Patents by Inventor Ying-Chun Chang

Ying-Chun Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11944970
    Abstract: A microfluidic detection unit comprises at least one fluid injection section, a fluid storage section and a detection section. Each fluid injection section defines a fluid outlet; the fluid storage section is in gas communication with the atmosphere and defines a fluid inlet; the detection section defines a first end in communication with the fluid outlet and a second end in communication with the fluid inlet. A height difference is defined between the fluid outlet and the fluid inlet along the direction of gravity. When a first fluid is injected from the at least one fluid injection section, the first fluid is driven by gravity to pass through the detection section and accumulate to form a droplet at the fluid inlet, such that a state of fluid pressure equilibrium of the first fluid is established.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: April 2, 2024
    Assignees: INSTANT NANOBIOSENSORS, INC., INSTANT NANOBIOSENSORS CO., LTD.
    Inventors: Yu-Chung Huang, Yi-Li Sun, Ting-Chou Chang, Jhy-Wen Wu, Nan-Kuang Yao, Lai-Kwan Chau, Shau-Chun Wang, Ying Ting Chen
  • Publication number: 20240088307
    Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chih-Hao Chang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
  • Publication number: 20040093612
    Abstract: An auto-balancing device mounted on the spindle of the motor of a disk player is disclosed to include a device shell, which defines an inner annular track and an outer annular track concentrically arranged around the center hub thereof, a plurality of rolling balls movably received in the inner annular track, and a balancing fluid filled in the outer annular track and worked with the rolling balls to produce a balancing force during rotary motion of the motor of the disk player, and to further balance eccentricity of mass and prohibit the production of vibrations and noises.
    Type: Application
    Filed: November 10, 2003
    Publication date: May 13, 2004
    Applicant: Tatung Co., Ltd.
    Inventor: Ying-Chun Chang