Abstract: A chip electrical property detection device and a method of manufacturing the same are provided. The chip electrical property detection device includes a circuit control substrate, an electrical detection module and a flexible conductive structure. The circuit control module includes multiple electrical conduction structures. The electrical detection module includes multiple movable carrying substrates, multiple electrical detection structures and multiple electrical connection structures. The movable carrying substrates are separately arranged on the flexible conductive structure. The electrical detection structures are respectively disposed on the movable carrying substrates and electrically connected to the electrical connection structures. The electrical connection structures penetrate the movable carrying substrates and electrically connect to the electrical conduction structures through the flexible conductive structure, respectively.

Abstract: A hammer includes a striking head (10), a handle (20) and a combining unit (30). The striking head (10) has a passage (15). The handle (20) has an installing part (21) having a mounting member (22), first ribs (23) and second ribs (24) outwardly extended from the mounting member (22). A flowing passage (25) is formed between the first ribs (23) and the second ribs (24), and a distance (D) is formed between the first ribs (23) and an internal wall of the passage (15). A resin is filled between the installing part (21) and the passage (15) to seal the flowing passages (25) and the distance (D), and the combining unit (30) is formed through each of the first ribs (23) and each of the second ribs (24) being interlocked after the resin is solidified.

Abstract: A pixel circuit includes a driving transistor, a storage capacitor, a first transistor, a second transistor, a third transistor and a fourth transistor. A first end of the driving transistor is electrically coupled to a system high voltage terminal. The driving transistor is configured to control a driving current supplied to a light emitting element. A first end of the storage capacitor is electrically coupled to a control end of the driving transistor. A first end of the first transistor is electrically coupled to a second end of the storage capacitor, and a second end of the first transistor is configured to receive a data signal. When the first transistor is turned on according to the first control signal, the storage capacitor resets a voltage at the control end of the driving transistor, by a capacitive coupling effect, according to a change in voltage of the data signal.

Abstract: A pixel circuit includes a driving transistor, a storage capacitor, a first transistor, a second transistor, a third transistor and a fourth transistor. A first end of the driving transistor is electrically coupled to a system high voltage terminal. The driving transistor is configured to control a driving current supplied to a light emitting element. A first end of the storage capacitor is electrically coupled to a control end of the driving transistor. A first end of the first transistor is electrically coupled to a second end of the storage capacitor, and a second end of the first transistor is configured to receive a data signal. When the first transistor is turned on according to the first control signal, the storage capacitor resets a voltage at the control end of the driving transistor, by a capacitive coupling effect, according to a change in voltage of the data signal.

Abstract: Disclosed are a display panel and a pixel circuit thereof. The pixel circuit includes a driving transistor, a data write-in circuit, a compensation circuit, a voltage control circuit, a light-emitting switch, and a light-emitting element. The driving transistor receives a power supply voltage. The data write-in circuit receives a first scanning signal, an emission signal, and a write-in data signal, stores the write-in data signal, and provides the write-in data signal to a control end of the driving transistor. The compensation circuit has a first switch and a second switch coupled to a relay end and controlled by a second scanning signal. The voltage control circuit adjusts a voltage difference between the control end of the driving transistor and the relay end. The light-emitting switch is coupled between a second end of the driving transistor and the light-emitting element, and is controlled by the emission signal.

Abstract: A hidden display device and a method of manufacturing the same are provided. The hidden display device includes an appearance decorative structure, a light-emitting module and a signal control module. The appearance decorative structure includes an appearance decorative shell. The light-emitting module is covered by the appearance decorative structure. The appearance decorative shell has a plurality of micron-level through openings each having a maximum diameter between 5 ?m and 200 ?m. The minimum distance between any two adjacent micron-level through openings is between 50 ?m and 100 ?m. The light-emitting module includes a plurality of light-emitting units respectively correspond to the micron-level through openings.

