Abstract: A first and second patterned circuit layer are formed on a first surface and a second surface of a base material. A first adhesive layer is formed on the first patterned circuit layer. A portion of the first surface is exposed by the first patterned circuit layer. The metal reflection layer covers the first insulation layer and a reflectance thereof is greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer, and the first adhesive layer is disposed between the first patterned circuit layer and the first insulation layer. A transparent adhesive layer and a protection layer are formed on the metal reflection layer. The transparent adhesive layer is disposed between the metal reflection layer and the protection layer. The protection layer comprises a transparent polymer. The light transmittance is greater than or equal to 80%.

Abstract: Some implementations described herein provide techniques and apparatuses for a stacked semiconductor die package. The stacked semiconductor die package may include an upper semiconductor die package above a lower semiconductor die package. The stacked semiconductor die package includes one or more rows of pad structures located within a footprint of a semiconductor die of the lower semiconductor die package. The one or more rows of pad structures may be used to mount the upper semiconductor die package above the lower semiconductor die package. Relative to another stacked semiconductor die package including a row of dummy connection structures adjacent to the semiconductor die that may be used to mount the upper semiconductor die package, a size of the stacked semiconductor die package may be reduced.

Abstract: A novel additive for recycling thermoset materials, its related recyclable thermoset composition and its application are disclosed. Specifically, the composition of the additive comprises at least one copolymer that has at least one carbamate group, at least one carbonate group and/or at least one urea group, and a number-average molecular weight of the copolymer is between 100 and 50,000 Da.

Abstract: Some implementations described herein provide techniques and apparatuses for a fixture including a semiconductor die package and methods of formation. The semiconductor die package is mounted to an interposer. In addition to the semiconductor die package, the fixture includes a lid component having a top structure and footing structures that connect the lid component to the interposer. The fixture includes a thermal interface material between a top surface of the semiconductor die package and the top structure of the lid component. The footing structures, connected to the interposer using deposits of an epoxy material, provide increase a structural rigidity of the fixture relative to another fixture not including the footing structures.

Abstract: A base material is provided. A first patterned circuit layer and a second patterned circuit layer are formed on a first surface and a second surface of the base material. A first insulation layer and a metal reflection layer are provided on the first patterned circuit layer and a portion of the first surface exposed by the first patterned circuit layer, wherein the metal reflection layer covers the first insulation layer, and a reflectance of the metal reflection layer is substantially greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer. A first ink layer is formed on the first insulation layer before the metal reflection layer is formed.

Abstract: A semiconductor package including two different adhesives and a method of forming are provided. The semiconductor package may include a package component having a semiconductor die bonded to a substrate, a first adhesive over the substrate, a heat transfer layer on the package component, and a lid attached to the substrate by a second adhesive. The first adhesive may encircle the package component and the heat transfer layer. The lid may include a top portion on the heat transfer layer and the first adhesive, and a bottom portion attached to the substrate and encircling the first adhesive. A material of the second adhesive may be different from a material of the first adhesive.

Abstract: A semiconductor package including one or more dam structures and the method of forming are provided. A semiconductor package may include an interposer, a semiconductor die bonded to a first side of the interposer, an encapsulant on the first side of the interposer encircling the semiconductor die, a substrate bonded to the a second side of the interposer, an underfill between the interposer and the substrate, and one or more of dam structures on the substrate. The one or more dam structures may be disposed adjacent respective corners of the interposer and may be in direct contact with the underfill. The coefficient of thermal expansion of the one or more of dam structures may be smaller than the coefficient of thermal expansion of the underfill.

Abstract: A light energy testing device includes a light source emitting parallel light, a Fresnel lens concentrating the parallel light, a fiber array consisting of a plurality of optical fibers, and an energy detecting device. Each fiber includes a light incident and emitting surface. The light incident surfaces are coplanar to define a light receiving surface. The light emitting surfaces cooperatively define a light transmitting surface. The energy detecting device includes a plurality of sensor units optically coupled with the light transmitting surface and a testing device connected to the sensor units. The parallel light is focused by the Fresnel lens to irradiate the light receiving surface. The sensor units generate energy signals according to the light from the light transmitting surface. The energy detecting device calculates a light energy distribution according to the energy signals.

Abstract: An LED bulb includes a heat sink, a circuit, an LED, and a driving module. The heat sink includes a base, a tube extending downwardly from a first face of the base, and a plurality of fins extending outwardly from an outer circumference of the tube. The circuit is formed on a second face of the base, and the LED is disposed on the second face of the base and electrically connected with the circuit. The LED bulb further includes a first lead and a second lead electrically connecting with the circuit and extending through the base. The driving module includes a first electrode, and a second electrode electrically insulated from the first electrode and surrounding the first electrode. The first electrode of the driving circuit contacts with the first lead, and the second electrode of the driving circuit contacts with the second lead.

