Abstract: An axially-mountable device includes a semiconductor chip comprising lower and upper electrical contacts. A lower die pad is electrically and mechanically connected to the lower electrical contact of the chip. An upper die pad is electrically and mechanically connected to the upper electrical contact of the chip. A first axially extending electrical lead is electrically and mechanically connected to the upper die pad and extends in a first axial direction. A second axially extending electrical lead is electrically and mechanically connected to the lower die pad and extends in a second axial direction that is opposite to the first axial direction. Packaging material encapsulates the semiconductor chip, the upper and lower die pads and a portion of the first and second axially extending leads. The first and second leads extend from the packaging material and are adapted to allow the device to be axially-mounted with another electrical component.

Abstract: The present disclosure relates to a method, a device and a storage medium for controlling an electronic map. The method includes: detecting a first user operation, configured for setting a viewing angle of the electronic map; in response to the first user operation, setting the viewing angle of the electronic map; and if no first user operation being detected within a predetermined length of time, setting the viewing angle of the electronic map according a posture of the electronic apparatus detected at current time.

Abstract: An axially-mountable device includes a semiconductor chip comprising lower and upper electrical contacts. A lower die pad is electrically and mechanically connected to the lower electrical contact of the chip. An upper die pad is electrically and mechanically connected to the upper electrical contact of the chip. A first axially extending electrical lead is electrically and mechanically connected to the upper die pad and extends in a first axial direction. A second axially extending electrical lead is electrically and mechanically connected to the lower die pad and extends in a second axial direction that is opposite to the first axial direction. Packaging material encapsulates the semiconductor chip, the upper and lower die pads and a portion of the first and second axially extending leads. The first and second leads extend from the packaging material and are adapted to allow the device to be axially-mounted with another electrical component.

Abstract: A method of providing a direct electroless palladium deposit on a copper surface is described. The method comprises the steps of (a) catalyzing the copper surface by applying a pre-dip composition to the copper surface, the pre-dip composition comprising a reducing agent; and thereafter (b) contacting the catalyzed copper surface with an electroless palladium composition to deposit a layer of palladium on the copper surface.

Abstract: Indexes for predefined search orders of items in a database are generated and stored. When a client issues a database query a responsive pre-generated index list is retrieved and provided to the client for use in, e.g., populating a U/I view for a user. Only those items that a client needs, e.g., for populating a current U/I view, are retrieved from the database and output to the client. When a change is rendered to the database, e.g., an item is added or deleted or an existing item is altered, only the change is output to the client, rather than the entire modified index or altered item. In this manner clients can more quickly and efficiently respond to user data query requests by performing some processing upfront and by limiting communications traffic to communications relevant to the client's current processing.

Abstract: A managing method for an application program is disclosed, which includes that: a first terminal converts a file of a specified application program stored by the first terminal per se into an intermediate file in a predetermined intermediate format, wherein the intermediate format can be identified by other terminals having a running environment of the application program (S101); and the first terminal performs backup management on the specified application program by storing the intermediate file into a specified storage location, so as to enable a second terminal to recover the application program that has been made a backup, wherein both the second terminal and the first terminal have the running environment of the application program (S103). A managing device for an application program and a terminal are further disclosed.

Abstract: Indexes for predefined search orders of items in a database are generated and stored. When a client issues a database query a responsive pre-generated index list is retrieved and provided to the client for use in, e.g., populating a U/I view for a user. Only those items that a client needs, e.g., for populating a current U/I view, are retrieved from the database and output to the client. When a change is rendered to the database, e.g., an item is added or deleted or an existing item is altered, only the change is output to the client, rather than the entire modified index or altered item. In this manner clients can more quickly and efficiently respond to user data query requests by performing some processing upfront and by limiting communications traffic to communications relevant to the client's current processing.

Abstract: A managing method for an application program is disclosed, which includes that: a first terminal converts a file of a specified application program stored by the first terminal per se into an intermediate file in a predetermined intermediate format, wherein the intermediate format can be identified by other terminals having a running environment of the application program (S101); and the first terminal performs backup management on the specified application program by storing the intermediate file into a specified storage location, so as to enable a second terminal to recover the application program that has been made a backup, wherein both the second terminal and the first terminal have the running environment of the application program (S103). A managing device for an application program and a terminal are further disclosed.

Abstract: A method is provided for bonding a die comprising a solder layer which has a melting point Tm. A bond head is heated to a bond head setting temperature T1, which is higher than Tm, and a substrate is heated to a substrate setting temperature T2, which is lower than Tm. The bond head then picks up the die and heats the die towards temperature T1 so as to melt the solder layer. The solder layer of the die is pressed onto the substrate so as to bond the die to the substrate, and thereafter the bond head is separated from the die so that the solder layer is cooled towards T2 and solidifies.

