Patents by Inventor Ying-Chieh Ke

Ying-Chieh Ke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multiple Chip Module Trenched Lid and Low Coefficient of Thermal Expansion Stiffener Ring
    Publication number: 20230317708
    Abstract: Multiple chip module (MCM) structures are described. In an embodiment, a module includes a first and second components on the top side of a module substrate, a stiffener structure mounted on the top side of the module substrate, and a lid mounted on the stiffener structure and covering the first component and the second component. The stiffener is joined to the lid within a trench formed in a roof of the lid.
    Type: Application
    Filed: March 31, 2023
    Publication date: October 5, 2023
    Inventors: Wei Chen, Jie-Hua Zhao, Jun Zhai, Po-Hao Chang, Hsien-Che Lin, Ying-Chieh Ke, Kunzhong Hu
  • Multiple chip module trenched lid and low coefficient of thermal expansion stiffener ring
    Patent number: 11646302
    Abstract: Multiple chip module (MCM) structures are described. In an embodiment, a module includes a first and second components on the top side of a module substrate, a stiffener structure mounted on the top side of the module substrate, and a lid mounted on the stiffener structure and covering the first component and the second component. The stiffener is joined to the lid within a trench formed in a roof of the lid.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: May 9, 2023
    Assignee: Apple Inc.
    Inventors: Wei Chen, Jie-Hua Zhao, Jun Zhai, Po-Hao Chang, Hsien-Che Lin, Ying-Chieh Ke, Kunzhong Hu
  • Multiple Chip Module Trenched Lid and Low Coefficient of Thermal Expansion Stiffener Ring
    Publication number: 20210305227
    Abstract: Multiple chip module (MCM) structures are described. In an embodiment, a module includes a first and second components on the top side of a module substrate, a stiffener structure mounted on the top side of the module substrate, and a lid mounted on the stiffener structure and covering the first component and the second component. The stiffener is joined to the lid within a trench formed in a roof of the lid.
    Type: Application
    Filed: September 4, 2020
    Publication date: September 30, 2021
    Inventors: Wei Chen, Jie-Hua Zhao, Jun Zhai, Po-Hao Chang, Hsien-Che Lin, Ying-Chieh Ke, Kunzhong Hu