Abstract: A first and second patterned circuit layer are formed on a first surface and a second surface of a base material. A first adhesive layer is formed on the first patterned circuit layer. A portion of the first surface is exposed by the first patterned circuit layer. The metal reflection layer covers the first insulation layer and a reflectance thereof is greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer, and the first adhesive layer is disposed between the first patterned circuit layer and the first insulation layer. A transparent adhesive layer and a protection layer are formed on the metal reflection layer. The transparent adhesive layer is disposed between the metal reflection layer and the protection layer. The protection layer comprises a transparent polymer. The light transmittance is greater than or equal to 80%.

Abstract: Provided are a passivation layer for forming a semiconductor bonding structure, a sputtering target making the same, a semiconductor bonding structure and a semiconductor bonding process. The passivation layer is formed on a bonding substrate by sputtering the sputtering target; the passivation layer and the sputtering target comprise a first metal, a second metal or a combination thereof. The bonding substrate comprises a third metal. Based on a total atom number of the surface of the passivation layer, O content of the surface of the passivation layer is less than 30 at %; the third metal content of the surface of the passivation layer is less than or equal to 10 at %. The passivation layer has a polycrystalline structure. The semiconductor bonding structure sequentially comprises a first bonding substrate, a bonding layer and a second bonding substrate: the bonding layer is mainly formed by the passivation layer and the third metal.

Abstract: A base material is provided. A first patterned circuit layer and a second patterned circuit layer are formed on a first surface and a second surface of the base material. A first insulation layer and a metal reflection layer are provided on the first patterned circuit layer and a portion of the first surface exposed by the first patterned circuit layer, wherein the metal reflection layer covers the first insulation layer, and a reflectance of the metal reflection layer is substantially greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer. A first ink layer is formed on the first insulation layer before the metal reflection layer is formed.

Abstract: A stamp structure comprises a stamp pad and a handle. The stamp pad includes an image piece, a buffer piece, a twin adhesive, and an adhesion piece, arranged from bottom to top. A gum is located between the image piece and the buffer piece. The bottom surface of the handle has an adhesion area, which is selectively adhering on the adhesion piece. Since users can make the adhesion piece of the stamp pad to adhere or to detach on the adhesion area at their will, they can choose different stamp pads to adhere on the same handle. Compared with traditional stamp structure, the present invention can help to save the material of the handle and the room to accommodate the stamp.

Abstract: An automatic induction device for turning pages includes a plurality of inner pages, a plurality of conductive rubber pieces, a flexible printed circuit board, and an electronic unit. The inner pages connect with each other on one side and each has a groove on the connected side. The conductive rubber pieces are inserted in the grooves respectively and one end of each conductive rubber piece extends out of the corresponding groove. The flexible printed circuit board has a plurality of connecting finger conductive portions and a connecting end, the connecting finger conductive portions are inserted in the grooves and contact with the conductive rubber pieces, respectively. The electronic unit electrically connects with the connecting end of the flexible printed circuit board. Based on the above assemblies, the automatic induction device for turning pages, electronic audio books and photo albums has more reliable performance, a simple structure and a low cost.

Abstract: An automatic induction device for turning pages includes a plurality of inner pages, a plurality of conductive rubber pieces, a flexible printed circuit board, and an electronic unit. The inner pages connect with each other on one side and each has a groove on the connected side. The conductive rubber pieces are inserted in the grooves respectively and one end of each conductive rubber piece extends out of the corresponding groove. The flexible printed circuit board has a plurality of connecting finger conductive portions and a connecting end, the connecting finger conductive portions are inserted in the grooves and contact with the conductive rubber pieces, respectively. The electronic unit electrically connects with the connecting end of the flexible printed circuit board. Based on the above assemblies, the automatic induction device for turning pages, electronic audio books and photo albums has more reliable performance, a simple structure and a low cost.