Abstract: A heat dissipating system provides a fast heat dissipating airflow stream inside a desktop computer and thereby greatly enhances the heat dissipating efficiency of the desktop computer. The computer heat dissipating system includes a computer chassis which has a circular opening bored on its front plate, a motherboard which has a thermal module including a front cooling fan and a set of chipsets heatsink module installed on its top surface, and a power supply with a cooling fan. The thermal module, the chipsets heatsink module, and the power supply are aligned along a single heat dissipating airflow stream. The external low temperature air first passes through the thermal module and removes the heat generated by the central processing unit, further flows into the chipsets heatsink module and removes the heat generated by the MCH chipsets and ICH chipsets, and finally enters into the power supply and removes the heat generated by the power supply.

Abstract: An inlet airflow guiding structure for a computer includes a computer chassis, a front bezel, an airflow guiding space defined between the front bezel and the computer chassis, and a plurality of inlet airflow openings. The airflow guiding space and the inlet airflow openings provide a low airflow impedance inlet that facilitates the movement of the incoming inlet airflow. The front cooling fan in the computer is thereby capable of providing lower-temperature air into computer for efficiently dissipating heat generated for high-speed CPU.

Abstract: An inlet airflow guiding structure for a computer includes a computer chassis, a front bezel, an airflow guiding space defined between the front bezel and the computer chassis, and a plurality of inlet airflow openings. The airflow guiding space and the inlet airflow openings provide a low airflow impedance inlet that facilitates the movement of the incoming inlet airflow. The front cooling fan in the computer is thereby capable of providing lower-temperature air into computer for efficiently dissipating heat generated for high-speed CPU.

Abstract: A computer bezel with an inlet airflow guiding device, which is not only suitable for a computer chassis with the BTX specification, but also able to provide a desktop computer an attractive appearance. The computer bezel with an inlet airflow guiding device includes a computer chassis, a front bezel, an inlet airflow guiding member, an airflow guiding space, and a plurality of inlet airflow openings. The airflow guiding space and the inlet airflow openings provide a low airflow impedance inlet that facilitates the movement of the incoming inlet airflow. The front cooling fan is thereby capable of providing the high power components of the desktop computer with low temperature air at a high velocity.

Abstract: A heat dissipating system provides a fast heat dissipating airflow stream inside a desktop computer and thereby greatly enhances the heat dissipating efficiency of the desktop computer. The computer heat dissipating system includes a computer chassis which has a circular opening bored on its front plate, a motherboard which has a thermal module including a front cooling fan and a set of chipsets heatsink module installed on its top surface, and a power supply with a cooling fan. The thermal module, the chipsets heatsink module, and the power supply are aligned along a single heat dissipating airflow stream. The external low temperature air first passes through the thermal module and removes the heat generated by the central processing unit, further flows into the chipsets heatsink module and removes the heat generated by the MCH chipsets and ICH chipsets, and finally enters into the power supply and removes the heat generated by the power supply.