Patents by Inventor Ying-Hsien HUANG

Ying-Hsien HUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11934027
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: June 21, 2022
    Date of Patent: March 19, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Patent number: 11929318
    Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: March 12, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu, Ying-Cheng Tseng, Po-Chun Lin
  • Patent number: 11377691
    Abstract: The present invention relates to methods that use novel biomarkers for diagnosing and/or treating Kawasaki diseases. The novel biomarkers of the invention show altered cytosine methylations state of certain CpG loci in subject with Kawasaki Disease relative to subject without Kawasaki diseases. Also provided are kits comprising at least one primer or reagent specific for the altered cytosine methylation state of certain CpG loci to detect Kawasaki Disease.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: July 5, 2022
    Assignee: Chang Gung Memorial Hospital, Kaohsiung
    Inventors: Ying-Hsien Huang, Ho-Chang Kuo
  • Publication number: 20190153081
    Abstract: The present invention relates to methods that use novel biomarkers for diagnosing and/or treating Kawasaki diseases. The novel biomarkers of the invention show altered cytosine methylations state of certain CpG loci in subject with Kawasaki Disease relative to subject without Kawasaki diseases. Also provided are kits comprising at least one primer or reagent specific for the altered cytosine methylation state of certain CpG loci to detect Kawasaki Disease.
    Type: Application
    Filed: November 20, 2018
    Publication date: May 23, 2019
    Inventors: Ying-Hsien HUANG, Ho-Chang KUO