Patents by Inventor Ying-Jen Liu

Ying-Jen Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11982866
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: May 14, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Liang-Ting Ho, Chen-Er Hsu, Yi-Liang Chan, Fu-Lai Tseng, Fu-Yuan Wu, Chen-Chi Kuo, Ying-Jen Wang, Wei-Han Hsia, Yi-Hsin Tseng, Wen-Chang Lin, Chun-Chia Liao, Shou-Jen Liu, Chao-Chun Chang, Yi-Chieh Lin, Shang-Yu Hsu, Yu-Huai Liao, Shih-Wei Hung, Sin-Hong Lin, Kun-Shih Lin, Yu-Cheng Lin, Wen-Yen Huang, Wei-Jhe Shen, Chih-Shiang Wu, Sin-Jhong Song, Che-Hsiang Chiu, Sheng-Chang Lin
  • Patent number: 11966170
    Abstract: A method includes receiving a wafer, measuring a surface topography of the wafer; calculating a topographical variation based on the surface topography measurement performing a single-zone alignment compensation when the topographical variation is less than a predetermined value or performing a multi-zone alignment compensation when the topographical variation is greater than the predetermined value; and performing a wafer alignment according to the single-zone alignment compensation or the multi-zone alignment compensation.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: April 23, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Ai-Jen Hung, Yung-Yao Lee, Heng-Hsin Liu, Chin-Chen Wang, Ying Ying Wang
  • Patent number: 6709278
    Abstract: A personal digital assistant (PDA) with a foldable memory card adapter has a PDA and a memory card adapter. The PDA is formed with a connecting slot in one edge of the PDA. The memory card adapter is connected to the PDA by a slide connector on an end a signal bus made of flexible material. When the card adapter is attached to the PDA, the slide connector is linked to the connecting port, whereby the memory card adapter can be folded to overlap the rear of the PDA. Thus the entire size of the PDA device is reduced and convenient to carry.
    Type: Grant
    Filed: March 21, 2002
    Date of Patent: March 23, 2004
    Assignee: Unication Co., Ltd.
    Inventor: Ying-Jen Liu
  • Publication number: 20030181074
    Abstract: A personal digital assistant (PDA) with a foldable memory card adapter has a PDA and a memory card adapter. The PDA is formed with a connecting slot in one edge of the PDA. The memory card adapter is connected to the PDA by a slide connector on an end a signal bus made of flexible material. When the card adapter is attached to the PDA, the slide connector is linked to the connecting port, whereby the memory card adapter can be folded to overlap the rear of the PDA. Thus the entire size of the PDA device is reduced and convenient to carry.
    Type: Application
    Filed: March 21, 2002
    Publication date: September 25, 2003
    Inventor: Ying-Jen Liu