Patents by Inventor Ying-Hua LAI

Ying-Hua LAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11969448
    Abstract: A probiotic composition for improving an effect of a chemotherapeutic drug of Gemcitabine on inhibiting pancreatic cancer is disclosed in the present disclosure. The probiotic composition comprises an effective amount of Lactobacillus paracasei GMNL-133, an effective amount of Lactobacillus reuteri GMNL-89, and a pharmaceutically acceptable carrier, wherein the Lactobacillus paracasei GMNL-133 was deposited in the China Center for Type Culture Collection on Sep. 26, 2011 under an accession number CCTCC NO. M 2011331, and the Lactobacillus reuteri GMNL-89 was deposited in the China Center for Type Culture Collection on Nov. 19, 2007 under an accession number CCTCC NO. M 207154. A method for improving the effect of the chemotherapeutic drug of Gemcitabine on inhibiting pancreatic cancer is further disclosed in the present disclosure.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: April 30, 2024
    Assignee: GENMONT BIOTECH INC.
    Inventors: Wan-Hua Tsai, I-ling Hsu, Shan-ju Hsu, Wen-ling Yeh, Ming-shiou Jan, Wee-wei Chieng, Li-jin Hsu, Ying-chun Lai
  • Publication number: 20210359085
    Abstract: A semiconductor device, includes a channel region, and a source/drain region adjacent to the channel region. The source/drain region includes a first epitaxial layer, a second epitaxial layer epitaxially formed on the first epitaxial layer and a third epitaxial layer epitaxially formed on the second epitaxial layer, and the first epitaxial layer is made of SiAs.
    Type: Application
    Filed: July 26, 2021
    Publication date: November 18, 2021
    Inventors: Cheng-Yi PENG, Ting TSAI, Chung-Wei HUNG, Jung-Ting CHEN, Ying-Hua LAI, Song-Bor LEE, Bor-Zen TIEN
  • Patent number: 11075269
    Abstract: A semiconductor device, includes a channel region, and a source/drain region adjacent to the channel region. The source/drain region includes a first epitaxial layer, a second epitaxial layer epitaxially formed on the first epitaxial layer and a third epitaxial layer epitaxially formed on the second epitaxial layer, and the first epitaxial layer is made of SiAs.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: July 27, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Cheng-Yi Peng, Ting Tsai, Chung-Wei Hung, Jung-Ting Chen, Ying-Hua Lai, Song-Bor Lee, Bor-Zen Tien
  • Publication number: 20200176566
    Abstract: A semiconductor device, includes a channel region, and a source/drain region adjacent to the channel region. The source/drain region includes a first epitaxial layer, a second epitaxial layer epitaxially formed on the first epitaxial layer and a third epitaxial layer epitaxially formed on the second epitaxial layer, and the first epitaxial layer is made of SiAs.
    Type: Application
    Filed: October 8, 2019
    Publication date: June 4, 2020
    Inventors: Cheng-Yi PENG, Ting TSAI, Chung-Wei HUNG, Jung-Ting CHEN, Ying-Hua LAI, Song-Bor LEE, Bor-Zen TIEN
  • Patent number: 9257505
    Abstract: A semiconductor device includes a semiconductor substrate and an isolation structure over the semiconductor substrate. The semiconductor device also includes a first epitaxial fin and a second epitaxial fin over the semiconductor substrate, and the first epitaxial fin and the second epitaxial fin protrude from the isolation structure. The semiconductor device further includes a gate stack over and traversing the first epitaxial fin and the second epitaxial fin. In addition, the semiconductor device includes a recess extending from a top surface of the isolation structure. The recess is between the first epitaxial fin and the second epitaxial fin.
    Type: Grant
    Filed: May 9, 2014
    Date of Patent: February 9, 2016
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ying-Hua Lai, Chia-Ming Chang, Tsung-Yu Chiang, Kuang-Hsin Chen
  • Publication number: 20150325646
    Abstract: A semiconductor device includes a semiconductor substrate and an isolation structure over the semiconductor substrate. The semiconductor device also includes a first epitaxial fin and a second epitaxial fin over the semiconductor substrate, and the first epitaxial fin and the second epitaxial fin protrude from the isolation structure. The semiconductor device further includes a gate stack over and traversing the first epitaxial fin and the second epitaxial fin. In addition, the semiconductor device includes a recess extending from a top surface of the isolation structure. The recess is between the first epitaxial fin and the second epitaxial fin.
    Type: Application
    Filed: May 9, 2014
    Publication date: November 12, 2015
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Ying-Hua LAI, Chia-Ming CHANG, Tsung-Yu CHIANG, Kuang-Hsin CHEN