Abstract: A computer-implemented method dynamically switches access plans for a query during concurrent query execution. The method includes receiving a first query configured to be processed by a database system. The method also includes generating, for the first query, an access plan for each of identified resource sets. The method includes determining a first set of available resources that represent an available capacity for the database system. The method further includes selecting a first resource set of the one or more resource sets, where the selecting is based on the first set of available resources being closest to the first resource set. The method also includes selecting, based on the first set of available resources, a first access plan of the one or more access plans. The method includes executing the first query and returning results of the first query to a source of the first query.

Abstract: An optical fiber module is provided and includes an optical fiber structure, a light-absorbing area and a photoelectric sensor in a housing. The optical fiber structure collectively arranges a plurality of first optical fibers to form at least one optical fiber bundle with a tapered end, and a second optical fiber is connected to the tapered end of the optical fiber bundle to converge the optical fiber bundle to the second optical fiber. The light-absorbing area corresponds to an end of the second optical fiber, such that the light-absorbing area absorbs scattering signals escaped and scattered when signals are transmitted from the plurality of first optical fibers to the second optical fiber. The photoelectric sensor is arranged corresponding to the plurality of first optical fibers to receive target signals escaped and refracted when the signals are transmitted from the second optical fiber to the plurality of first optical fibers.

Abstract: Some implementations described herein provide techniques and apparatuses for a fixture including a semiconductor die package and methods of formation. The semiconductor die package is mounted to an interposer. In addition to the semiconductor die package, the fixture includes a lid component having a top structure and footing structures that connect the lid component to the interposer. The fixture includes a thermal interface material between a top surface of the semiconductor die package and the top structure of the lid component. The footing structures, connected to the interposer using deposits of an epoxy material, provide increase a structural rigidity of the fixture relative to another fixture not including the footing structures.

Abstract: At least one computer processor can replace visual words of an unsupervised machine learning classification model with visual objects of an image. At least two co-occurring single visual objects adjacent to each other in pixels of the image can be combined to obtain a compound visual object. The unsupervised machine learning classification model can be augmented to model the image as a mixture of subjects, where each subject is represented through placements of the visual objects in a mixture of concentric spheres centering on a mixture of intersections on a mixture of horizontal layers. At least one processor can learn latent relationships between the placements of the visual objects in a three-dimensional space depicted in the image and image semantics. Learning the latent relationships trains the unsupervised machine learning classification model to perform image subject classification through the placements of the visual objects in a new image.

Abstract: A semiconductor device includes a package substrate, a package component and at least one adhesive pattern. The package component has a thermal interface material (TIM) layer thereon. The adhesive pattern has a first surface facing the package substrate and a second surface opposite to the first surface, and the second surface of the at least one adhesive pattern is substantially coplanar with a surface of the TIM layer.

Abstract: The present disclosure provides a packing method including following steps. Genetic algorithm is utilized to calculate multiple packing programs. Multiple candidate packing programs including all items are selected from the packing programs. Among each of the candidate packing programs, at least one of the items to be placed earlier is classified into a first subset, and at least another one of the items to be placed later is classified into a second subset. Among each of the candidate packing programs, a first packing for the first subset is maintained, and a second packing for the second subset is recalculated by using a greedy algorithm to generate an updated second packing.

Abstract: A semiconductor package including two different adhesives and a method of forming are provided. The semiconductor package may include a package component having a semiconductor die bonded to a substrate, a first adhesive over the substrate, a heat transfer layer on the package component, and a lid attached to the substrate by a second adhesive. The first adhesive may encircle the package component and the heat transfer layer. The lid may include a top portion on the heat transfer layer and the first adhesive, and a bottom portion attached to the substrate and encircling the first adhesive. A material of the second adhesive may be different from a material of the first adhesive.