Abstract: An LED bulb includes a connector for electrically connecting with a power supply, a heat sink disposed on the connector, and a plurality of LEDs mounted the heat sink. The heat sink includes a base, a tube extending downwardly from a first face of the base, and a plurality of fins extending outwardly from an outer circumference of the tube. The LEDs are attached on a second face of the base. The base defines a plurality of through tunnels extending through the base from the first face to the second face of the base.

Abstract: A light concentrator assembly includes a Fresnel lens, a plano-concave lens, and a CPC. The CPC is aligned with the Fresnel lens and the plano-concave lens. The Fresnel lens unit is configured for converging parallel light transmitted the Fresnel lens. The plano-concave lens is configured for further concentrating the light from the Fresnel lens before the light converged at a point. The CPC is configured for reflecting and directing the light beams from the plano-concave lens to exit through a light output opening of the CPC. The light concentrator assembly has a large incident acceptance angle.

Abstract: A workpiece with three-dimensional pattern having a three-dimensional surface and suitable for an electronic device is provided. A multiple three-dimensional micro patterns formed on the three-dimensional surface reflects an environment light to form images with a visual effect. The workpiece with three-dimensional pattern includes a workpiece and an adhesive layer. The adhesive layer is disposed on the workpiece and impressed to form the multiple three-dimensional micro patterns, and the workpiece is punched to form the three-dimensional surface. A first part of the multiple three-dimensional micro patterns on the three-dimensional surface reflects the environment light to form a first reflecting light beam. A second part of the multiple three-dimensional micro patterns on the three-dimensional surface reflects the environment light to form a second reflecting light beam.

Abstract: A light concentration element assembly includes a Fresnel lens unit and a compound parabolic concentrator. The Fresnel lens unit includes a first Fresnel lens and a second Fresnel lens arranged parallel with each other, and configured for converging light transmitted therethrough. The compound parabolic concentrator includes at least two paraboloidal reflecting surfaces. The parabolic concentrator includes a light incident opening facing the Fresnel lens unit and a light output opening, and the paraboloidal reflecting surfaces are configured for reflecting the converged light from the Fresnel lens unit and outputting the reflected light through the light output opening. A solar cell apparatus using the light concentration element assembly is provided.

Abstract: A light concentrator assembly includes a first Fresnel lens, a second Fresnel lens, and a compound parabolic concentrator. The first Fresnel lens includes a first flat surface and an opposite first Fresnel lens surface. The second Fresnel lens includes a second flat surface and an opposite second Fresnel lens surface facing the first Fresnel lens surface. A first focal point of the first Fresnel lens and a second focal point of the second Fresnel lens coincide. The compound parabolic concentrator is located opposite the second flat surface. Light beams are converged by the first and second Fresnel lenses, and exit through the compound parabolic concentrator.

Abstract: An LED bulb includes a heat sink, a circuit, an LED, and a driving module. The heat sink includes a base, a tube extending downwardly from a first face of the base, and a plurality of fins extending outwardly from an outer circumference of the tube. The circuit is formed on a second face of the base, and the LED is disposed on the second face of the base and electrically connected with the circuit. The LED bulb further includes a first lead and a second lead electrically connecting with the circuit and extending through the base. The driving module includes a first electrode, and a second electrode electrically insulated from the first electrode and surrounding the first electrode. The first electrode of the driving circuit contacts with the first lead, and the second electrode of the driving circuit contacts with the second lead.

Abstract: An LED bulb includes a connector for electrically connecting with a power supply, a heat sink disposed on the connector, and a plurality of LEDs mounted the heat sink. The heat sink includes a base, a tube extending downwardly from a first face of the base, and a plurality of fins extending outwardly from an outer circumference of the tube. The LEDs are attached on a second face of the base. The base defines a plurality of through tunnels extending through the base from the first face to the second face of the base.

Abstract: An exemplary heat dissipation device includes an elongated main body, a number of heat sinks, and a number of airflow channels. The main body has a central axis, and includes a first portion and a second portion. The second portion has an end distant from the first portion which is configured for supporting at least one item selected from the group consisting of a solid-state light source and a circuit board having a solid-state light source mounted thereon. The heat sinks are arranged around the first portion in sequence along the central axis of the main body, and spaced from one another. Each heat sink includes a number of fins extending out from the first portion radially. The airflow channel is defined between each two neighboring heat sinks.