Abstract: A patch-type bone conduction earphone for amplifying audio power includes a casing structure, a circuit substrate, a control module, an audio signal receiving module, a wireless signal transmission module, a bone conduction module and a power supply module. The audio signal receiving module is configured to receive an environmental audio signal. The wireless signal transmission module is configured for wirelessly receiving a predetermined audio signal. The bone conduction module is configured to convert the predetermined audio signal into a predetermined vibration signal. The circuit substrate, the control module, the audio signal receiving module, the wireless signal transmission module and the bone conduction module can cooperate with each other to form an electronic assembly structure that is able to be recycled, so that the electronic assembly structure can be configured to be used in a new patch-type bone conduction earphone through a recycling process or related processing steps.

Abstract: A critical path analysis method includes: obtaining multiple critical paths of a digital circuit; sorting the critical paths according to stage counts of the critical paths and dividing the critical paths into batches; using a simulation program with integrated circuit emphasis (SPICE) tool to analyze the batches sequentially to generate a static timing analysis (STA) report with respect to the critical paths.

Abstract: A chip transferring and bonding device includes a signal control module, a substrate carrying module, a chip transferring module and a chip bonding module. The substrate carrying module is configured to be electrically connected to the signal control module. The chip transferring module is configured to be electrically connected to the signal control module. The chip bonding module is configured to be electrically connected to the signal control module. The chip bonding module includes at least one micro heater, and the at least one micro heater of the chip bonding module is a light source generator configured for generating a light source or a heat source generator configured for generating a heat source. When the chip bonding module is optionally configured to be used, the micro heater of the chip bonding module can be allowed to heat a corresponding one of the chips through the signal control module.

Abstract: A temporary carrying substrate, a chip-transferring device and a chip transferring method are provided. The chip-transferring device includes a signal control module, a chip-carrying module and a chip-transferring module. The chip-transferring module is allowed to be configured to carry a temporary carrying substrate through the signal control module, and the temporary carrying substrate includes a plurality of micro heaters disposed thereinside or thereoutside. When the chip-transferring module needs to be configured to carry the temporary carrying substrate, a plurality of chips are arranged on a plurality of chip placement areas of the temporary carrying substrate and arranged in a predetermined arrangement shape. When the micro heater needs to be used, the micro heater is allowed to be configured to heat the temporary carrying substrate through the signal control module, thereby causing the temporary carrying substrate to generate thermal expansion to facilitate moving a corresponding one of the chips.

Abstract: A method for forming a film pattern includes: providing a substrate having a surface on which the film pattern is to be formed; providing a pattern material containing a hot-melt glue; providing a mask, wherein the mask includes a light-transmitting portion and a light-non-transmitting portion, wherein the pattern material is between the substrate and the mask; irradiating the mask by using a light source capable of generating heat, wherein the light generated by the light source passes through the light-transmitting portion, so that the pattern material under the light-transmitting portion is attached to the surface of the substrate by the melting of the hot-melt glue; and removing the mask and the pattern material under the light-non-transmitting portion.

Abstract: A digital projector for generating projected images through timing control, which includes a light providing module, an image generating module, an optical component module and a projection lens module. The light providing module includes a plurality of light-emitting chip units that are configured to be turned on asynchronously within a predetermined time through timing control, thereby enabling the light providing module to generate a projection beam. The image generating module is configured to allow the projection beam to pass through, thereby converting the projection beam into an image beam. The projection lens module is configured to project the image beam to a predetermined position. The digital projector can generate projected images in a sequential control manner through the cooperation of the light providing module, the image generating module, the optical component module and the projection lens module.

Abstract: A recyclable patch-type bone conduction earphone includes a casing structure, a circuit substrate, a control module, an audio signal receiving module, a wireless signal transmission module, a bone conduction module and a power supply module. The audio signal receiving module is configured to receive an environmental audio signal. The wireless signal transmission module is configured for wirelessly receiving a predetermined audio signal. The bone conduction module is configured to convert the predetermined audio signal into a predetermined vibration signal. The circuit substrate, the control module, the audio signal receiving module, the wireless signal transmission module and the bone conduction module can cooperate with each other to form an electronic assembly structure that is able to be recycled, so that the electronic assembly structure can be configured to be used in a new recyclable patch-type bone conduction earphone through a recycling process or related processing steps.

