Patents by Inventor Ying-Chi TSAI

Ying-Chi TSAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240136226
    Abstract: An ammonium fluoride gas may be used to form a protection layer for one or more interlayer dielectric layers, one or more insulating caps, and/or one or more source/drain regions of a semiconductor device during a pre-clean etch process. The protection layer can be formed through an oversupply of nitrogen trifluoride during the pre-clean etch process. The oversupply of nitrogen trifluoride causes an increased formation of ammonium fluoride, which coats the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) with a thick protection layer. The protection layer protects the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) during the pre-clean process from being etched by fluorine ions formed during the pre-clean process.
    Type: Application
    Filed: January 2, 2024
    Publication date: April 25, 2024
    Inventors: Li-Wei CHU, Ying-Chi SU, Yu-Kai CHEN, Wei-Yip LOH, Hung-Hsu CHEN, Chih-Wei CHANG, Ming-Hsing TSAI
  • Patent number: 11915976
    Abstract: An ammonium fluoride gas may be used to form a protection layer for one or more interlayer dielectric layers, one or more insulating caps, and/or one or more source/drain regions of a semiconductor device during a pre-clean etch process. The protection layer can be formed through an oversupply of nitrogen trifluoride during the pre-clean etch process. The oversupply of nitrogen trifluoride causes an increased formation of ammonium fluoride, which coats the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) with a thick protection layer. The protection layer protects the interlayer dielectric layer(s), the insulating cap(s), and/or the source/drain region(s) during the pre-clean process from being etched by fluorine ions formed during the pre-clean process.
    Type: Grant
    Filed: June 27, 2022
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Li-Wei Chu, Ying-Chi Su, Yu-Kai Chen, Wei-Yip Loh, Hung-Hsu Chen, Chih-Wei Chang, Ming-Hsing Tsai
  • Patent number: 9845973
    Abstract: A cascade refrigeration system includes first and second cooling devices. The first cooling device includes a first compressor, a condenser, an expansion device, an evaporator having first and second passages independent from and not communicating with each other, and a first conduit interconnecting the first compressor, the condenser, the expansion device and the first passage. The second cooling device includes a second compressor, a heat exchanger, and a second conduit interconnecting the second compressor, the second passage and the heat exchanger. A circulation switching device includes a switching mechanism connected to the first conduit downstream of the condenser and upstream of the expansion device.
    Type: Grant
    Filed: December 15, 2015
    Date of Patent: December 19, 2017
    Assignee: WINWAY TECH. CO., LTD.
    Inventors: Ying-Chi Tsai, Yu-Pin Hsu, Chia-PIn Sun
  • Patent number: 9845979
    Abstract: An evaporator includes a casing and a plurality of circulation units disposed on the casing. Each of the circulation units includes a flow path formed in the casing, an inlet formed in the casing for entry of one of refrigerants into the casing and fluidly communicating with the flow path, and an outlet formed in the casing spaced apart from the inlet for exit of the one of the refrigerants out the casing and fluidly communicating with the flow path. The circulation units are independent from each other and do not fluidly communicate with each other.
    Type: Grant
    Filed: December 15, 2015
    Date of Patent: December 19, 2017
    Assignee: WINWAY TECH. CO., LTD.
    Inventors: Ying-Chi Tsai, Yu-Pin Hsu, Chia-Pin Sun
  • Publication number: 20170167758
    Abstract: A cascade refrigeration system includes first and second cooling devices. The first cooling device includes a first compressor, a condenser, an expansion device, an evaporator having first and second passages independent from and not communicating with each other, and a first conduit interconnecting the first compressor, the condenser, the expansion device and the first passage. The second cooling device includes a second compressor, a heat exchanger, and a second conduit interconnecting the second compressor, the second passage and the heat exchanger. A circulation switching device includes a switching mechanism connected to the first conduit downstream of the condenser and upstream of the expansion device.
    Type: Application
    Filed: December 15, 2015
    Publication date: June 15, 2017
    Inventors: Ying-Chi TSAI, Yu-Pin HSU, Chia-Pin SUN
  • Publication number: 20170167765
    Abstract: An evaporator includes a casing and a plurality of circulation units disposed on the casing. Each of the circulation units includes a flow path formed in the casing, an inlet formed in the casing for entry of one of refrigerants into the casing and fluidly communicating with the flow path, and an outlet formed in the casing spaced apart from the inlet for exit of the one of the refrigerants out the casing and fluidly communicating with the flow path. The circulation units are independent from each other and do not fluidly communicate with each other.
    Type: Application
    Filed: December 15, 2015
    Publication date: June 15, 2017
    Inventors: Ying-Chi TSAI, Yu-Pin HSU, Chia-Pin SUN