Abstract: An ammonium fluoride gas may be used to form a protection layer for one or more interlayer dielectric layers, one or more insulating caps, and/or one or more source/drain regions of a semiconductor device during a pre-clean etch process. The protection layer can be formed through an oversupply of nitrogen trifluoride during the pre-clean etch process. The oversupply of nitrogen trifluoride causes an increased formation of ammonium fluoride, which coats the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) with a thick protection layer. The protection layer protects the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) during the pre-clean process from being etched by fluorine ions formed during the pre-clean process.

Abstract: A breathable and waterproof non-woven fabric is manufactured by a manufacturing method including the following steps. Performing a kneading process on 87 to 91 parts by weight of a polyester, 5 to 7 parts by weight of a water repellent, and 3 to 6 parts by weight of a flow promoter to form a mixture, in which the polyester has a melt index between 350 g/10 min and 1310 g/10 min at a temperature of 270° C., and the mixture has a melt index between 530 g/10 min and 1540 g/10 min at a temperature of 270° C. Performing a melt-blowing process on the mixture, such that the flow promoter is volatilized and a melt-blown fiber is formed, in which the melt-blown fiber has a fiber body and the water repellent disposed on the fiber body with a particle size (D90) between 350 nm and 450 nm.

Abstract: A novel additive for recycling thermoset materials, its related recyclable thermoset composition and its application are disclosed. Specifically, the composition of the additive comprises at least one copolymer that has at least one carbamate group, at least one carbonate group and/or at least one urea group, and a number-average molecular weight of the copolymer is between 100 and 50,000 Da.

Abstract: A method of manufacturing an electronic device, including the following steps, is provided. A first dielectric layer and a second dielectric layer are provided. The first dielectric layer has a first surface and a second surface opposite to each other, and the second dielectric layer has a third surface and a fourth surface opposite to each other. A first unit is formed on the first surface or the second surface of the first dielectric layer. The first dielectric layer and the second dielectric layer are combined to form a substrate structure. The second surface of the first dielectric layer faces the third surface of the second dielectric layer. A dielectric loss of the first unit is less than a dielectric loss of the first dielectric layer. The method of manufacturing the electronic device of the embodiment of the disclosure can reduce the dielectric loss by using the unit.

Abstract: An ammonium fluoride gas may be used to form a protection layer for one or more interlayer dielectric layers, one or more insulating caps, and/or one or more source/drain regions of a semiconductor device during a pre-clean etch process. The protection layer can be formed through an oversupply of nitrogen trifluoride during the pre-clean etch process. The oversupply of nitrogen trifluoride causes an increased formation of ammonium fluoride, which coats the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) with a thick protection layer. The protection layer protects the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) during the pre-clean process from being etched by fluorine ions formed during the pre-clean process.

Abstract: A temperature control apparatus is disposed in a first environment and a second environment. The temperature control apparatus includes a heat exchanging unit and a working fluid. The heat exchanging unit is independently disposed and divided into a first heat exchanging portion and a second heat exchanging portion. The heat exchanging unit includes a pipe and a plurality of heat-dissipating fins for cooling the pipe. Two ends of the pipe are connected to from a closed pipe. The pipe runs in the first and the second heat exchanging portions alternately. The heat-dissipating fins are not continuously disposed in the first heat exchanging portion and the second heat exchanging portion. The first heat exchanging portion is correspondingly disposed at the first environment. The second heat exchanging portion is correspondingly disposed at the second environment. The working fluid flows in the pipe.

Abstract: A temperature control apparatus is disposed in a first environment and a second environment. The temperature control apparatus includes a heat exchanging unit, a compressor, a circulation loop, and a working fluid. The heat exchanging unit is divided into a first heat exchanging portion and a second heat exchanging portion. The heat exchanging unit includes a pipe and multiple heat-dissipating fins for cooling the pipe. The pipe is disposed in the heat exchanging unit. The pipe runs in the first heat exchanging portion and then runs in the second heat exchanging portion. The first heat exchanging portion is correspondingly disposed at the first environment. The second heat exchanging portion is correspondingly disposed at the second environment. The circulation loop is communicated to the heat exchanging unit and the compressor. The compressor compresses the working fluid to flow in the circulation loop.

Abstract: A heat exchange device includes a housing, a heat exchange module, and a piezoelectric module. Isolated inner and outer circulation chambers are formed in the housing. The heat exchange module in the housing includes a stack of separated plates parallel to each other. An inner channel communicated with the inner circulation chamber and an outer channel communicated with the outer circulation chamber are defined respectively by both sides of one of the plates and the other adjacent plates. The piezoelectric module in the housing includes a piezoelectric chip, and first and second heat exchange sides thermally coupled to the piezoelectric chip. The first heat exchange side is located in the inner circulation chamber and the second heat exchange side is located in the outer circulation chamber, so that heat can be transferred between the inner and outer circulation chambers via the piezoelectric chip.

Abstract: A shelf thermostat device and a thermostat system. The shelf thermostat device includes a fixing bracket and a heat exchanger. An electronic device is detachably disposed at the fixing bracket. The heat exchanger is detachably disposed at the fixing bracket and layer arranged in a row with the electronic device. The heat exchanger has a heat exchanging core. The heat exchanging core has a first side and a second side opposite to the first side, and a plurality of internal channels and a plurality of external channels. The internal channels and the external channels are disposed staggered and isolated with each other. An internal air flows between the internal channels and the electronic device. An external air flows to the second side of the heat exchanging core from the first side of the heat exchanging core through the external channels.

