Patents by Inventor Ying-Chung CHUANG

Ying-Chung CHUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230070726
    Abstract: A power converter is provided. The power converter includes a housing, a heat dissipation module, and a first circuit board. The housing forms a receiving space, wherein the housing includes a first housing port and a second housing port. The heat dissipation module is detachably connected to the housing, and disposed in the receiving space. The heat dissipation module includes an inner path that communicates the first housing port with the second housing port. Working fluid enters the inner path via the first housing port. The working fluid leaves the inner path via the second housing port. The first circuit board includes a first circuit board body and a first heat source, wherein the first heat source is disposed on the first circuit board body, and the first heat source is thermally connected to the inner path of the heat dissipation module.
    Type: Application
    Filed: November 16, 2022
    Publication date: March 9, 2023
    Inventors: Sheng-Nan TSAI, Ying-Chung CHUANG, Chia-Jung LIU, Yi-Wei CHEN, Han-Yu TAI, Shao-Hsiang LO
  • Patent number: 11547026
    Abstract: A power converter is provided. The power converter includes a housing, a heat dissipation module, and a first circuit board. The housing forms a receiving space, wherein the housing includes a first housing port and a second housing port. The heat dissipation module is detachably connected to the housing, and disposed in the receiving space. The heat dissipation module includes an inner path that communicates the first housing port with the second housing port. Working fluid enters the inner path via the first housing port. The working fluid leaves the inner path via the second housing port. The first circuit board includes a first circuit board body and a first heat source, wherein the first heat source is disposed on the first circuit board body, and the first heat source is thermally connected to the inner path of the heat dissipation module.
    Type: Grant
    Filed: April 1, 2021
    Date of Patent: January 3, 2023
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Sheng-Nan Tsai, Ying-Chung Chuang, Chia-Jung Liu, Yi-Wei Chen, Han-Yu Tai, Shao-Hsiang Lo
  • Publication number: 20220087077
    Abstract: A power converter is provided. The power converter includes a housing, a heat dissipation module, and a first circuit board. The housing forms a receiving space, wherein the housing includes a first housing port and a second housing port. The heat dissipation module is detachably connected to the housing, and disposed in the receiving space. The heat dissipation module includes an inner path that communicates the first housing port with the second housing port. Working fluid enters the inner path via the first housing port. The working fluid leaves the inner path via the second housing port. The first circuit board includes a first circuit board body and a first heat source, wherein the first heat source is disposed on the first circuit board body, and the first heat source is thermally connected to the inner path of the heat dissipation module.
    Type: Application
    Filed: April 1, 2021
    Publication date: March 17, 2022
    Inventors: Sheng-Nan TSAI, Ying-Chung CHUANG, Chia-Jung LIU, Yi-Wei CHEN, Han-Yu TAI, Shao-Hsiang LO