Patents by Inventor Ying Hung Kao

Ying Hung Kao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7964291
    Abstract: A magnesium alloy compound type thermal metal material includes a heat dissipation surface layer formed of a magnesium alloy, a contact surface layer formed of gold, platinum, silver, or copper alloy, and a fusion layer, which is an eutectic structure joined between the heat dissipation surface layer and the contact surface layer under and formed therebetween subject to application of a high temperature and a high pressure, such that the thermal conductivity metal alloy of the contact surface layer absorbs heat energy quickly from the heat source and transfers absorbed heat energy to the heat dissipation surface layer for quick dissipation; the internal molecules of the product are joined tightly together subject to the applied pressure, and the surface of the product allows for electroplating.
    Type: Grant
    Filed: August 27, 2007
    Date of Patent: June 21, 2011
    Assignee: Jiing Tung Tec. Metal Co., Ltd.
    Inventors: Ying Hung Kao, Emily Hsiao
  • Patent number: 7914902
    Abstract: A thermal module directly press-forged from magnesium alloy is disclosed having a peripheral wall, a recessed chamber surrounded by the peripheral wall. The body is made of magnesium alloy by means of softening magnesium alloy with heat and then press forging softened magnesium alloy into the desired shape.
    Type: Grant
    Filed: November 6, 2007
    Date of Patent: March 29, 2011
    Assignee: Jiing Tung Tec. Metal Co., Ltd.
    Inventors: Ying Hung Kao, Emily Hsiao