Abstract: A package structure includes a thermal dissipation structure, a first encapsulant, a die, a through integrated fan-out via (TIV), a second encapsulant, and a redistribution layer (RDL) structure. The thermal dissipation structure includes a substrate and a first conductive pad disposed over the substrate. The first encapsulant laterally encapsulates the thermal dissipation structure. The die is disposed on the thermal dissipation structure. The TIV lands on the first conductive pad of the thermal dissipation structure and is laterally aside the die. The second encapsulant laterally encapsulates the die and the TIV. The RDL structure is disposed on the die and the second encapsulant.

Abstract: Apparatus and methods that employ divider walls that are configured for insertion and proper positioning within a cavity of an information handling system chassis enclosure in a mechanically non-interfering manner prior to securement of the divider wall in a fixed position within the cavity. A divider wall may be provided that is shorter than the height of a corresponding chassis enclosure cavity to allow the divider wall to be freely inserted and fixed in position within the chassis cavity in perpendicular relationship between two opposing cavity interior surfaces without any resulting compressive forces being applied to the respective ends of the divider wall by the opposing interior surfaces of the chassis enclosure cavity.

Abstract: Apparatus and methods that employ divider walls that are configured for insertion and proper positioning within a cavity of an information handling system chassis enclosure in a mechanically non-interfering manner prior to securement of the divider wall in a fixed position within the cavity. A divider wall may be provided that is shorter than the height of a corresponding chassis enclosure cavity to allow the divider wall to be freely inserted and fixed in position within the chassis cavity in perpendicular relationship between two opposing cavity interior surfaces without any resulting compressive forces being applied to the respective ends of the divider wall by the opposing interior surfaces of the chassis enclosure cavity.

Abstract: A support member includes a plate and an engaging member formed to the plate. The extends laterally and is defined by an upper surface, a lower surface and a rail that extends downward from the lower surface proximate an outer edge of the plate. The engaging member is formed to the lower surface of the plate and around a portion of the rail. The engaging member includes a surface engaging shoulder extending downward from a lower surface of the engaging member and formed around an outer surface of the engaging member. The surface engaging shoulder extends outside of and below the rail. The engaging member includes an upper shoulder formed above the surface engaging shoulder. The engaging member is configured so that the surface engaging shoulder and the upper shoulder flex upward when a force is applied downward to the upper surface of the plate.

Abstract: A support member includes a plate and an engaging member formed to the plate. The extends laterally and is defined by an upper surface, a lower surface and a rail that extends downward from the lower surface proximate an outer edge of the plate. The engaging member is formed to the lower surface of the plate and around a portion of the rail. The engaging member includes a surface engaging shoulder extending downward from a lower surface of the engaging member and formed around an outer surface of the engaging member. The surface engaging shoulder extends outside of and below the rail. The engaging member includes an upper shoulder formed above the surface engaging shoulder. The engaging member is configured so that the surface engaging shoulder and the upper shoulder flex upward when a force is applied downward to the upper surface of the plate.

Abstract: A device includes a screen back cover, a screen protective cover frame, a roller, and a screen protective cover. The screen back cover is configured to mount a screen to a computer. The screen protective cover frame includes a roller chamber, and is configured to snap fit with the screen back cover. The roller is disposed within the roller chamber, and is configured to guide a battery of the computer and to inhibit the battery from being placed in physical communication with the screen when the battery is inserted into the computer. The screen protective cover is in physical communication with the screen protective cover frame, and is configured to hold the roller within the roller chamber.

Abstract: A device includes a screen back cover, a screen protective cover frame, a roller, and a screen protective cover. The screen back cover is configured to mount a screen to a computer. The screen protective cover frame includes a roller chamber, and is configured to snap fit with the screen back cover. The roller is disposed within the roller chamber, and is configured to guide a battery of the computer and to inhibit the battery from being placed in physical communication with the screen when the battery is inserted into the computer. The screen protective cover is in physical communication with the screen protective cover frame, and is configured to hold the roller within the roller chamber.

Abstract: A metal container processing method includes steps of: a) stamping a metal sheet material into a blank container subject to the desired shape, b) removing sharp burrs and dents from the surface of the metal sheet material of the blank container with sodium nitrite solution, c) covering the surface of the metal sheet material of the blank container with a layer of surface coating of phosphorous compound, and d) covering said layer of surface coating with a layer of heat insulation coating containing Teflon and heat insulating material at the ratio of about 100:25˜35%.