Abstract: A semiconductor package including one or more dam structures and the method of forming are provided. A semiconductor package may include an interposer, a semiconductor die bonded to a first side of the interposer, an encapsulant on the first side of the interposer encircling the semiconductor die, a substrate bonded to the a second side of the interposer, an underfill between the interposer and the substrate, and one or more of dam structures on the substrate. The one or more dam structures may be disposed adjacent respective corners of the interposer and may be in direct contact with the underfill. The coefficient of thermal expansion of the one or more of dam structures may be smaller than the coefficient of thermal expansion of the underfill.

Abstract: A mobile communication system including a base station, a WLAN AP, and a mobile communication device is provided. The base station transmits a first measurement configuration including a first threshold value and a second threshold value which is less than the first threshold value. The WLAN AP is configured with a serving AP ID and a neighboring AP ID. The mobile communication device connects to the WLAN AP with the serving AP ID, measures a first signal strength of the WLAN AP with the serving AP ID according to the first measurement configuration, measures a second signal strength of the WLAN AP with the neighboring AP ID according to the first measurement configuration, and transmits a first measurement report to the base station when the first signal strength is less than the first threshold value and the second signal strength is greater than the second threshold value.

Abstract: A mobile communication system including a base station, a WLAN AP, and a mobile communication device is provided. The base station transmits a first measurement configuration including a first threshold value and a second threshold value which is less than the first threshold value. The WLAN AP is configured with a serving AP ID and a neighboring AP ID. The mobile communication device connects to the WLAN AP with the serving AP ID, measures a first signal strength of the WLAN AP with the serving AP ID according to the first measurement configuration, measures a second signal strength of the WLAN AP with the neighboring AP ID according to the first measurement configuration, and transmits a first measurement report to the base station when the first signal strength is less than the first threshold value and the second signal strength is greater than the second threshold value.