Abstract: A manufacturing method of a package structure includes: forming a redistribution layer on a top surface of a glass substrate; forming a protective layer on the top surface of the glass substrate; cutting the glass substrate and the protective layer such that the glass substrate has a cutting edge, in which a crack is formed in the cutting edge of the glass substrate; and heating the protective layer such that a portion of the protective layer flows towards a bottom surface of the glass substrate to cover the cutting edge of the glass substrate and fill the crack in the cutting edge of the glass substrate.

Abstract: A package structure includes a substrate, a plurality of conductive pads, a light-emitting diode, a photo imageable dielectric material, and a black matrix. The substrate includes a top surface. The conductive pads are located on the top surface of the substrate. The light-emitting diode is located on the conductive pads. The photo imageable dielectric material is located between the light-emitting diode and the top surface of the substrate and between the conductive pads. An orthogonal projection of the light-emitting diode on the substrate is overlapped with an orthogonal projection of the photo imageable dielectric material on the substrate. The black matrix is located on the top surface of the substrate and the conductive pads.

Abstract: A vapor chamber device and a manufacturing method are disclosed. The vapor chamber has a housing and multiple independent chambers. The housing includes two shells opposite to each other. The independent chambers are formed between the two shells. Each independent chamber contains a working fluid and has at least one diversion bump and a capillary structure. The diversion bump is formed on an inner surface of the second shell, and the capillary structure is mounted on the diversion bump. When the vapor chamber device is vertically mounted to a heat source, the independent chambers at an upper portion of the vapor chamber device still contain the working fluid. The working fluid in the independent chambers may not all flow to a bottom of the vapor chamber device. Therefore, a contact area between the working fluid and the heat source is increased and heat dissipation efficiency is improved.

Abstract: A vapor chamber device has a housing and multiple chambers. The housing includes two shells opposite to each other. The chambers are formed between the two shells. Each chamber contains a working fluid and has at least one diversion bump and a capillary structure. The diversion bump is formed on an inner surface of the second shell, and the capillary structure is mounted on the diversion bump. Since the chambers are independent from one another, when the vapor chamber device is vertically mounted to a heat source, the chambers at an upper portion of the vapor chamber device still contain the working fluid. The working fluid in the vapor chamber device may not all flow to a bottom of the vapor chamber device. Therefore, a contact area between the working fluid and the heat source is increased and heat dissipation efficiency is improved.

Abstract: A compound of Formula II, is provided. R1, R2 and R3 are independently either hydrogen, alkyl, aryl, halogen, alkoxy, nitro, amino or hydroxyl. X is either F, Cl, Br, I or CN. Y is either N or CH. Compositions that include Formula II can be used to inhibit vacuolar H+ ATPase.

Abstract: A compound of Formula II, is provided. R1, R2 and R3 are independently either hydrogen, alkyl, aryl, halogen, alkoxy, nitro, amino or hydroxyl. X is either F, Cl, Br, I or CN. Y is either N or CH. Compositions that include Formula II can be used to inhibit vacuolar H+ ATPase.

Abstract: The invention provides a method for updating firmware stored in a memory. In one embodiment, the memory is divided into a plurality of blocks, and the firmware to be updated with a new image version. First, a first data block is obtained from the new image version, and a second data block is obtained from a target block selected from the memory. Whether the first data block is different from the second data block is then checked. The first data block is then written into the target block when the first data block is different from the second data block. Finally, the aforementioned steps are repeated until all of the blocks are processed.

Abstract: A method for detecting a type of a non-volatile memory. The method includes issuing one of a sequence of reading identification commands to detect the type of the non-volatile memory; obtaining a response data from the non-volatile memory; judging whether the response data matches any type of a plurality of types of non-volatile memory; utilizing another reading identification command of the sequence of reading identification commands to detect the type of the non-volatile memory when the response data does not match any type of the plurality of types of non-volatile memory; and determining the type of the non-volatile memory according to the response data when the response data match one type of the plurality of types of non-volatile memory.

Abstract: A parallel memory updating method and its system are proposed in the present invention. The present invention is applied for a host computer and makes the host computer capable of using pipeline concept to update multiple peripheral devices at the same time. Thus, the updating efficiency is greatly improved. The parallel flash memory updating method includes the following steps: sending a START_FLASH_CMD command via an IDE interface to make the peripheral devices switch to a flash memory updating mode; send out a WRITE_ENABLE command to enable a writing function of the flash memories of the peripheral devices; and writing firmware data to the flash memories of the peripheral devices.