Patents by Inventor Ying-Hsien HUANG

Ying-Hsien HUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12204163
    Abstract: An optical system affixed to an electronic apparatus is provided, including a first optical module, a second optical module, and a third optical module. The first optical module is configured to adjust the moving direction of a first light from a first moving direction to a second moving direction, wherein the first moving direction is not parallel to the second moving direction. The second optical module is configured to receive the first light moving in the second moving direction. The first light reaches the third optical module via the first optical module and the second optical module in sequence. The third optical module includes a first photoelectric converter configured to transform the first light into a first image signal.
    Type: Grant
    Filed: February 5, 2024
    Date of Patent: January 21, 2025
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Chih-Wei Weng, Chia-Che Wu, Chien-Yu Kao, Hsiao-Hsin Hu, He-Ling Chang, Chao-Hsi Wang, Chen-Hsien Fan, Che-Wei Chang, Mao-Gen Jian, Sung-Mao Tsai, Wei-Jhe Shen, Yung-Ping Yang, Sin-Hong Lin, Tzu-Yu Chang, Sin-Jhong Song, Shang-Yu Hsu, Meng-Ting Lin, Shih-Wei Hung, Yu-Huai Liao, Mao-Kuo Hsu, Hsueh-Ju Lu, Ching-Chieh Huang, Chih-Wen Chiang, Yu-Chiao Lo, Ying-Jen Wang, Shu-Shan Chen, Che-Hsiang Chiu
  • Patent number: 12205860
    Abstract: In an embodiment, a device includes: a sensor die having a first surface and a second surface opposite the first surface, the sensor die having an input/output region and a first sensing region at the first surface; an encapsulant at least laterally encapsulating the sensor die; a conductive via extending through the encapsulant; and a front-side redistribution structure on the first surface of the sensor die, the front-side redistribution structure being connected to the conductive via and the sensor die, the front-side redistribution structure covering the input/output region of the sensor die, the front-side redistribution structure having a first opening exposing the first sensing region of the sensor die.
    Type: Grant
    Filed: July 12, 2023
    Date of Patent: January 21, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tsung-Hsien Chiang, Yu-Chih Huang, Ting-Ting Kuo, Chih-Hsuan Tai, Ban-Li Wu, Ying-Cheng Tseng, Chi-Hui Lai, Chiahung Liu, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu
  • Patent number: 11377691
    Abstract: The present invention relates to methods that use novel biomarkers for diagnosing and/or treating Kawasaki diseases. The novel biomarkers of the invention show altered cytosine methylations state of certain CpG loci in subject with Kawasaki Disease relative to subject without Kawasaki diseases. Also provided are kits comprising at least one primer or reagent specific for the altered cytosine methylation state of certain CpG loci to detect Kawasaki Disease.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: July 5, 2022
    Assignee: Chang Gung Memorial Hospital, Kaohsiung
    Inventors: Ying-Hsien Huang, Ho-Chang Kuo
  • Publication number: 20190153081
    Abstract: The present invention relates to methods that use novel biomarkers for diagnosing and/or treating Kawasaki diseases. The novel biomarkers of the invention show altered cytosine methylations state of certain CpG loci in subject with Kawasaki Disease relative to subject without Kawasaki diseases. Also provided are kits comprising at least one primer or reagent specific for the altered cytosine methylation state of certain CpG loci to detect Kawasaki Disease.
    Type: Application
    Filed: November 20, 2018
    Publication date: May 23, 2019
    Inventors: Ying-Hsien HUANG, Ho-Chang KUO