Abstract: A communication device including a substrate, a gate drive circuit, and a first tunable unit is provided. The gate drive circuit is disposed on the substrate. The gate drive circuit includes a first thin-film transistor and is configured to output a gate drive signal. The first tunable unit is disposed on the substrate and is electrically connected to the gate drive circuit. The first tunable unit includes a first drive circuit and a first tunable component. The first drive circuit includes a first terminal and a second terminal, and the first terminal of the first drive circuit is configured to receive the gate drive signal. The first tunable component is electrically connected to the second terminal of the first drive circuit.

Abstract: An electronic device is provided. The electronic device includes a substrate, a radio frequency (RF) element, an electronic element, a coupler, a detector, a controller, and an impedance matching circuit. The RF element, the electronic element, the coupler, the detector, and the impedance matching circuits are arranged on the substrate. The coupler generates a first coupling output signal in response to a first input coupling signal and a second coupling output signal in response to a second input coupled signal. The detector generates a determination signal based on the first coupling output signal and the second coupling output signal. The controller is arranged outside the substrate and generates a control signal according to the determination signal. The impedance matching circuit provides an impedance for a transmission path between the RF element and the electronic element in response to the control signal.

Abstract: Disclosed is a package structure, including a first substrate, a second substrate, a bonding pad, a protective layer, and an air gap. The first substrate has a first surface and a second surface opposite to each other, and includes a first via extending from the first surface to the second surface. The second substrate is disposed on the first surface of the first substrate, has a third surface facing the first surface and a fourth surface opposite to the third surface, and includes a second via extending from the third surface to the fourth surface. The bonding pad is disposed between the first and second substrates and connected to the first and second vias. The protective layer is disposed between the first and second substrates, and surrounds the bonding pad. The air gap is disposed between the first and second substrates.

Abstract: An electronic device includes a board, a chip, a first conductive element and a second conductive element. The board has a first surface and a second surface opposite to the first surface. The board has a first through hole penetrating from the first surface to the second surface. The first conductive element is disposed between the board and the chip. The second conductive element has a first portion and a second portion connected to the first portion. The first conductive element is disposed between the first portion of the second conductive element and the board and overlaps with the first portion of the second conductive element. In a cross-sectional view of the electronic device, the second portion of the second conductive element directly contacts a side surface of the first conductive element and extends into the first through of the board.

Abstract: A display device, characterized in that the display device includes a first panel, having a first side and a first light shielding layer at a periphery of the first panel, wherein the first light shielding layer has a first edge departing away from the first side; and a second panel, disposed on the first panel, and having a second side adjacent to the first side; wherein the second panel includes a second light shielding layer at a periphery of the second panel; and the second light shielding layer has a second edge departing away from the second side. Wherein a first width is measured from the first side to the first edge along a direction, a second width is measured from the second side to the second edge along the direction, the second width is greater than the first width, and the direction is vertical to the first side.

Abstract: An electronic device including a glass substrate, a first circuit structure, and a second circuit structure. The glass substrate has a first side and a second side opposite to the first side, and includes a through via. The first circuit structure is disposed on the first side. The first circuit structure at least partially overlaps the through via. The second circuit structure is disposed on the second side. The second circuit structure at least partially overlaps the through via. The first circuit structure and the second circuit structure are electrically connected through the through via, and a thickness of the glass substrate is greater than or equal to 50 micrometers (?m) and less than or equal to 2 millimeters (mm).

Abstract: The disclosure provides an electronic device. The electronic device includes a plurality of units. Each of the units includes an integrated substrate. The integrated substrate includes a first dielectric layer, a first conductive layer, a second dielectric layer, and a second conductive layer. The first dielectric layer has a first side and a second side opposite to the first side. The first conductive layer is disposed on the first side. The second dielectric layer has a third side facing the second side and a fourth side opposite to the third side. The second conductive layer is disposed on the fourth side. A loss tangent of at least one of the first dielectric layer and the second dielectric layer is less than or equal to 0.1 and greater than 0. The electronic device of an embodiment of the disclosure may improve product yield.

Abstract: A display device is provided, which includes a first substrate, a second, a liquid-crystal layer, a first line, a second line and a patterned electrode. The patterned electrode includes a main portion with a cross shape, the patterned electrode is divided by the main portion into a first sub-portion, a second sub-portion, a third sub-portion and a fourth sub-portion. The first sub-portion includes a first edge extending along the second direction. The second sub-portion includes a second edge extending along the second direction. The third sub-portion includes a third edge extending along the second direction. The fourth sub-portion includes a fourth edge extending along the second direction. Each of the first edge, the second edge, the third edge and the fourth edge has a closed area.

Abstract: An electronic device and a manufacturing method thereof are provided. The manufacturing method of the electronic device includes forming a circuit substrate. Forming the circuit substrate includes providing a base material, wherein the base material has a first side and a second side opposite to each other. A contact pad is formed on the first side. An electronic element is provided. A conductive bump is formed on the contact pad, wherein the electronic element is bonded onto the circuit substrate via the conductive bump. A laser is applied to an area of the second side of the base material corresponding to the contact pad.

Abstract: A display device is provided, which includes a first substrate, a second, a backlight module, a liquid-crystal layer and a patterned electrode. The liquid-crystal layer is doped with a left-handed chiral dopant. The patterned electrode includes a main portion with a cross shape. The patterned electrode is divided by a first center line of the main portion into a first sub-portion and a second sub-portion. The first sub-portion and the second sub-portion are adjacent and are connected to the main portion. Each of the first sub-portion and the second sub-portion includes a plurality of branch portions. A first included angle is between one of the branch portions of the second sub-portion and the first center line. A second included angle is between one of the branch portions of the first sub-portion and the first center line. The first included angle and the second included angle are not equal.