Abstract: A recycling method for recyclable bone conduction earphones includes attaching a plurality of recyclable patch-type bone conduction earphones that run out of power to a recycling tape; packaging the recyclable patch-type bone conduction earphones that are attached to the recycling tape in a recycling bag; transporting the recycling bag containing the recyclable patch-type bone conduction earphones to a predetermined processing area; in the predetermined processing area, disassembling each recyclable patch-type bone conduction earphone to obtain a casing structure, an electronic assembly structure and a power supply module of each recyclable patch-type bone conduction earphone; and processing the casing structure, the electronic assembly structure and the power supply module of each recyclable patch-type bone conduction earphone, so that at least one of the casing structure, the electronic assembly structure and the power supply module is configured to be used in a new recyclable patch-type bone conduction ear

Abstract: A system for testing poultry response is disclosed. The system comprises a camera, a processor, a beam generator, and a beam direction control unit. The camera is configured to receive a plurality of first images of a poultry house, and the plurality of first images include at least one of the poultry area and the background area. The processor is configured to calculate a first activity according to the plurality of first images, and to determine whether the first activity is lower than a target activity threshold. The beam generator is configured to emit a beam. The beam direction control unit is configured to move the beam. If the first activity is lower than the target activity threshold, the beam is emitted through the beam generator, and the beam is moved through the beam direction control unit, so as to disturb the plurality of poultry in the poultry house.

Abstract: Aspects of the disclosure provide a frame processor for processing frames with aliasing artifacts. For example, the frame processor can include a super-resolution (SR) and anti-aliasing (AA) engine and an attention reference frame generator coupled to the SR and AA engine. The SR and AA engine can be configured to enhance resolution and remove aliasing artifacts of a frame to generate a first high-resolution frame with aliasing artifacts and a second high-resolution frame with aliasing artifacts removed. The attention reference frame generator can be configured to generate an attention reference frame based on the first high-resolution frame and the second high-resolution frame.

Abstract: A hanging structure applicable to an unmanned aerial vehicle includes a hook-shaped body and at least one hook claw. The hook-shaped body has a bottom, at least one pivoting end, and an abutting portion. A hook opening is provided between the at least one pivoting end and the abutting portion and is opposite to the bottom. In addition, the at least one hook claw has a pivoting portion, and a first claw portion and a second claw portion that extend from the pivoting portion, respectively. The pivoting portion is pivoted to the at least one pivoting end. The second claw portion is heavier than the first claw portion. When the hanging structure is in a hanging state, a first end of the first claw portion abuts against the abutting portion, and the hook opening is closed. An unmanned aerial vehicle hanging system including the above hanging structure is further provided.

Abstract: A graphics system includes an effect engine and a graphics pipeline. The graphics pipeline performs pipeline operations on graphical objects in a frame. The graphics pipeline includes at least a fragment shader stage. An application programming interface (API) provides an instruction that specifies a subset of the graphical objects in the frame for the effect engine to execute. When detecting the instruction, the graphics pipeline invokes the effect engine to perform a predefined set of graphics operations on the subset of the graphical objects in the frame. The predefined set of graphics operations has a higher computational complexity than the pipeline operations.

Abstract: A hammer includes a striking head (10), a handle (20) and a combining unit (30). The striking head (10) has a passage (15). The handle (20) has an installing part (21) having a mounting member (22), first ribs (23) and second ribs (24) outwardly extended from the mounting member (22). A flowing passage (25) is formed between the first ribs (23) and the second ribs (24), and a distance (D) is formed between the first ribs (23) and an internal wall of the passage (15). A resin is filled between the installing part (21) and the passage (15) to seal the flowing passages (25) and the distance (D), and the combining unit (30) is formed through each of the first ribs (23) and each of the second ribs (24) being interlocked after the resin is solidified.