Patents by Inventor Ying CONG

Ying CONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12727284
    Abstract: This application is directed to a light-emitting diode epitaxial wafer, a growth method therefor, and a light-emitting diode chip. The growth method comprises: placing a sapphire substrate into a reaction chamber; introducing a reaction gas into the reaction chamber; forming GaN crystal nuclei containing In atoms on the sapphire substrate; growing at least one composite layer on the GaN crystal nuclei, the GaN crystal nuclei growing to form a buffer layer, each composite layer comprising an InGaN sublayer and a GaN sublayer; and successively growing an N-type GaN layer, an active layer and a P-type GaN layer on the buffer layer to form an epitaxial wafer, the active layer comprising alternately stacked InGaN quantum wells and GaN quantum barriers. Large and stable GaN crystal nuclei are formed to effectively counteract stress generated by lattice mismatch between the sapphire substrate and a GaN-based material.
    Type: Grant
    Filed: June 4, 2021
    Date of Patent: September 1, 2026
    Assignee: HC Semitek (Suzhou) Co. Ltd.
    Inventors: Zhen Yao, Ying Cong, Binzhong Dong, Peng Li
  • Publication number: 20240120434
    Abstract: The present disclosure belongs to the technical field of semiconductors, and provides a light-emitting diode epitaxial wafer, a growth method therefor, and a light-emitting diode chip. The growth method comprises: placing a sapphire substrate into a reaction chamber; introducing a reaction gas into the reaction chamber, and forming a plurality of GaN crystal nuclei containing In atoms on the surface of the sapphire substrate; growing at least one composite layer on the GaN crystal nuclei, the GaN crystal nuclei growing to form a buffer layer, and each composite layer comprising an InGaN sublayer and a GaN sublayer that is grown on the InGaN sublayer; and successively growing an N-type GaN layer, an active layer and a P-type GaN layer on the buffer layer to form an epitaxial wafer, the active layer comprising alternately stacked InGaN quantum wells and GaN quantum barriers.
    Type: Application
    Filed: June 4, 2021
    Publication date: April 11, 2024
    Inventors: Zhen YAO, Ying CONG, Binzhong DONG, Peng LI