Abstract: An electronic device and a manufacturing method thereof are provided. The electronic device includes an antenna structure, a first circuit structure, and a chip. The antenna structure includes a first dielectric layer, a first metal pattern, a second dielectric layer, and a second metal pattern. The first dielectric layer has a first surface and a second surface. The first metal pattern is disposed on the first surface. The second dielectric layer is disposed on the first metal pattern. The second metal pattern is disposed on the second dielectric layer. The first circuit structure is disposed on the antenna structure, and includes a third dielectric layer, a first conductive layer, and a first pad. The third dielectric layer is disposed on the second surface and has a fourth surface away from the second surface. The first conductive layer is disposed on the fourth surface. The first pad is disposed on the first conductive layer.

Abstract: A manufacturing method of an electronic device including the following steps is provided. First, a first conductive layer is formed on a substrate. Next, a first insulating layer and a second conductive layer are formed on the first conductive layer. The first insulating layer is disposed between the second conductive layer and the first conductive layer, and the first insulating layer has a via exposing a part of the first conductive layer. An aspect ratio of the via of the first insulating layer is greater than 1, and at least part of a sidewall of the first insulating layer is covered by the second conductive layer.

Abstract: A manufacturing method of an electronic device includes the following steps. First, a curved substrate is formed. Next, a first conductive layer is formed on a first insulating layer. Then, a second conductive layer is formed on a second insulating layer. Thereafter, the first insulating layer and the second insulating layer are bonded to the curved substrate. The manufacturing method of the electronic device may reduce problems such as peeling and/or offset of the manufactured electronic device.

Abstract: A method of manufacturing an electronic device, including the following steps, is provided. A first dielectric layer and a second dielectric layer are provided. The first dielectric layer has a first surface and a second surface opposite to each other, and the second dielectric layer has a third surface and a fourth surface opposite to each other. A first unit is formed on the first surface or the second surface of the first dielectric layer. The first dielectric layer and the second dielectric layer are combined to form a substrate structure. The second surface of the first dielectric layer faces the third surface of the second dielectric layer. A dielectric loss of the first unit is less than a dielectric loss of the first dielectric layer. The method of manufacturing the electronic device of the embodiment of the disclosure can reduce the dielectric loss by using the unit.

Abstract: An electronic device is provided. The electronic device includes a panel and a polarizing element. The polarizing element is disposed at one side of the panel, and the polarizing element includes a plurality of coating polarizing layers. A method for manufacturing an electronic device is further provided.

Abstract: Provided is an electronic device including a first liquid crystal layer having a first side and a second side opposite thereto; a second liquid crystal layer disposed on the first liquid crystal layer and having a third side and a fourth side opposite thereto; a first alignment layer disposed on the first side and having a first alignment direction; a second alignment layer disposed on the second side and having a second alignment direction opposite to the first alignment direction; a third alignment layer disposed on the third side and having a third alignment direction; and a fourth alignment layer disposed on the fourth side and having a fourth alignment direction opposite to the third alignment direction. The second alignment layer is between the first liquid crystal layer and the third alignment layer. The third alignment layer is between the second liquid crystal layer and the second alignment layer.

Abstract: A display device is provided, which includes a first substrate, a second, a backlight module, a liquid-crystal layer and a patterned electrode. The liquid-crystal layer is doped with a left-handed chiral dopant. The patterned electrode includes a main portion with a cross shape. The patterned electrode is divided by a first center line of the main portion into a first sub-portion and a second sub-portion. The first sub-portion and the second sub-portion are adjacent and are connected to the main portion. Each of the first sub-portion and the second sub-portion includes a plurality of branch portions. A first included angle is between one of the branch portions of the second sub-portion and the first center line. A second included angle is between one of the branch portions of the first sub-portion and the first center line. The first included angle and the second included angle are not equal.

Abstract: A communication device including a substrate, a gate drive circuit, and a first tunable unit is provided. The gate drive circuit is disposed on the substrate. The gate drive circuit includes a first thin-film transistor and is configured to output a gate drive signal. The first tunable unit is disposed on the substrate and is electrically connected to the gate drive circuit. The first tunable unit includes a first drive circuit and a first tunable component. The first drive circuit includes a first terminal and a second terminal, and the first terminal of the first drive circuit is configured to receive the gate drive signal. The first tunable component is electrically connected to the second terminal of the first drive circuit.

Abstract: A display device is provided. The display device includes a first substrate, a second substrate, a patterned electrode, a switch unit, and a liquid-crystal layer doped with a chiral dopant. The second substrate is disposed corresponding to the first substrate, and the patterned electrode is disposed on the first substrate or the second substrate. The switch unit is disposed adjacent to the patterned electrode. The liquid-crystal layer doped with the chiral dopant is disposed between the first substrate and the second substrate. In addition, an edge of the patterned electrode that is closest to the switch unit has an open area and a closed area, wherein the open area is adjacent to the closed area, and the patterned electrode extends a connecting portion out from the closed area and the connecting portion is connected to the switch unit.

Abstract: Provided is an electronic device including a first liquid crystal layer having a first side and a second side opposite thereto; a second liquid crystal layer disposed on the first liquid crystal layer and having a third side and a fourth side opposite thereto; a first alignment layer disposed on the first side and having a first alignment direction; a second alignment layer disposed on the second side and having a second alignment direction opposite to the first alignment direction; a third alignment layer disposed on the third side and having a third alignment direction; and a fourth alignment layer disposed on the fourth side and having a fourth alignment direction opposite to the third alignment direction. The second alignment layer is between the first liquid crystal layer and the third alignment layer. The third alignment layer is between the second liquid crystal layer and the second alignment layer.