Abstract: A quantum dot luminophore comprising at least one luminescent core, a spacer layer, an encapsulation layer, and a plurality of quantum dots is disclosed. The luminescent core is designed to emit a red light after being excited by an incident blue light, and the quantum dots are configured to irradiate a green light by the illumination of the blue light and/or the red light. In the present invention, the quantum dots are particularly used to cover or surround the luminescent core for solving the light re-absorption. By such arrangement, even though part of incident blue light (about 10-30%) may be reflected by the luminescent core made of phosphor materials, the reflected blue light still can also be recycled by the quantum dots surrounding the luminescent core, such that the light conversion efficiency and emission intensity of the luminescent core are hence increased because the loss of blue light is decreased.

Abstract: A quantum dot luminophore comprising at least one luminescent core, a spacer layer, an encapsulation layer, and a plurality of quantum dots is disclosed. The luminescent core is designed to emit a red light after being excited by an incident blue light, and the quantum dots are configured to irradiate a green light by the illumination of the blue light and/or the red light. In the present invention, the quantum dots are particularly used to cover or surround the luminescent core for solving the light re-absorption. By such arrangement, even though part of incident blue light (about 10-30%) may be reflected by the luminescent core made of phosphor materials, the reflected blue light still can also be recycled by the quantum dots surrounding the luminescent core, such that the light conversion efficiency and emission intensity of the luminescent core are hence increased because the loss of blue light is decreased.

Abstract: An etching apparatus of a semiconductor processing apparatus and the method thereof for recycling etchant solutions are provided. The method is suitable for a processing apparatus which provides an etchant solution on a wafer so as to perform an etching process. After the etching process is completed, a water solution is added to the etchant solution for maintaining a water content thereof. Then, the mixed etchant solution is recycled.

Abstract: Semiconductor wafers have ashed photoresist residue and/or post-etch residue thereon to be cleaned through the chemical wet station, and a pattern of exposed metal layer. Post-etch residue removing solvent such as EKC-270 is fed into the solvent tank through a first solvent valve and first liquid feeding conduit that connected to bottom of the solvent tank. A circulation conduit connects the solvent tank with the first liquid feeding conduit for circulating the post-etch residue removing solvent. A liquid feeding pump is connected with the first liquid feeding conduit. A liquid drain conduit and a drain valve are connected with bottom of the solvent tank. Replacement solvent such as EKC-800 is fed into the solvent tank through a second solvent valve and second liquid feeding conduit.

Abstract: Semiconductor wafers have ashed photoresist residue and/or post-etch residue thereon to be cleaned through the chemical wet station, and a pattern of exposed metal layer. Post-etch residue removing solvent such as EKC-270 is fed into the solvent tank through a first solvent valve and first liquid feeding conduit that connected to bottom of the solvent tank. A circulation conduit connects the solvent tank with the first liquid feeding conduit for circulating the post-etch residue removing solvent. A liquid feeding pump is connected with the first liquid feeding conduit. A liquid drain conduit and a drain valve are connected with bottom of the solvent tank. Replacement solvent such as EKC-800 is fed into the solvent tank through a second solvent valve and second liquid feeding conduit.