Abstract: The present disclosure provides a die. The die of the present disclosure has a top surface, a plurality of side surfaces, a bottom surface, a circuit layer and a platform. The bottom surface is connected to the side surfaces. The circuit layer is formed on the bottom surface. The platform is disposed around the top surface and is parallel to the top surface and the bottom surface. The distance from the platform to the bottom surface is less than that from the top surface to the bottom surface. The platform is perpendicularly connected to the side surfaces. The present disclosure further provides a method of manufacturing the above die and a semiconductor package with the die.

Abstract: The present disclosure provides a semiconductor package. The semiconductor package includes a heat spreader, a first die, a plurality of first conductive bumps, a molding layer and a redistribution layer. The first die is disposed on the heat spreader and has a top surface and a bottom surface opposing to the top surface. The first conductive bumps are disposed on the top surface of the first die and electrically connected to the first die. The molding layer is formed on the heat spreader to cover the top surface of the first die and expose the first conductive bumps. The redistribution layer is disposed on the molding layer to electrically connect to the first conductive bumps. The present disclosure further provides a method of manufacturing the above semiconductor package.

Abstract: A semiconductor wafer includes a substrate structure, a first insulation layer, a conductive layer and a second insulation layer. The substrate structure defines a via. The first insulation layer covers a surface of the substrate structure. The first insulation layer extends into the via, covers a lateral wall of the via and exposes a bottom surface at a bottom of the via. The conductive layer covers the first insulation layer and the bottom surface exposed by the first insulation layer. The second insulation layer covers the conductive layer. A warpage of the semiconductor wafer is less than 550 micrometers.

Abstract: Display devices and methods forming the same. A digitizer sensor board is integrated on an upper substrate or a lower substrate of a display panel to provide a display device. In the display device, the display panel displays images, and the digitizer sensor board is integrated into the display panel to sense position of a position pointer or finger contact on a surface.

Abstract: Display systems with multifunctional digitizer module board. A shield film is integrated on a digitizer sensor board to form a multifunctional digitizer module board with lower thickness and weight. In the multifunctional digitizer module, a digitizer sensor board senses position of a position pointer or finger contact on a surface and a shield film is integrated on one surface of the digitizer sensor board by semiconductor process to screen out external noise. A display panel is disposed above the multifunctional digitizer module board and coupled thereto, displaying images.

Abstract: Display systems with digitizers. In a display system, an interface is coupled to a host system, and a control unit is coupled to a digitizer module, the display panel and the interface. The control unit drives the display panel to display a corresponding image and generates a scan timing signal to the digitizer module, according to an image signal from the host system via the interface. The digitizer module is coupled to the host system via the same interface and executes a scan operation to generate position data in response to the scan timing signal.

Abstract: Display systems with digitizers. In a display system, an interface is coupled to a host system, and a control unit is coupled to a digitizer module, the display panel and the interface. The control unit drives the display panel to display a corresponding image and generates a scan timing signal to the digitizer module, according to an image signal from the host system via the interface. The digitizer module is coupled to the host system via the same interface and executes a scan operation to generate position data in response to the scan timing signal.

Abstract: Display devices and methods forming the same. A digitizer sensor board is integrated on an upper substrate or a lower substrate of a display panel to provide a display device. In the display device, the display panel displays images, and the digitizer sensor board is integrated into the display panel to sense position of a position pointer or finger contact on a surface.

Abstract: Display systems with multifunctional digitizer module board. A shield film is integrated on a digitizer sensor board to form a multifunctional digitizer module board with lower thickness and weight. In the multifunctional digitizer module, a digitizer sensor board senses position of a position pointer or finger contact on a surface and a shield film is integrated on one surface of the digitizer sensor board by semiconductor process to screen out external noise. A display panel is disposed above the multifunctional digitizer module board and coupled thereto, displaying images.