Jing-Yin Jhang, Yi-Hui Lee, Ying-Cheng Liu, Yi-An Shih, I-Ming Tseng, Yu-Ping Wang
  • Publication number: 20230272214
    Abstract: A thermoplastic vulcanizate and a method for preparing the same are provided. The thermoplastic vulcanizate includes a thermoplastic, a cross-linked rubber particle, and a compatibilizer, wherein the cross-linked rubber particle is dispersed in the thermoplastic serving as a continuous phase, wherein the cross-linked rubber particle is a product of a composition via a cross-linking reaction. The composition includes an ethylene copolymer and a cross-linking agent, wherein the weight ratio of the thermoplastic to the ethylene copolymer is 3:17 to 1:1.
    Type: Application
    Filed: February 23, 2023
    Publication date: August 31, 2023
    Applicants: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, FORMOSA PLASTICS CORPORATION
    Inventors: Jin-An WU, Fu-Ming CHIEN, Yun-Chen CHANG, Jen-Long WU, Wen-Hao KANG, Kuei-Pin LIN, Ying-Cheng WENG, Shih-Hsun LIN
  • Patent number: 11331840
    Abstract: A lamination forming system includes a melt extruder, a nozzle head and a carrier unit. The melt extruder is configured to melt a plastic raw material into a plastic melt and to deliver the same. The nozzle head includes a sprue channel that has an inlet connected to the melt extruder for entry of the melt plastic into the sprue channel, and an outlet disposed distally from the inlet to deliver the plastic melt from the sprue channel. The carrier unit includes a slide table controllable to move relative to the nozzle head. The slide table is configure to carry the plastic melt outputted from the nozzle head.
    Type: Grant
    Filed: April 26, 2019
    Date of Patent: May 17, 2022
    Assignees: FORMOSA PLASTICS CORPORATION, NATIONAL KAOHSIUNG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: Chung-Ching Huang, Te-Wen Lee, Jen-Long Wu, Wen-Hao Kang, Ying-Cheng Weng
  • Publication number: 20200338798
    Abstract: A lamination forming system includes a melt extruder, a nozzle head and a carrier unit. The melt extruder is configured to melt a plastic raw material into a plastic melt and to deliver the same. The nozzle head includes a sprue channel that has an inlet connected to the melt extruder for entry of the melt plastic into the sprue channel, and an outlet disposed distally from the inlet to deliver the plastic melt from the sprue channel. The carrier unit includes a slide table controllable to move relative to the nozzle head. The slide table is configure to carry the plastic melt outputted from the nozzle head.
    Type: Application
    Filed: April 26, 2019
    Publication date: October 29, 2020
    Inventors: Chung-Ching HUANG, Te-Wen LEE, Jen-Long WU, Wen-Hao KANG, Ying-Cheng WENG