Patents by Inventor Ying-Hui Shih

Ying-Hui Shih has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240096732
    Abstract: Some implementations described herein provide techniques and apparatuses for a fixture including a semiconductor die package and methods of formation. The semiconductor die package is mounted to an interposer. In addition to the semiconductor die package, the fixture includes a lid component having a top structure and footing structures that connect the lid component to the interposer. The fixture includes a thermal interface material between a top surface of the semiconductor die package and the top structure of the lid component. The footing structures, connected to the interposer using deposits of an epoxy material, provide increase a structural rigidity of the fixture relative to another fixture not including the footing structures.
    Type: Application
    Filed: January 13, 2023
    Publication date: March 21, 2024
    Inventors: Chih-Hao CHEN, Li-Hui CHENG, Ying-Ching SHIH
  • Publication number: 20240071847
    Abstract: A semiconductor package including two different adhesives and a method of forming are provided. The semiconductor package may include a package component having a semiconductor die bonded to a substrate, a first adhesive over the substrate, a heat transfer layer on the package component, and a lid attached to the substrate by a second adhesive. The first adhesive may encircle the package component and the heat transfer layer. The lid may include a top portion on the heat transfer layer and the first adhesive, and a bottom portion attached to the substrate and encircling the first adhesive. A material of the second adhesive may be different from a material of the first adhesive.
    Type: Application
    Filed: August 26, 2022
    Publication date: February 29, 2024
    Inventors: Yi-Huan Liao, Ping-Yin Hsieh, Chih-Hao Chen, Pu Wang, Li-Hui Cheng, Ying-Ching Shih
  • Publication number: 20240071857
    Abstract: A semiconductor device includes a package substrate, a package component and at least one adhesive pattern. The package component has a thermal interface material (TIM) layer thereon. The adhesive pattern has a first surface facing the package substrate and a second surface opposite to the first surface, and the second surface of the at least one adhesive pattern is substantially coplanar with a surface of the TIM layer.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Chien Pan, Pu Wang, Li-Hui Cheng, Ying-Ching Shih
  • Patent number: 10936025
    Abstract: A fixing bracket for holding an expansion card in a computer without screws includes first and second fixing frames and an elastic member connected to the first and second fixing frames. The two fixing frames define a receiving space for the expansion card. The first fixing frame can be moved relative to the second fixing frame, or the second fixing frame can be moved relative to the first fixing frame, by applying an external force to deform the elastic member. When the external force is released, the elastic member restores and clamps the expansion card in place until disassembly by the same process.
    Type: Grant
    Filed: July 30, 2019
    Date of Patent: March 2, 2021
    Assignee: HONGFUJIN PRECISION ELECTRONICS (TIANJIN) CO., LTD.
    Inventors: Tung-Ho Shih, Ying-Hui Shih, Ting-Ya Liao
  • Publication number: 20200319684
    Abstract: A fixing bracket for holding an expansion card in a computer without screws includes first and second fixing frames and an elastic member connected to the first and second fixing frames. The two fixing frames define a receiving space for the expansion card. The first fixing frame can be moved relative to the second fixing frame, or the second fixing frame can be moved relative to the first fixing frame, by applying an external force to deform the elastic member. When the external force is released, the elastic member restores and clamps the expansion card in place until disassembly by the same process.
    Type: Application
    Filed: July 30, 2019
    Publication date: October 8, 2020
    Inventors: TUNG-HO SHIH, YING-HUI SHIH, TING-YA LIAO
  • Patent number: 7623345
    Abstract: A fastening structure for fastening at least a storage component in a computer chassis includes a fixed support frame and at least a fastening apparatus. Additionally, the fastening structure can be utilized to perform a fastening or un-fastening operation with high speed on the storage components in the computer chassis without using any screws. Thus, the disclosed fastening structure can reduce cost of assembly and repair of the computer, and also can reduce time for assembly and repair of the computer.
    Type: Grant
    Filed: February 25, 2008
    Date of Patent: November 24, 2009
    Assignee: Lite-On Technology Corp.
    Inventor: Ying-Hui Shih
  • Publication number: 20080278907
    Abstract: A fastening apparatus for fastening at least an interface card includes a fixed support frame and at least a movable fastening structure. Additionally, the fastening structure can be utilized to perform a fastening or un-fastening operation with high speed on a plurality of interface cards simultaneously in the computer chassis without using any screws. Thus, the disclosed fastening apparatus can reduce cost of assembly and repair of the computer, and also can reduce time for assembly and repair of the computer.
    Type: Application
    Filed: March 3, 2008
    Publication date: November 13, 2008
    Inventor: Ying-Hui Shih
  • Publication number: 20080277547
    Abstract: A fastening structure for fastening at least a storage component in a computer chassis includes a fixed support frame and at least a fastening apparatus. Additionally, the fastening structure can be utilized to perform a fastening or un-fastening operation with high speed on the storage components in the computer chassis without using any screws. Thus, the disclosed fastening structure can reduce cost of assembly and repair of the computer, and also can reduce time for assembly and repair of the computer.
    Type: Application
    Filed: February 25, 2008
    Publication date: November 13, 2008
    Inventor: Ying-Hui Shih
  • Patent number: 7326077
    Abstract: A fixing device for an extension card having a bracket with a bent portion has a casing and a metal pressing member. The casing has a support portion. The metal pressing member has a longitudinal bottom plate, a pivotal structure, and a resilient latching structure. The pivotal structure is pivotally connected to the casing. The bent portion of the bracket of the extension card is placed on the support portion of the casing. The longitudinal bottom plate of the metal pressing member presses on the bent portion. The resilient latching structure of the metal pressing member detachably latches onto the casing. As a result, the extension card is capable of being retained in or dismounted from the casing easily and quickly.
    Type: Grant
    Filed: January 19, 2006
    Date of Patent: February 5, 2008
    Assignee: Lite-On Technology Corporation
    Inventors: Ying-Hui Shih, Yue-Wen Jiang
  • Publication number: 20070167064
    Abstract: A fixing device for an extension card having a bracket with a bent portion has a casing and a metal pressing member. The casing has a support portion. The metal pressing member has a longitudinal bottom plate, a pivotal structure, and a resilient latching structure. The pivotal structure is pivotally connected to the casing. The bent portion of the bracket of the extension card is placed on the support portion of the casing. The longitudinal bottom plate of the metal pressing member presses on the bent portion. The resilient latching structure of the metal pressing member detachably latches onto the casing. As a result, the extension card is capable of being retained in or dismounted from the casing easily and quickly.
    Type: Application
    Filed: January 19, 2006
    Publication date: July 19, 2007
    Inventors: Ying-Hui Shih, Yue-Wen Jiang