Abstract: A semiconductor package includes a first die, a second die, and a hybrid-type adhesive. The second die is stacked on the first die through the hybrid-type adhesive. The hybrid-type adhesive includes a conductive adhesive and a non-conductive adhesive. The conductive adhesive is disposed between the non-conductive adhesive and the first die. The non-conductive adhesive is disposed between the conductive adhesive and the second die.

Abstract: A semiconductor device includes a gate stack and a channel layer over the gate stack. The gate stack includes a metal gate electrode, a ferroelectric layer, and a semiconducting oxide layer disposed between the ferroelectric layer and the metal gate electrode. The semiconducting oxide layer includes SrRuO3, InGaZnO (IGZO) or LaSrMnO.

Abstract: A semiconductor device includes a first electrode layer, a ferroelectric layer, and a second electrode layer. A material of the ferroelectric layer comprises a ferroelectric material doped with a first dopant and a second dopant different from the first dopant, and the first dopant comprises cerium. The ferroelectric layer is disposed between the first electrode layer and the second electrode layer.

Abstract: A semiconductor device includes a first electrode layer, a ferroelectric layer, a first alignment layer and a second electrode layer. A material of the first alignment layer includes rare-earth metal oxide. The ferroelectric layer and the first alignment layer are disposed between the first electrode layer and the second electrode layer, and the first alignment layer is disposed between the ferroelectric layer and the first electrode layer.

Abstract: A semiconductor device includes a gate stack and a channel layer over the gate stack. The gate stack includes a metal gate electrode, a ferroelectric layer, and a semiconducting oxide layer disposed between the ferroelectric layer and the metal gate electrode. The semiconducting oxide layer includes SrRuO3, InGaZnO (IGZO) or LaSrMnO.

Abstract: A semiconductor package includes a first die, a second die, and a hybrid-type adhesive. The second die is stacked on the first die through the hybrid-type adhesive. The hybrid-type adhesive includes a conductive adhesive and a non-conductive adhesive. The conductive adhesive is disposed between the non-conductive adhesive and the first die. The non-conductive adhesive is disposed between the conductive adhesive and the second die.

Abstract: A semiconductor device includes a substrate, a gate stack over the substrate, a channel layer over the gate stack, and a source/drain electrode. The gate stack includes a metal gate electrode, a ferroelectric layer, and a semiconducting oxide layer disposed between the ferroelectric layer and the metal gate electrode. The source/drain electrode is formed on the channel layer and disposed on sides of the gate stack.

Abstract: A semiconductor device includes a substrate, a gate stack over the substrate, a channel layer over the gate stack, and a source/drain electrode. The gate stack includes a metal gate electrode, a ferroelectric layer, and a semiconducting oxide layer disposed between the ferroelectric layer and the metal gate electrode. The source/drain electrode is formed on the channel layer and disposed on sides of the gate stack.

Abstract: A semiconductor package includes a substrate, an electronic component, a dielectric layer a transmitting antenna, a receiving antenna and a FSS (Frequency selective surface) antenna. The electronic component is disposed on and electrically connected with the substrate. The dielectric layer has a dielectric upper surface. The transmitting antenna and the receiving antenna are formed adjacent to the substrate. The FSS antenna is formed adjacent to the dielectric upper surface of the dielectric layer. The FSS antenna is separated from the substrate by the dielectric layer in a wireless signal emitting direction.

Abstract: A vehicle door handle including an RFID module and a button module cooperates with a vehicle controller and a remote control. The button module triggers the RFID module to transmit a querying code to the remote control upon being pressed. The remote control transmits a confirmation code and a remote ID code to the RFID module, and the RFID module determines whether the confirmation code corresponds to the querying code. If yes, the RFID module further forwards the remote ID code to the controller in order for the controller to determine whether the remote ID code is identical with a pre-stored ID code, and to control a lock actuator to switch from a locking position to an unlocking position, or vice versa, when it is determined that the remote ID code is identical with the pre-stored ID code.

