Abstract: A first and second patterned circuit layer are formed on a first surface and a second surface of a base material. A first adhesive layer is formed on the first patterned circuit layer. A portion of the first surface is exposed by the first patterned circuit layer. The metal reflection layer covers the first insulation layer and a reflectance thereof is greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer, and the first adhesive layer is disposed between the first patterned circuit layer and the first insulation layer. A transparent adhesive layer and a protection layer are formed on the metal reflection layer. The transparent adhesive layer is disposed between the metal reflection layer and the protection layer. The protection layer comprises a transparent polymer. The light transmittance is greater than or equal to 80%.

Abstract: A method of building a characteristic model includes: acquiring raw electrical data from a measurement system outside one or more processing units; acquiring operational state-related data from an information collector inside the one or more processing units; performing a data annealing process on the raw electrical data and the operational state-related data to obtain and purified electrical data and purified operational state-related data; and performing a machine learning (ML)-based process to build the characteristic model based on the purified electrical data and the purified operational state-related data.

Abstract: A bracket and a terminal equipment are provided. The bracket is provided for a terminal device to be installed thereon and includes a bracket body, two installing elements, and at least one holding element. The two installing elements respectively protrude outward from two sides of the bracket body, and each of the two installing elements includes an engaging portion. The two installing elements are configured to be inserted into the terminal device so the terminal device is installed on the bracket, and each of the engaging portions is configured such that each of the installing elements is engaged with and retained in the terminal device. The holding element protrudes outward from the bracket body and is configured to be inserted into a loading hole of the terminal device.

Abstract: The present disclosure relates to an integrated chip. The integrated chip includes a substrate having one or more interior surfaces forming a recess within an upper surface of the substrate. Source/drain regions are disposed within the substrate on opposing sides of the recess. A first gate dielectric is arranged along the one or more interior surfaces forming the recess, and a second gate dielectric is arranged on the first gate dielectric and within the recess. A gate electrode is disposed on the second gate dielectric. The second gate dielectric includes one or more protrusions that extend outward from a recessed upper surface of the second gate dielectric and that are arranged along opposing sides of the second gate dielectric.

Abstract: A separation apparatus suitable for separating plastic and silicone in a composite material includes a storage tank configured to store a hydrocarbon solvent, and a reaction tank fluidly connected to the storage tank and having a reaction space for placement of the composite material therein and for receiving the hydrocarbon solvent from the storage tank such that the composite material is immersed in the hydrocarbon solvent for separating the plastic and the silicone in the composite material. The plastic and the silicone in the composite material are insoluble in the hydrocarbon solvent.

Abstract: A graphics system includes an effect engine and a graphics pipeline. The graphics pipeline performs pipeline operations on graphical objects in a frame. The graphics pipeline includes at least a fragment shader stage. An application programming interface (API) provides an instruction that specifies a subset of the graphical objects in the frame for the effect engine to execute. When detecting the instruction, the graphics pipeline invokes the effect engine to perform a predefined set of graphics operations on the subset of the graphical objects in the frame. The predefined set of graphics operations has a higher computational complexity than the pipeline operations.

Abstract: A base material is provided. A first patterned circuit layer and a second patterned circuit layer are formed on a first surface and a second surface of the base material. A first insulation layer and a metal reflection layer are provided on the first patterned circuit layer and a portion of the first surface exposed by the first patterned circuit layer, wherein the metal reflection layer covers the first insulation layer, and a reflectance of the metal reflection layer is substantially greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer. A first ink layer is formed on the first insulation layer before the metal reflection layer is formed.

Abstract: A semiconductor device includes a first electrode layer, a ferroelectric layer, and a second electrode layer. A material of the ferroelectric layer comprises a ferroelectric material doped with a first dopant and a second dopant different from the first dopant, and the first dopant comprises cerium. The ferroelectric layer is disposed between the first electrode layer and the second electrode layer.

Abstract: A semiconductor device includes a first electrode layer, a ferroelectric layer, a first alignment layer and a second electrode layer. A material of the first alignment layer includes rare-earth metal oxide. The ferroelectric layer and the first alignment layer are disposed between the first electrode layer and the second electrode layer, and the first alignment layer is disposed between the ferroelectric layer and the first electrode layer.

