Patents by Inventor Ying-Chieh Wu

Ying-Chieh Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250133699
    Abstract: An electronic device includes a logic body, a heat dissipation fin, and a rotating bracket. The logic body has multiple first end openings and multiple first bottom openings. The first end openings are disposed on a first end of the logic body. The first bottom openings are disposed on a bottom of the logic body and are adjacent to the first end. The heat dissipation fins are disposed inside an interior of the logic body and correspond to the first bottom openings. The rotating bracket is rotatably disposed at the bottom. In a closed mode, the rotating bracket is close to the bottom and covers the first bottom openings. In an open mode, the rotating bracket is unfolded from the bottom and exposes the first bottom openings.
    Type: Application
    Filed: January 10, 2024
    Publication date: April 24, 2025
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Chien-Sheng Lan, Ying-Chieh Wu, Chih-Yuan Chuang, Wen-Hsien Chin, Yi-Chang Lee, Jih-Houng Lee