Abstract: An electronic device includes: a first panel including a first bonding pad and a first edge adjacent to the first bonding pad; a second panel overlapped with the first panel and including a second bonding pad; a circuit board electrically connected to the first panel and used to provide a first signal; and a first conductive connector electrically connected to the first panel and the second panel, wherein the first signal is input to the first bonding pad of the first panel through the circuit board, and input to the second bonding pad of the second panel through the first conductive connector, wherein the first bonding pad is between the second bonding pad and the first edge in a top view direction.

Abstract: A flexible circuit board designed for chip integration is provided. The flexible circuit board includes an insulating substrate, a conductive copper layer, a first tin layer, a second tin layer, and a first solder resist layer. The first tin layer has a first tin thickness, and the second tin layer has a greater second tin thickness. A first tin surface of the first tin layer and a second tin surface of the second tin layer are substantially level.

Abstract: A method forming a source/drain region based on a first portion of a semiconductor region, forming a high-k dielectric layer based on a second portion of the semiconductor region, forming a dipole film on the high-k dielectric layer, performing a treatment process on the dipole film using a process gas comprising nitrogen and hydrogen, performing a drive-in process to drive a dipole dopant in the dipole film into the high-k dielectric layer, and depositing a work-function layer on the high-k dielectric layer.

Abstract: Devices and methods of manufacture for a hybrid interposer within a semiconductor device. A semiconductor device may include a package substrate and a hybrid interposer. The hybrid interposer may include an organic interposer material layer, and a non-organic interposer material layer positioned between the organic interposer material layer and the package substrate. The semiconductor device may further include an integrated device positioned within the hybrid interposer. In one embodiment, the integrated device may be positioned within the organic interposer material layer. In another embodiment, the integrated device may be positioned within the non-organic interposer material layer. In a further embodiment, the integrated device may be positioned within the organic interposer material layer and the non-organic interposer material layer.

Abstract: A coupling system includes a chip configured to receive an optical signal, wherein an angle between a propagation direction of the optical signal and a top surface of the chip ranges from about 92-degrees to about 88-degrees. The chip includes a grating configured to receive the optical signal; and a waveguide, wherein the grating is configured to receive the optical signal and redirect the optical signal along the waveguide, and the grating is on a light incident side of the waveguide.

Abstract: An electronic device includes: a first substrate, wherein the first substrate is flexible; a second substrate disposed corresponding to the first substrate, wherein the second substrate is flexible; and a first conductive layer disposed on the first substrate. The first conductive layer includes: a first conductive pattern for receiving a first electrode signal and including a first bonding part; and a second conductive pattern for receiving a second electrode signal and including a second bonding part. The electronic device further includes: a second conductive layer disposed on the second substrate and electrically connected to the second conductive pattern; and a first metal layer disposed between the first substrate and at least one of the first bonding part and the second bonding part and is electrically connected to the at least one of the first bonding part and the second bonding part.

Abstract: A display apparatus including a foldable touch display panel and a display driving device is provided. The foldable touch display panel includes a plurality of touch sensors. The display driving device is coupled to the foldable touch display panel. The display driving device is configured to determine a folding angle of the foldable touch display panel according to a capacitance variation of the touch sensors in a folded state, and drive the foldable touch display panel to operate in a full panel display mode or in a partial panel display mode according to the folding angle.

Abstract: A method and system for online monitoring and compensation of inter-turn short circuit faults (ISF) in windings of electric machines, such as permanent magnet synchronous motors is provided. A method for characterizing an ISF in a winding of an electric machine comprises: measuring phase voltages and currents; calculating sequence components of the electric machine based on the phase voltages and currents; determining a ratio between a percentage of shorted turns in the winding and a fault loop resistance based on the sequence components of the electric machine; and estimating characteristics of the inter-turn short circuit fault using an unscented Kalman filter. The characteristics include at least one of: a fault current, the percentage of shorted turns, or the fault loop resistance. A method for compensation an ISF in a winding of an electric machine comprises compensating the fault current based on the compensation current estimated from an unscented Kalman filter.

Abstract: A photonic device includes a silicon layer, wherein the silicon layer includes a waveguide portion. The photonic device further includes a cladding layer over the waveguide portion, wherein the cladding layer partially exposes a surface of the waveguide portion. The photonic device further includes a low refractive index layer in direct contact with the cladding layer, wherein the low refractive index layer comprises silicon oxide, silicon carbide, silicon oxynitride, silicon carbon oxynitride, aluminum oxide or hafnium oxide. The photonic device further includes an interconnect structure over the low refractive index layer.