Abstract: A semiconductor device includes a gate stack and a channel layer over the gate stack. The gate stack includes a metal gate electrode, a ferroelectric layer, and a semiconducting oxide layer disposed between the ferroelectric layer and the metal gate electrode. The semiconducting oxide layer includes SrRuO3, InGaZnO (IGZO) or LaSrMnO.

Abstract: A semiconductor package includes a first die, a second die, and a hybrid-type adhesive. The second die is stacked on the first die through the hybrid-type adhesive. The hybrid-type adhesive includes a conductive adhesive and a non-conductive adhesive. The conductive adhesive is disposed between the non-conductive adhesive and the first die. The non-conductive adhesive is disposed between the conductive adhesive and the second die.

Abstract: A semiconductor device includes a substrate, a gate stack over the substrate, a channel layer over the gate stack, and a source/drain electrode. The gate stack includes a metal gate electrode, a ferroelectric layer, and a semiconducting oxide layer disposed between the ferroelectric layer and the metal gate electrode. The source/drain electrode is formed on the channel layer and disposed on sides of the gate stack.

Abstract: A semiconductor device includes a substrate, a gate stack over the substrate, a channel layer over the gate stack, and a source/drain electrode. The gate stack includes a metal gate electrode, a ferroelectric layer, and a semiconducting oxide layer disposed between the ferroelectric layer and the metal gate electrode. The source/drain electrode is formed on the channel layer and disposed on sides of the gate stack.

Abstract: A semiconductor package includes a substrate, an electronic component, a dielectric layer a transmitting antenna, a receiving antenna and a FSS (Frequency selective surface) antenna. The electronic component is disposed on and electrically connected with the substrate. The dielectric layer has a dielectric upper surface. The transmitting antenna and the receiving antenna are formed adjacent to the substrate. The FSS antenna is formed adjacent to the dielectric upper surface of the dielectric layer. The FSS antenna is separated from the substrate by the dielectric layer in a wireless signal emitting direction.

Abstract: A vehicle door handle including an RFID module and a button module cooperates with a vehicle controller and a remote control. The button module triggers the RFID module to transmit a querying code to the remote control upon being pressed. The remote control transmits a confirmation code and a remote ID code to the RFID module, and the RFID module determines whether the confirmation code corresponds to the querying code. If yes, the RFID module further forwards the remote ID code to the controller in order for the controller to determine whether the remote ID code is identical with a pre-stored ID code, and to control a lock actuator to switch from a locking position to an unlocking position, or vice versa, when it is determined that the remote ID code is identical with the pre-stored ID code.

Abstract: A semiconductor package includes a substrate, an electronic component, a dielectric layer a transmitting antenna, a receiving antenna and a FSS (Frequency selective surface) antenna. The electronic component is disposed on and electrically connected with the substrate. The dielectric layer has a dielectric upper surface. The transmitting antenna and the receiving antenna are formed adjacent to the substrate. The FSS antenna is formed adjacent to the dielectric upper surface of the dielectric layer. The FSS antenna is separated from the substrate by the dielectric layer in a wireless signal emitting direction.

Abstract: A print circuit board and a manufacturing method thereof are disclosed. The print circuit board includes a first substrate, a first insulating layer and a metal sheet. The first insulating layer is formed between the first substrate and the metal sheet. The insulating layer includes silicon-based polymer compound. The manufacturing method for the print circuit board includes the following steps: coating a first substrate and a metal sheet with insulating material, placing the first substrate and the metal sheet into a heating device to bake the insulating material on the first substrate and the metal sheet, and bonding the metal sheet onto the first substrate through thermally pressing the baked insulating material. The insulating material includes silicon-based polymer compound.

Abstract: A camera device includes a lens module, a mounting casing, and a base member. The lens module includes a housing, a camera unit mounted in and partially exposed from the housing, and a wire electrically connected to the camera unit. The mounting casing includes a main body having a front wall formed with a front window and a surrounding wall peripherally extending from the front wall and cooperating with the front wall to define a receiving space being in spatial communication with the front window, and two connecting portions extending from the surrounding wall of the main body. The housing is disposed in the receiving space to expose the camera unit from the front window. The base member is connected to the housing and the mounting casing.