Abstract: An apparatus and method for a two semiconductor device package where the semiconductor devices are connected in electrical series. The first device is mounted P-side down on an electrically conductive substrate. Non-active area on the P side is isolated from the electrically conductive substrate. The second device is mounted P-side up at a spaced apart location on the substrate. Opposite sides of each are electrically connected to leads to complete the series connection of the two devices. A method of manufacturing such a package includes providing an electrically conductive lead frame, mounting one device P-side up and flipping the other device and mounting it P-side down on the lead frame with non-active area of the P side isolated from the lead frame, and connecting the other side of each device to separate leads. Isolation of the non-active area of the P side of the device can be through modification of the substrate or lead frame surface by grooves or raised portions.

Abstract: A method is provided for bonding a die comprising a solder layer which has a melting point Tm. A bond head is heated to a bond head setting temperature T1, which is higher than Tm, and a substrate is heated to a substrate setting temperature T2, which is lower than Tm. The bond head then picks up the die and heats the die towards temperature T1 so as to melt the solder layer. The solder layer of the die is pressed onto the substrate so as to bond the die to the substrate, and thereafter the bond head is separated from the die so that the solder layer is cooled towards T2 and solidifies.

Abstract: In particular embodiments, the present invention provides a system and method for governance, risk, and compliance management. For example, a method for governance, risk, and compliance management includes providing an interface for defining a control to be used to reach a goal of an organization. The control provides a procedure to be followed by the organization. The method further includes providing the interface for implementing the control in order to reach the goal of the organization. The method further includes receiving metric data from an external source. The metric data includes a document link. The method further includes providing the interface for accessing, using the document link, one or more documents corresponding to the control. The one or more documents are accessed in such a way as to prevent the one or more documents from losing their status as original.

Abstract: In particular embodiments, the present invention provides a system and method for governance, risk, and compliance management. For example, a method for governance, risk, and compliance management includes providing an interface for defining a control to be used to reach a goal of an organization. The control provides a procedure to be followed by the organization. The method further includes providing the interface for defining a metric for tracking a progress of the organization towards reaching the goal using the procedure. The method further includes receiving metric data from an external source. The metric data corresponds to the metric. The method further includes tracking the progress of the organization towards reaching the goal using at least the metric and the metric data. The method further includes displaying the progress of the organization towards reaching the goal.

Abstract: An apparatus and method for a two semiconductor device package where the semiconductor devices are connected in electrical series. The first device is mounted P-side down on an electrically conductive substrate. Non-active area on the P side is isolated from the electrically conductive substrate. The second device is mounted P-side up at a spaced apart location on the substrate. Opposite sides of each are electrically connected to leads to complete the series connection of the two devices. A method of manufacturing such a package includes providing an electrically conductive lead frame, mounting one device P-side up and flipping the other device and mounting it P-side down on the lead frame with non-active area of the P side isolated from the lead frame, and connecting the other side of each device to separate leads. Isolation of the non-active area of the P side of the device can be through modification of the substrate or lead frame surface by grooves or raised portions.

Abstract: A simultaneous multianalyte electrochemical assay includes a cell which has a surface and the surface includes analyte binding sites i.e., antibodies or antigens on a solid phase at distinct separate locations. Separate working electrodes are located within proximity to these separate locations. Enzyme labeled antibodies or antigens depending on the assay format are added and the enzyme reaction product measured, by simultaneous amperometric measurement with the independent electrode in each area. The electrodes are spatially separated from adjacent analytes so that a measurement can be taken before cross-interference due to diffusion of product from adjacent analyte areas.

Abstract: The present invention sets forth an improved method of microetching a metal substrate by contacting the substrate with an aqueous composition comprising a sodium persulfate or hydrogen peroxide oxidizing agent, acid, and one or more additives. When the oxidizing agent is sodium persulfate, the one or more additives generally comprise an aliphatic saturated dicarboxylic acid. When the oxidizing agent is hydrogen peroxide, the one or more additives generally comprise a stabilizer and amino tris(methylene phosphonic acid).

Abstract: The present invention sets forth an improved method of microetching a metal substrate by contacting the substrate with an aqueous composition comprising a sodium persulfate or hydrogen peroxide oxidizing agent, acid, and one or more additives. When the oxidizing agent is sodium persulfate, the one or more additives generally comprise an aliphatic saturated dicarboxylic acid. When the oxidizing agent is hydrogen peroxide, the one or more additives generally comprise a stabilizer and amino tris(methylene phosphonic acid).

Abstract: The present invention is premised on the realization that a single electrochemical binding assay device can be used to determine multiple analytes in a single sample by simultaneous amperometric measurements using a plurality of working electrodes.