Abstract: A shelf thermostat device and a thermostat system. The shelf thermostat device includes a fixing bracket and a heat exchanger. An electronic device is detachably disposed at the fixing bracket. The heat exchanger is detachably disposed at the fixing bracket and layer arranged in a row with the electronic device. The heat exchanger has a heat exchanging core. The heat exchanging core has a first side and a second side opposite to the first side, and a plurality of internal channels and a plurality of external channels. The internal channels and the external channels are disposed staggered and isolated with each other. An internal air flows between the internal channels and the electronic device. An external air flows to the second side of the heat exchanging core from the first side of the heat exchanging core through the external channels.

Abstract: A low-dropout linear regulator is provided. The low-dropout linear regulator includes: a voltage divider, a first error amplifier, an output transistor, a differential circuit, and a control circuit. The voltage divider generates a feedback voltage according to an output voltage of the low-dropout linear regulator. The first error amplifier compares the feedback voltage with a reference voltage, and outputs a first voltage at an output terminal of the first error amplifier according to the comparison result. The output transistor includes a first terminal receiving the first voltage, and a second terminal outputting the output voltage. The differential circuit receives the feedback voltage and the reference voltage, and generates a second voltage on its output terminal. The control circuit adjusts a voltage on the first terminal of the output transistor according to variation of the second voltage.

Abstract: A heat exchange device includes a housing, a heat exchange module, and a piezoelectric module. Isolated inner and outer circulation chambers are formed in the housing. The heat exchange module in the housing includes a stack of separated plates parallel to each other. An inner channel communicated with the inner circulation chamber and an outer channel communicated with the outer circulation chamber are defined respectively by both sides of one of the plates and the other adjacent plates. The piezoelectric module in the housing includes a piezoelectric chip, and first and second heat exchange sides thermally coupled to the piezoelectric chip. The first heat exchange side is located in the inner circulation chamber and the second heat exchange side is located in the outer circulation chamber, so that heat can be transferred between the inner and outer circulation chambers via the piezoelectric chip.

Abstract: A control circuit of a power converter is provided. The control circuit comprises a PWM circuit, a sample circuit, and emulation circuit. The PWM circuit generates a switching signal for switching an inductor and generating a switching current of the inductor in response to a current feedback signal. The sample circuit is coupled to sample a switching current signal into a capacitor during an on time of the switching signal. The emulation circuit generates a discharge current couple to discharge the capacitor during an off time of the switching signal for generating the current feedback signal. The switching current signal is correlated to the switching current of the inductor, and the discharge current is generated in response to an input voltage of the inductor, an output voltage of the power converter, and the on time of the switching signal.

Abstract: An apparatus for fabricating patterns using a laser diode is presented. The apparatus includes at least one laser diode, at least one lens and a mask having at least one pin hole, wherein light emitted from the laser diode is emitted through the lens and the pin hole to be focused on a first material layer.

Abstract: A water purification device includes a container, at least a filtration unit, and a trailing cable connected to the container or the filtration unit. The container has therein a chamber and at least a first opening in communication with the chamber. The filtration unit is disposed in the first opening to admit sewer water and thus remove most impurities therefrom. Accordingly, the water purification device sinks spontaneously into the sewer water to be filtered so as, to filter the external sewer water by means of water pressure and thus produce drinking water.

Abstract: The present invention provides a correction circuit for a power converter. The correction circuit includes a sampling circuit, a demagnetizing-time circuit, a duty circuit, and a compensation circuit. The sampling circuit generates an average-current signal in response to a switching current of the power converter. The demagnetizing-time circuit generates a discharging-time signal in response to a switching signal and an input-voltage signal. The duty circuit generates a duty signal in response to the discharging-time signal, an on-time of the switching signal, and a switching period of the switching signal. The compensation circuit is coupled to receive the average-current signal and the duty signal for generating a corrected signal. The switching signal is utilized to switch a magnetic device for regulating an output voltage of the power converter. The corrected signal is coupled to generate the switching signal.

Abstract: An air-cooled heat exchanger includes a casing, a first heat-exchanging core, a second heat-exchanging core, a first internal driving device, a second internal driving device and an external driving device. The first internal driving device is used for driving a first internally-circulated airflow to flow along a first internal circulation path. The second internal driving device is used for driving a second internally-circulated airflow to flow along a second internal circulation path. The external driving device is used for driving a first externally-circulated airflow to flow along a first external circulation path and driving a second externally-circulated airflow to flow along a second external circulation path. The first heat-exchanging core is configured to perform heat exchange between the first internally-circulated airflow and the first externally-circulated airflow.

Abstract: A control circuit of a power factor correction (PFC) converter is provided. The control circuit includes a pulse width modulation (PWM) circuit, an amplifier, a detection circuit., and a capacitor. The PWM circuit generates a switching signal in response to a loop signal. The amplifier is coupled to generate the loop signal in response to a switching current. The detection circuit generates a mode signal coupled to change output impedance of the amplifier. The capacitor is coupled to the amplifier for loop frequency compensation. The switching signal is coupled to switch an inductor of the PFC power converter and generate the switching current.

Abstract: A heat-dissipation structure for a motor. The heat-dissipation structure comprises a shaft, a seat and a rotator. The rotator coupled to the seat by the shaft comprises a housing and a cover. The housing comprises an inner side connected to the shaft and a bottom comprising at least one through hole. The cover is connected to an exterior of the bottom of the housing and a distance is formed between the cover and the housing, so that the cover prevents objects from entering the through hole.

Abstract: Apparatuses for fabricating micro patterns using a laser diode array and methods for fabricating micro patterns are presented. The apparatus includes a laser diode array having at least one laser diode wherein light emitted from each laser diode is focused by a convex lens onto a second material layer attached to a first material layer. At least one driving shaft drives motion of the first and the second material layers. An adjustment means is used for adjusting the gap and pitch between adjacent laser diodes.