Abstract: The invention provides devices and methods for non-invasive monitoring and measuring of intraocular pressure (IOP) of a subject. Embodiments include a lens that is adapted to fit on the subject's eye, a microstructure disposed in or on the lens, the microstructure having at least one feature that exhibits a change in shape and/or geometry and/or position on the lens in response to a change in curvature of the lens. When the curvature of the lens changes in response to a change in IOP, a corresponding change in shape and/or geometry and/or position of the feature may be used to determine the change in IOP. The change in the feature is detectable in digital images of the lens taken with a mobile electronic device such as a smartphone.

Abstract: An electronic device and a battery management method thereof are provided. The method includes the following. A battery learning enable command is received to execute a battery learning operation. During an execution period of the battery learning operation, usage record data of a battery module is analyzed to obtain usage situation information. An appropriate value of a charging limit capacity is determined based on the usage situation information.

Abstract: A microphone system of the invention is applicable to an electronic device comprising an adjustable mechanism that causes a change in geometry of a microphone array. The microphone system comprises the microphone array, a sensor and a beamformer. The microphone array comprises multiple microphones that detect sound and generate multiple audio signals. The sensor detects a mechanism variation of the electronic device to generate a sensing output. The beamformer is configured to perform a set of operations comprising: performing a spatial filtering operation over the multiple audio signals using a trained model based on the sensing output, one or more first sound sources in one or more desired directions and one or more second sound sources in one or more undesired directions to generate a beamformed output signal originated from the one or more first sound sources.

Abstract: A coil module is provided, including a second coil mechanism. The second coil mechanism includes a third coil assembly and a second base corresponding to the third coil assembly. The second base has a positioning assembly corresponding to a first coil mechanism.

Abstract: An electronic device includes an encapsulant, an optical emitter, and an optical sensor. The optical sensor is encapsulated by the encapsulant. The optical emitter is supported by the encapsulant.

Abstract: An antenna structure includes a ground element, a feeding radiation element, a first radiation element, a second radiation element, a first coupling branch, and a dielectric substrate. The feeding radiation element has a feeding point. The first radiation element is coupled to the feeding radiation element. The second radiation element is coupled to the feeding radiation element. The second radiation element and the first radiation element substantially extend in opposite directions. The first coupling branch is coupled to a first grounding point on the ground element. The first coupling branch extends across the first radiation element. The first coupling branch includes a first coil portion and a first connection portion.

Abstract: A microphone system for a boomless headset is disclosed, comprising a microphone array and a processing unit. The microphone array comprises Q microphones and generates Q audio signals. A first microphone and a second microphone are disposed on different earcups, and a third microphone is disposed on one of two earcups and displaced laterally and vertically from one of the first and the second microphones. The processing unit performs operations comprising: performing spatial filtering over the Q audio signals using a trained model based on an arc line with a vertical distance and a horizontal distance from a midpoint between the first and the second microphones, a time delay range for the first and the second microphones and coordinates of the Q microphones to generate a beamformed output signal originated from zero or more target sound sources inside a target beam area, where Q>=3.

Abstract: A method for customizing an appearance of a merchandise which is suitable for being performed by a computing device in order to customize a customized choice result selected by a user includes a designed image and a merchandise information. The method includes receiving the designed image, receiving the merchandise information, overlappingly displaying the designed image on a virtual merchandise image corresponding to the merchandise information, receiving at least one edit operation for at least one designed element in the designed image, and editing for the designed element in the designed image according to the edit operation and then generating a customizing virtual image. Thereby, the method can be used for customizing an appearance of a merchandise and directly customize the designed image that has been arranged. In addition, a computing device and a non-transitory computer-readable recording medium for customizing the appearance of the merchandise are also provided.

Abstract: Examples herein relate to ambient noise level detection. For instance, in some examples an electronic device includes a cooling resource and a processor resource to alter an operational speed of the cooling resource from an initial operational speed to a first altered operational speed, detect an ambient noise level, compare the ambient noise level to a first noise threshold, and restrict the operational speed of the cooling resource to be less than the initial operational speed.

Abstract: A motor includes a rotor and a stator. The stator includes a stator core, and at least one coil module that is wound on the stator core. Each of the at least one coil module includes a plurality of first winding sets that are wound on the stator core. Each of the first winding sets includes a first end and a second end. For each of the at least one coil module, the first ends respectively of the first winding sets are electrically connected to each other, and the second ends respectively of the first winding sets are electrically connected to each other, such that the first winding sets are connected in parallel.