Abstract: A bag apparatus for delivering fluid comprises an inflatable bag structure, a pipe and an adjuster. The inflatable bag structure includes a first channel and a second channel. The pipe penetrates through the inflatable bag structure and includes a first conduit. The first conduit communicates with an outside of the inflatable bag structure. An inflated space is formed between the pipe and the inflatable bag structure and communicates with the first channel. The first conduit communicates with the second channel. The adjuster is movably inserted into an end of the inflatable bag structure. A through hole is disposed on the radial side of the adjuster. When the adjuster moves to an inflating position, the through hole communicates with the first channel and a fluid supply; when the adjuster moves to a delivering position, the through hole communicates with the second channel and the fluid supply.

Abstract: A semiconductor device with the metal fuse is provided. The metal fuse connects an electronic component (e.g., a transistor) and a existing dummy feature which is grounded. The protection of the metal fuse can be designed to start at the beginning of the metallization formation processes. The grounded dummy feature provides a path for the plasma charging to the ground during the entire back end of the line process. The metal fuse is a process level protection as opposed to the diode, which is a circuit level protection. As a process level protection, the metal fuse protects subsequently-formed circuitry. In addition, no additional active area is required for the metal fuse in the chip other than internal dummy patterns that are already implemented.

Abstract: Data center network provisioning method includes partitioning a plurality of virtual machines in the data center network into a plurality of groups according to topology information of data center network. A plurality of virtual machines in each group is assigned to a plurality of servers in the data center network. A pair-wised transmission path of the plurality of servers is assigned according to a traffic load of each switch in the data center network.

Abstract: A semiconductor device having enhanced passivation integrity is disclosed. The device includes a substrate, a first layer, and a metal layer. The first layer is formed over the substrate. The first layer includes a via opening and a tapered portion proximate to the via opening. The metal layer is formed over the via opening and the tapered portion of the first layer. The metal layer is substantially free from gaps and voids.

Abstract: A semiconductor device with the metal fuse and a fabricating method thereof are provided. The metal fuse connects an electronic component (e.g., a transistor) and a existing dummy feature which is grounded. The protection of the metal fuse can be designed to start at the beginning of the metallization formation processes. The grounded dummy feature provides a path for the plasma charging to the ground during the entire back end of the line process. The metal fuse is a process level protection as opposed to the diode, which is a circuit level protection. As a process level protection, the metal fuse protects subsequently-formed circuitry. In addition, no additional active area is required for the metal fuse in the chip other than internal dummy patterns that are already implemented.

Abstract: An oil injector for a vehicle is provided. The oil injector includes a transparent body having a flowing hole formed on a front end of the body. A flexible tube member is connected to the body and corresponds to the flowing hole. A storing space is formed in an internal portion of the body. One end of a piston member is entered into the storing space, and the piston member is movable relative to the body. Therefore, the piston member provides a pushing function in the storing space so that a fluid flows into or out form the body via the tube member, and the transparent body is provided for observing a storing amount of the fluid in the body.

Abstract: A storage case is provided, including two shell bodies correspondingly foldably and unfoldably connected to each other. Each shell body includes a main body and a color ring arranged around a circumferential edge at an end of the main body, and a color of the color ring is different from a color of the main body. When the two shell bodies are correspondingly folded, the two color rings are substantially disposed parallel to each other in intervals and located at opposite end edges remote from each other of the two shell bodies. When the two shell bodies are unfolded and located neighboring to and parallel to each other, the two color rings are disposed, substantially, neighboring to each other on the same level.

Abstract: A pumping device includes a pump and a connector. A piston is slidably disposed in a container of the pump. A pumping rod is connected with the piston with an end, and the other end of the pumping rod extends outward. The container has an opening at a bottom thereof, and a first connecting portion is formed around the opening The connector has a cavity, an inlet channel, and an outlet channel. The inlet channel and the outlet channel communicate with the cavity respectively. The connector has a second connecting portion to be engaged with the first connecting portion to allow the cavity communicating with the opening of the container. The inlet channel only allows fluid entering the cavity, and the outlet channel only allows fluid leaving the cavity.

