Abstract: A light-emitting device comprises a substrate comprising a sidewall, a first top surface, and a second top surface, wherein the second top surface is closer to the sidewall of the substrate than the first top surface to the sidewall of the substrate; a semiconductor stack formed on the substrate comprising a first semiconductor layer, an active layer, and a second semiconductor layer; a dicing street surrounding the semiconductor stack, and exposing the first top surface and the second top surface of the substrate; a protective layer covering the semiconductor stack; a reflective layer comprising a Distributed Bragg Reflector structure covering the protective layer; and a cap layer covering the reflective layer, wherein the second top surface of the substrate is not covered by the protective layer, the reflective layer, and the cap layer.

Abstract: A method of manufacturing a composite article includes providing a polishing pad; rubbing over the polishing pad to produce a polishing pad debris; collecting the polishing pad debris; providing a wood material; and applying a force over the wood material and the polishing pad debris to form the composite article, wherein the composite article includes the wood material and the polishing pad debris, and the rubbing of the polishing pad includes removing a portion of the polishing pad to produce the polishing pad debris.

Abstract: The present disclosure provides a light-emitting package. The light-emitting package includes a main body, a cavity disposed in the cavity, a base plane in the cavity and a light-emitting element. The light-emitting element is disposed in the cavity and connected to the base plane. The light-emitting element includes a substrate and a semiconductor stack on the substrate. The substrate includes a side wall, and the side wall incudes a first cutting trace. The main body includes a step portion disposed in the cavity and it surrounds the light-emitting element. The step portion comprises a first height relative to base plane, and the first cutting trace comprises a second height relative to the base plane. The second height is greater than the first height.

Abstract: A tape laying device includes a tape transmission mechanism, a compaction head mechanism, a cutter mechanism, a heating mechanism and a motion mechanism. The tape transmission mechanism is configured to transmit the pre-impregnated tape. The compaction head mechanism, connected with the tape transmission mechanism, is configured to depress and drive the pre-impregnated tape transmitted by the tape transmission mechanism to follow a moving path so as to adhere the pre-impregnated tape onto the mould surface. The cutter mechanism is configured to cut the pre-impregnated tape. The heating mechanism, disposed downstream to the cutter mechanism, is configured to heat the pre-impregnated tape. The motion mechanism is used to have the cutter mechanism having an active path to move toward the moving path while the cutter mechanism cuts the pre-impregnated tape.

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of light-emitting elements on a first substrate and forming a first pattern array on a second substrate, wherein the first pattern array includes an adhesive layer. The method also includes transferring the plurality of light-emitting elements from the first substrate to the second substrate and forming the first pattern array on a third substrate. The method includes transferring the plurality of light-emitting elements from the second substrate to the third substrate, and reducing an adhesion force of a portion of the adhesive layer. The method also includes forming a second pattern array on a fourth substrate, and transferring the plurality of light-emitting elements from the third substrate to the fourth substrate. The pitch between the plurality of light-emitting elements on the first substrate is different than the pitch of the first pattern array.

Abstract: A method for manufacturing a semiconductor device is provided. The method includes forming a plurality of diodes on a first substrate and forming a first pattern array on a second substrate. The method also includes transferring the plurality of diodes from the first substrate to the second substrate. The method further includes forming the first pattern array on a third substrate. In addition, the method includes transferring the plurality of diodes from the second substrate to the third substrate. The method also includes forming a second pattern array on a fourth substrate. The method further includes transferring the plurality of diodes from the third substrate to the fourth substrate. The pitch between the plurality of diodes on the first substrate is different from the pitch of the first pattern array.

Abstract: Various embodiments of the present disclosure are directed towards a semiconductor structure including a first well region disposed within a substrate and comprising a first doping type. A conductive structure overlies the first well region. A pair of first doped regions is disposed within the first well region on opposing sides of the conductive structure. The pair of first doped regions comprise a second doping type opposite the first doping type. A pair of second doped regions is disposed within the first well region on the opposing sides of the conductive structure. The pair of second doped regions comprise the second doping type and are laterally offset from the pair of first doped regions by a non-zero distance.

Abstract: The present invention relates to an infusion product for making tea beverages, more specifically to a plant-based composition for making a tea beverage for food applications. The plants are fruits, herbs, tea and/or spices. The invention further relates to a method for producing said infusion product and its use for making a tea beverage as generated by a single-serve brewer, within a 1-minute timeframe. The invention enables users to prepare more complex tea beverages conveniently.

Abstract: A method of manufacturing a composite article includes providing a polishing pad; rubbing over the polishing pad to produce a polishing pad debris; collecting the polishing pad debris; providing a wood material; and applying a force over the wood material and the polishing pad debris to form the composite article, wherein the composite article includes the wood material and the polishing pad debris, and the rubbing of the polishing pad includes removing a portion of the polishing pad to produce the polishing pad debris.

Abstract: A multiplier for calculating a multiplication of a first fixed point number and a second fixed point number comprises a converter and a restoration circuit. The converter is configured to convert the first fixed point number to a sign, a mantissa, and an exponent. At least one of a bit width of the sign, a bit width of the mantissa, and a bit width of the exponent is dynamically configured based on a position of a layer associated with the first fixed point number in a neural network, a position of a pixel in an input feature map associated with the first fixed point number, and/or a channel associated with the first fixed point number. The restoration circuit is configured to calculate the multiplication based on the sign, the mantissa, the exponent, and the second fixed point number.