Abstract: A semiconductor package includes a substrate, an electronic component, a dielectric layer a transmitting antenna, a receiving antenna and a FSS (Frequency selective surface) antenna. The electronic component is disposed on and electrically connected with the substrate. The dielectric layer has a dielectric upper surface. The transmitting antenna and the receiving antenna are formed adjacent to the substrate. The FSS antenna is formed adjacent to the dielectric upper surface of the dielectric layer. The FSS antenna is separated from the substrate by the dielectric layer in a wireless signal emitting direction.

Abstract: A print circuit board and a manufacturing method thereof are disclosed. The print circuit board includes a first substrate, a first insulating layer and a metal sheet. The first insulating layer is formed between the first substrate and the metal sheet. The insulating layer includes silicon-based polymer compound. The manufacturing method for the print circuit board includes the following steps: coating a first substrate and a metal sheet with insulating material, placing the first substrate and the metal sheet into a heating device to bake the insulating material on the first substrate and the metal sheet, and bonding the metal sheet onto the first substrate through thermally pressing the baked insulating material. The insulating material includes silicon-based polymer compound.

Abstract: A camera device includes a lens module, a mounting casing, and a base member. The lens module includes a housing, a camera unit mounted in and partially exposed from the housing, and a wire electrically connected to the camera unit. The mounting casing includes a main body having a front wall formed with a front window and a surrounding wall peripherally extending from the front wall and cooperating with the front wall to define a receiving space being in spatial communication with the front window, and two connecting portions extending from the surrounding wall of the main body. The housing is disposed in the receiving space to expose the camera unit from the front window. The base member is connected to the housing and the mounting casing.

Abstract: A vehicle door handle including an RFID module and a button module cooperates with a vehicle controller and a remote control. The button module triggers the RFID module to transmit a querying code to the remote control upon being pressed. The remote control transmits a confirmation code and a remote ID code to the RFID module, and the RFID module determines whether the confirmation code corresponds to the querying code. If yes, the RFID module further forwards the remote ID code to the controller in order for the controller to determine whether the remote ID code is identical with a pre-stored ID code, and to control a lock actuator to switch from a locking position to an unlocking position, or vice versa, when it is determined that the remote ID code is identical with the pre-stored ID code.

Abstract: A system for capturing a panoramic image of a shoe sole includes a processor and a panoramic image capturing device that is disposed apart from an attachment surface of the shoe sole. The panoramic image capturing device captures a panoramic image of the attachment surface and an inner surface of a sidewall of the shoe sole. The panoramic image capturing device outputs the panoramic image. The processor obtains the panoramic image outputted by the panoramic image capturing device.

Abstract: A camera device includes a lens module, a mounting casing, and a base member. The lens module includes a housing, a camera unit mounted in and partially exposed from the housing, and a wire electrically connected to the camera unit. The mounting casing includes a main body having a front wall formed with a front window and a surrounding wall peripherally extending from the front wall and cooperating with the front wall to define a receiving space being in spatial communication with the front window, and two connecting portions extending from the surrounding wall of the main body. The housing is disposed in the receiving space to expose the camera unit from the front window. The base member is connected to the housing and the mounting casing.

Abstract: A semiconductor package assembly includes a first substrate. A first semiconductor die is disposed on the first substrate. A passive device is located directly on the first semiconductor die. The passive device is disposed within a boundary of the first semiconductor die in a plan view.

Abstract: A system for determining an amount of glue applied to a shoe portion includes a lighting device, an image capturing device and a processor. The lighting device illuminates the shoe portion with light beams that have wavelengths within a predetermined range. The image capturing device captures an image associated with the shoe portion under illumination of the light beams, and outputs the image associated with the shoe portion. The processor obtains chromaticity values of pixels selected from an instance of the image associated with the shoe portion that is applied with glue, and generates a result of estimation regarding the amount of the glue applied to the shoe portion based on the chromaticity values and at least one reference value.