Abstract: A semiconductor device having enhanced passivation integrity is disclosed. The device includes a substrate, a first layer, and a metal layer. The first layer is formed over the substrate. The first layer includes a via opening and a tapered portion proximate to the via opening. The metal layer is formed over the via opening and the tapered portion of the first layer. The metal layer is substantially free from gaps and voids.

Abstract: A spray gun includes a control portion, a flared tube, a spray tube, and a connecting tube between the control portion and the spray tube. A fluid container communicates with the connecting tube via a sucking tube. An inner tube located in the spray tube has an end communicating with the sucking tube. The flared tube covers the spray tube and has a restriction portion therein to sleeve onto the spray tube. When the control portion is triggered to allow gas enter the connecting tube and the spray tube, fluid is sucked into the inner tube from the fluid container and is mixed with the gas to form mist. An air channel between the control portion and the fluid container is adapted for pressurize the fluid to facilitate sucking the fluid.

Abstract: A semiconductor device with the metal fuse and a fabricating method thereof are provided. The metal fuse connects an electronic component (e.g., a transistor) and a existing dummy feature which is grounded. The protection of the metal fuse can be designed to start at the beginning of the metallization formation processes. The grounded dummy feature provides a path for the plasma charging to the ground during the entire back end of the line process. The metal fuse is a process level protection as opposed to the diode, which is a circuit level protection. As a process level protection, the metal fuse protects subsequently-formed circuitry. In addition, no additional active area is required for the metal fuse in the chip other than internal dummy patterns that are already implemented.

Abstract: An oil changing device for a transmission includes a tub body having a receiving space for receiving transmission oil, a main assembly having a base body, a manual set and a backflow valve, the base body mounted to the tub body, the base body having a main channel, a first passage and a backflow passage, the base body configured to connect with one end of an injection tube, another end of the injection tube connected to a transmission, the injection tube communicating with the main channel, the base body having a through hole opened therethrough, the through hole communicating with the main channel, the manual set having a second passage defined therein, the first passage connected between the main channel and the second passage, the backflow valve inserted into the through hole, and the backflow valve selectively closing or unclosing the backflow passage.

Abstract: A semiconductor device having enhanced passivation integrity is disclosed. The device includes a substrate, a first layer, and a metal layer. The first layer is formed over the substrate. The first layer includes a via opening and a tapered portion proximate to the via opening. The metal layer is formed over the via opening and the tapered portion of the first layer. The metal layer is substantially free from gaps and voids.

Abstract: A semiconductor device with the metal fuse is provided. The metal fuse connects an electronic component (e.g., a transistor) and a existing dummy feature which is grounded. The protection of the metal fuse can be designed to start at the beginning of the metallization formation processes. The grounded dummy feature provides a path for the plasma charging to the ground during the entire back end of the line process. The metal fuse is a process level protection as opposed to the diode, which is a circuit level protection. As a process level protection, the metal fuse protects subsequently-formed circuitry. In addition, no additional active area is required for the metal fuse in the chip other than internal dummy patterns that are already implemented.

Abstract: A hammer includes a handle, a head portion, and a striking mechanism. The head portion is connected with the handle and includes a metal strike element and a resilient strike element. A receiving space is defined between the two strike elements. The striking mechanism is located in the receiving space and includes a slide axle and a striking member. The striking member has a through hole for being slidably sleeved onto the slide axle. The striking member is slidable in the receiving space to alternatively strike one end of the head portion. Thereby, inertia striking force is provided by the striking member so that the hammer can be used to strike an object more easily.

Abstract: A data encryption method, adapted to a node computing device in a cloud server system comprises following steps. A primary data is received. A dimension of an encrypted matrix is computed. An encryption length is computed, and data segments matching the encryption length are extracted from the primary data sequentially according to the encryption length. A plurality of encrypted segments is obtained by encrypting the extracted data segments respectively through the encrypted matrix.

Abstract: A semiconductor device having enhanced passivation integrity is disclosed. The device includes a substrate, a first layer, and a metal layer. The first layer is formed over the substrate. The first layer includes a via opening and a tapered portion proximate to the via opening. The metal layer is formed over the via opening and the tapered portion of the first layer. The metal layer is substantially free from gaps and voids.