Abstract: A laser processing system includes a laser source, an optical splitting unit, a frequency conversion unit and at least one optical mixer. The optical splitting unit is provided to divide light emitted by the laser source into a first light and a second light, and the first light and the second light have the same wavelength range. The frequency conversion unit is provided to convert the second light into a working light. The working light includes a frequency converted light, and the frequency converted light and the second light have different wavelength ranges. The optical mixer is provided to mix the first light with the frequency converted light.

Abstract: An organic semiconductor substrate includes a base, a first conductive pattern, a second conductive pattern, a first metal oxide pattern, a second metal oxide pattern, an organic flat pattern layer, a source, a drain, an organic semiconductor pattern, an organic gate insulating layer, and a gate. The first conductive pattern and the second conductive pattern are disposed on the base and separated from each other. The first metal oxide pattern and the second metal oxide pattern respectively cover and are electrically connected to the first conductive pattern and the second conductive pattern, respectively. A first portion of the organic flat pattern layer is disposed between the first metal oxide pattern and the second metal oxide pattern. A surface of the first metal oxide pattern has a first distance from the base. A surface of the first portion of the organic flat pattern layer has a second distance from the base. The second distance is less than or equal to the first distance.

Abstract: An earphone device is provided and includes: a wireless or wired transceiver module configured to receive a first electrical signal from an electronic device via a wireless or wired transmission network; a first compensation module connected to the wireless or wired transceiver module and arranged in a streaming audio gain compensating filter of an active noise cancellation chip, where the first compensation module is used to implement a frequency response curve to calculate a frequency response of the first electrical signal in each frequency band, and to generate a first filter parameter of a target frequency response curve via a first compensation gain conversion model, so that the first filter parameter gain compensates the first electrical signal in each of the frequencies; and a first transducer connected to the first compensation module to convert the first electrical signal gain compensating into sound and then transmit the sound.

Abstract: A self-fitting hearing compensation device with real-ear measurement is provided and includes: a first transducer, which receives a first test signal from a device and converts the first test signal into a first electrical signal; a first hearing compensation module, which is connected to the first transducer and performs gain compensation on the first electrical signal; a second transducer, which is connected to the first hearing compensation module, converts the gain-compensated first electrical signal into sound, and transmits the sound into an ear canal; and a third transducer, which synchronously converts the sound transmitted in the ear canal into a second electrical signal, so as to transmit the second electrical signal to the device via a wireless transmission network. In addition, a self-fitting hearing compensation method and a computer program product are also provided.

Abstract: A hearing compensation device is provided and includes a transducer, which receives sound to convert the sound into electrical signals; and a noise reduction module and a hearing compensation module, which are connected to the transducer to receive the electrical signals synchronously. The noise reduction module generates opposite signals with the same energy as the electrical signals to remove ambient noise. The hearing compensation module obtains a real-time customized audiogram or a hearing table according to a user's current real environment. Multiple sets of parameters of multiple filters are searched via active noise cancellation technology with optimization method and loss function to generate an optimal filter parameter value, such that the noise reduction module and the hearing compensation module disposed in the same chip perform real-time and/or synchronous processing to provide a hearing aid with reduced signal delay, real-time and user customization.

Abstract: A drying and filtering device. The filtering and drying device comprises a bearing base body, an adsorption drying tube and a refrigerating tube. The bearing base body comprises an upper adsorption airflow cavity and an upper refrigerating airflow cavity located at an upper end of the bearing base body, and a lower adsorption airflow cavity and a lower refrigerating airflow cavity located at a lower end of the bearing base body. The adsorption drying tube is vertically arranged between the upper end and the lower end, and communicates with the upper adsorption airflow cavity and the lower adsorption airflow cavity. The refrigerating tube is vertically arranged between the upper end and the lower end, and communicates with the upper refrigerating airflow cavity and the lower refrigerating airflow cavity. The bearing base body further comprises an air intake guide cavity, and communicates with the refrigerating tube and the adsorption drying tube.

