Patents by Inventor Ying-Chuan Lin

Ying-Chuan Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for detecting contaminating species on a wafer edge
    Patent number: 6727494
    Abstract: A method and an apparatus for detecting contaminating species such as metal particles on a wafer edge from a semiconductor fabrication process are disclosed. In the method, a wafer is suspended and rotated in a container with a volume of solvent at a bottom portion of the container such that only an edge portion of the wafer is exposed to the solvent. After the wafer is turned in the solvent such that the entire edge portion of the wafer has been exposed to the solvent, the solvent may be removed for analyzing in an electronic instrument for detecting the species of contaminating particles. The apparatus further includes a wafer mounting device for supporting the wafer which can be adjusted in height to suit wafers of different diameters.
    Type: Grant
    Filed: April 18, 2001
    Date of Patent: April 27, 2004
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventor: Ying-Chuan Lin
  • Method and apparatus for detecting contaminating species on a wafer edge
    Publication number: 20020153482
    Abstract: A method and an apparatus for detecting contaminating species such as metal particles on a wafer edge from a semiconductor fabrication process are disclosed. In the method, a wafer is suspended and rotated in a container with a volume of solvent at a bottom portion of the container such that only an edge portion of the wafer is exposed to the solvent. After the wafer is turned in the solvent such that the entire edge portion of the wafer has been exposed to the solvent, the solvent may be removed for analyzing in an electronic instrument for detecting the species of contaminating particles. The apparatus further includes a wafer mounting device for supporting the wafer which can be adjusted in height to suit wafers of different diameters.
    Type: Application
    Filed: April 18, 2001
    Publication date: October 24, 2002
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventor: Ying-Chuan Lin