Abstract: A method and apparatus for performing motion recognition using motion sensor fusion and an associated computer program product are provided, where the method is applied to an electronic device. The method includes the steps of: utilizing a plurality of motion sensors of the electronic device to obtain sensor data respectively corresponding to the plurality of motion sensors, the sensor data measured at a device coordinate system of the electronic device, wherein the plurality of motion sensors includes inertial motion sensors; and performing sensor fusion according to the sensor data by converting at least one portion of the sensor data and derivatives of the sensor data into converted data based on a global coordinate system of a user of the electronic device, to perform motion recognition based on the global coordinate system, in order to recognize the user's motion.

Abstract: A system for predicting types of pathogens in patients with septicemia is provided. The system includes at least one sensor and a processor. The sensor is used to sense current physiological data including at least one of body temperature, blood pressure, and pulse. The processor is configured to calculate at least one feature value according to the current physiological data, and input the feature value into a machine learning model to determine one of categories including at least two of uninfected, fungal infected, contaminated bacteria infected, Gram-negative infected, and Gram-positive infected.

Abstract: A system for enhancing accuracy of body surface temperature measurement includes: a core body temperature sensor configured to obtain a core body temperature data of a user, a heart rate sensor configured to obtain a heart rate data of the user, a physical indicator sensor configured to obtain at least one physical indicator of the user, a body surface temperature sensor configured to obtain a body surface temperature data of the user, an environment temperature sensor configured to obtain an environment temperature data, a humidity sensor configured to obtain an environment humidity data, and a processor. The processor is configured to calculate a representative feature temperature data of the user according to the core temperature data, the heart rate data, the at least one physical indicator, the body surface temperature data, the environment temperature data, and the environment humidity data.

Abstract: A mobile device enables a user to edit a video containing a human figure, such that an original human pose is modified into a target human pose in the video. In response to a user command, the mobile device first identifies key points of the human figure from a frame of the video. The user command indicates a target position of a given key point of the key points. The mobile device generates a target frame including the target human pose, with the given key point of the target human pose at the target position. An edited frame sequence is generated on the display including the target frame. The edited frame sequence shows the movement of the human pose transitioning into the target human pose.

Abstract: A multiplier for calculating a multiplication of a first fixed point number and a second fixed point number comprises a converter and a restoration circuit. The converter is configured to convert the first fixed point number to a sign, a mantissa, and an exponent. At least one of a bit width of the sign, a bit width of the mantissa, and a bit width of the exponent is dynamically configured based on a position of a layer associated with the first fixed point number in a neural network, a position of a pixel in an input feature map associated with the first fixed point number, and/or a channel associated with the first fixed point number. The restoration circuit is configured to calculate the multiplication based on the sign, the mantissa, the exponent, and the second fixed point number.

Abstract: A method and apparatus for performing motion recognition using motion sensor fusion and an associated computer program product are provided, where the method is applied to an electronic device. The method includes the steps of: utilizing a plurality of motion sensors of the electronic device to obtain sensor data respectively corresponding to the plurality of motion sensors, the sensor data measured at a device coordinate system of the electronic device, wherein the plurality of motion sensors includes inertial motion sensors; and performing sensor fusion according to the sensor data by converting at least one portion of the sensor data and derivatives of the sensor data into converted data based on a global coordinate system of a user of the electronic device, to perform motion recognition based on the global coordinate system, in order to recognize the user's motion.

Abstract: The present invention broadly relates to a process for preparing products comprising active components, and in particular biological materials, wherein the active components are stabilised. The invention further relates to compositions comprising the products, and in particular compositions comprising therapeutic biological materials.

Abstract: A method and apparatus for performing motion recognition using motion sensor fusion and an associated computer program product are provided, where the method is applied to an electronic device. The method includes the steps of: utilizing a plurality of motion sensors of the electronic device to obtain sensor data respectively corresponding to the plurality of motion sensors, the sensor data measured at a device coordinate system of the electronic device, wherein the plurality of motion sensors includes inertial motion sensors; and performing sensor fusion according to the sensor data by converting at least one portion of the sensor data and derivatives of the sensor data into converted data based on a global coordinate system of a user of the electronic device, to perform motion recognition based on the global coordinate system, in order to recognize the user's motion.

Abstract: A photovoltaic junction box comprises a box body formed of a single integrally-molded part having a housing portion defining a receiving chamber and a packaging portion having a first packaging portion located inside the receiving chamber and a second packaging portion located outside the receiving chamber, a plurality of conductive terminals positioned along the box body and at least one diode chip disposed in a portion of the box body outside of the receiving chamber.

Abstract: A graphics processing unit (GPU) includes programmable shader hardware and grouping hardware. The grouping hardware receives pixels collected from a set of primitives, wherein pixel locations of each primitive have been obtained through rasterization of a set of vertices of the primitive. The grouping hardware also groups the pixels into a set of groups having a sequential order. None of the pixels in each group overlapped with each other in a display and overlapped pixels belong to different groups. The programmable shader hardware performs order-insensitive shader operations on the groups according to a first subset of an instruction set defined for a programmable shader, with two or more of the groups processed in parallel. The programmable shader hardware also performs order-sensitive shader operations on each of the groups in the sequential order according to a second subset of the instruction set defined for the programmable shader.