Patents by Inventor Ying-Chun Lin

Ying-Chun Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240088307
    Abstract: A semiconductor package is provided. The semiconductor package includes a heat dissipation substrate including a first conductive through-via embedded therein; a sensor die disposed on the heat dissipation substrate; an insulating encapsulant laterally encapsulating the sensor die; a second conductive through-via penetrating through the insulating encapsulant; and a first redistribution structure and a second redistribution structure disposed on opposite sides of the heat dissipation substrate. The second conductive through-via is in contact with the first conductive through-via. The sensor die is located between the second redistribution structure and the heat dissipation substrate. The second redistribution structure has a window allowing a sensing region of the sensor die receiving light. The first redistribution structure is electrically connected to the sensor die through the first conductive through-via, the second conductive through-via and the second redistribution structure.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chih-Hao Chang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
  • Patent number: 11929318
    Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
  • Patent number: 8939906
    Abstract: A wireless intraocular pressure monitoring device includes reflecting and detecting modules. The reflecting module includes a soft contact lens having a curvature corresponding to that of a cornea while worn. A metal layer is embedded in and deformable with the soft contact lens. The detecting module includes two waveguides, an oscillator, and a converting unit. The oscillator is operable to generate oscillation signals having a frequency dependent on an equivalent impedance of the waveguides such that the equivalent impedance corresponds to intraocular pressure. The converting unit is operable for receiving and converting the oscillation signals into an output signal corresponding to the intraocular pressure.
    Type: Grant
    Filed: March 18, 2013
    Date of Patent: January 27, 2015
    Assignee: National Chiao Tung University
    Inventors: Tzuen-Hsi Huang, Ying-Chun Lin, Wei-Shang Su, Huey-Wen Cheng, Hong-Yi Huang, Ching-Hsing Luo, Jin-Chern Chiou
  • Publication number: 20140275936
    Abstract: A wireless intraocular pressure monitoring device includes reflecting and detecting modules. The reflecting module includes a soft contact lens having a curvature corresponding to that of a cornea while worn. A metal layer is embedded in and deformable with the soft contact lens. The detecting module includes two waveguides, an oscillator, and a converting unit. The oscillator is operable to generate oscillation signals having a frequency dependent on an equivalent impedance of the waveguides such that the equivalent impedance corresponds to intraocular pressure. The converting unit is operable for receiving and converting the oscillation signals into an output signal corresponding to the intraocular pressure.
    Type: Application
    Filed: March 18, 2013
    Publication date: September 18, 2014
    Applicant: NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: Tzuen-Hsi Huang, Ying-Chun Lin, Wei-Shang Su, Huey-Wen Cheng, Hong-Yi Huang, Ching-Hsing Luo, Jin-Chern Chiou
  • Patent number: 5741777
    Abstract: The present invention relates generally to methods and compositions for inhibiting wound contraction and the scarring that frequently results from such contraction. More particularly, the invention relates to the use of a protein tyrosine phosphatase inhibitor to block the dephosphorylation of protein tyrosine phosphatase receptors and interrupt the cyclic nature of wound contraction.
    Type: Grant
    Filed: October 31, 1995
    Date of Patent: April 21, 1998
    Assignee: Board of Regents, The University of Texas System
    Inventors: Frederick L. Grinnell, Ying-Chun Lin