Patents by Inventor Ying-Da Wang

Ying-Da Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die-to-Die Gap Control for Semiconductor Structure and Method
    Publication number: 20130049216
    Abstract: An embodiment is a structure comprising a substrate, a first die, and a second die. The substrate has a first surface and a second surface opposite the first surface. The substrate has a through substrate via extending from the first surface towards the second surface. The first die is attached to the substrate, and the first die is coupled to the first surface of the substrate. The second die is attached to the substrate, and the second die is coupled to the first surface of the substrate. A first distance is between a first edge of the first die and a first edge of the second die, and the first distance is in a direction parallel to the first surface of the substrate. The first distance is equal to or less than 200 micrometers.
    Type: Application
    Filed: August 30, 2011
    Publication date: February 28, 2013
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jing-Cheng Lin, Szu Wei Lu, Ying-Ching Shih, Ying-Da Wang, Li-Chung Kuo, Long Hua Lee, Shin-Puu Jeng, Chen-Hua Yu