Abstract: An optoelectronic tweezer device includes a transparent substrate, a semiconductor layer, a first electrode and a dielectric layer. The semiconductor layer is located above the transparent substrate and includes a first doping region, a second doping region and a transition region, wherein the transition region is located between the first doping region and the second doping region. The first electrode is located on the first doping region and is electrically connected to the first doping region. The dielectric layer is located above the semiconductor layer and has a first through hole overlapping the first electrode.

Abstract: A communication equipment receives a plurality of network sessions and includes a memory and a processor. The memory stores a plurality of software modules. The processor is connected to the memory and configured to implement the following steps. A network session inferring step is performed to execute an inference software module, and the inference software module processes at least one network packet of each of the network sessions and a packet characteristic module according to a machine learning algorithm to infer a priority level. An adaptive priority list establishing step is performed to execute a classification software module, and the classification software module establishes an adaptive priority list according to the priority levels of the network sessions. The communication equipment transmits the network packets of each of the network sessions to a network according to the adaptive priority list so as to set QoS of the network sessions.

Abstract: An adsorptive separation apparatus comprises an upper air pipe, a lower air pipe, an adsorption pipe assembly located between the upper air pipe and the lower air pipe, an oil-water separation seat located at an end of the lower air pipe, and an oil-water separator arranged in the oil-water separation seat. An inner cavity is formed in the oil-water separation seat, and an air intake port is provided on the outer side surface of the oil-water separation seat. The inner cavity is in communication with the air intake port and the lower air pipe. The oil-water separator is located in the inner cavity. The oil-water separator comprises a separator housing and multiple layers of wire meshes filled inside the separator housing. Multiple through holes are formed on the separator housing.

Abstract: A method of forming augmented corpus related to articulation disorder includes acquiring target speech feature data from a target corpus; acquiring training speech feature data from training corpora; training a conversion model to make it capable of converting training speech feature data into a respective output that is similar to the target speech feature data; receiving an augmenting source corpus and acquiring augmenting source speech feature data therefrom; converting, by the conversion model thus trained, the augmenting source speech feature data into converted speech feature data; and synthesizing the augmented corpus based on the converted speech feature data.

Abstract: An optical fiber module is provided and includes an optical fiber structure, a light-absorbing area and a photoelectric sensor in a housing. The optical fiber structure collectively arranges a plurality of first optical fibers to form at least one optical fiber bundle with a tapered end, and a second optical fiber is connected to the tapered end of the optical fiber bundle to converge the optical fiber bundle to the second optical fiber. The light-absorbing area corresponds to an end of the second optical fiber, such that the light-absorbing area absorbs scattering signals escaped and scattered when signals are transmitted from the plurality of first optical fibers to the second optical fiber. The photoelectric sensor is arranged corresponding to the plurality of first optical fibers to receive target signals escaped and refracted when the signals are transmitted from the second optical fiber to the plurality of first optical fibers.

Abstract: A heat exchange device and a freeze dryer. The freeze dryer comprises a bearing device, and an evaporation device and a condensation device which are provided on the bearing device, at least one of the evaporation device and the condensation device comprising a structure of the heat exchange device. The heat exchange device is integrally molded by extrusion, and the heat exchange device is provided with at least one medium flow passage, a plurality of fins are formed on the outer periphery of the medium flow passage, and the fins being provided at intervals to form gaps allowing airflows to pass therethrough. The heat exchange device and the freeze dryer of the present disclosure can be designed to be smaller, reducing the volume, and facilitating miniaturization of products.

Abstract: A light emitting diode (LED) package structure includes a first insulating layer, a first conductive pattern, a second insulating layer, a second conductive pattern, an LED element, and a solder material. The first conductive pattern has a first portion and a second portion, the first portion fills a through hole of the first insulating layer, and the second portion is disposed on the first insulating layer. The second insulating layer is disposed on the first insulating layer and covers the first conductive pattern. The second portion of the first conductive pattern is sandwiched between the first insulating layer and the second insulating layer. The second conductive pattern is disposed on the second insulating layer and is electrically connected to the first conductive pattern. The LED element is bonded to the second conductive pattern. The solder material is disposed on the first portion of the first conductive pattern.