Abstract: A method of forming an integrated circuit (IC) package with improved performance and reliability is disclosed. The method includes forming a singulated IC die, coupling the singulated IC die to a carrier substrate, and forming a routing structure. The singulated IC die has a conductive via and the conductive via has a peripheral edge. The routing structure has a conductive structure coupled to the conductive via. The routing structure further includes a cap region overlapping an area of the conductive via, a routing region having a first width from a top-down view, and an intermediate region having a second width from the top-down view along the peripheral edge of the conductive via. The intermediate region is arranged to couple the cap region to the routing region and the second width is greater than the first width.

Abstract: An auto-focusing device for solar heat energy power generators includes a stationary heating unit for absorbing solar energy to make works, a lens unit including a lens and a frame, a first driving unit connected to the frame and driving the frame, and a tracking unit electrically connected to the first driving unit and controlling the first driving unit to output power. The lens is fixed to the frame and focuses solar beam on the heating unit. The frame is movable along a curved track such that the lens always aims at the sun. Multiple auto-focusing devices for solar heat energy power generators are arranged in matrix form so as to generate electric power.