Abstract: A circuit board assembly in a camera module for blocking unwanted light when images are captured includes a circuit board, a sensor, and an optical blocking body connecting the circuit board and the sensor. The circuit board includes a base board and a photomask. The photomask is arranged on a surface of the base board, the base board includes conductive circuit layers and dielectric layers, the conductive circuit layers and the dielectric layers are alternately arranged, the sensor being electronically connected to the conductive layers. The optical blocking body, the photomask, and the dielectric layers block ambient light entering the camera module other than through the lens assembly of the camera module.

Abstract: An easily disassembled lens module in a terminal device includes a lens assembly, a circuit board, and a structural member. The circuit board includes a first portion, a second portion, and a third portion which are connected in sequence. The first portion is connected to the lens assembly, the second portion and the third portion protrude from the lens assembly. The structural member includes a connecting portion fixed on the third portion and at least one pulling portion protruding from the third portion. After installation in the terminal device, the lens assembly can be disassembled by using the at least one pulling portion to pull on the structural member so that the lens assembly can be disassembled without using tools and without causing damage.

Abstract: A chip carrier device includes a frame, a chip support and a limiter. The chip support is disposed on the frame, and includes a supporting film for chips to be adhered thereto. A peripheral portion of the supporting film is attached to a surrounding frame part of the frame. A crossing portion of the supporting film passes through a center of the supporting film, and interconnects two opposite points of the peripheral portion. The supporting film is formed with through holes. The limiter includes a limiting part that interconnects two opposite points of the surrounding frame part, that is positioned corresponding to the crossing portion, and that is positioned on one side of the supporting film where the chips are to be arranged.

Abstract: A semiconductor package having a partial outer metal layer and packaging method thereof is disclosed. In the method, a specific packaging substrate or a specific positioning plate is used to package multiple semiconductor devices and a partial outer metal layer is quickly formed on an encapsulation of each semiconductor device in the same step.

Abstract: A semiconductor package having a partial outer metal layer and packaging method thereof is disclosed. In the method, a specific packaging substrate or a specific positioning plate is used to package multiple semiconductor devices and a partial outer metal layer is quickly formed on an encapsulation of each semiconductor device in the same step.

Abstract: A chip carrier device includes a frame, a chip support and a limiter. The chip support is disposed on the frame, and includes a supporting film for chips to be adhered thereto. A peripheral portion of the supporting film is attached to a surrounding frame part of the frame. A crossing portion of the supporting film passes through a center of the supporting film, and interconnects two opposite points of the peripheral portion. The supporting film is formed with through holes. The limiter includes a limiting part that interconnects two opposite points of the surrounding frame part, that is positioned corresponding to the crossing portion, and that is positioned on one side of the supporting film where the chips are to be arranged.

Abstract: An image processing device able to receive image and other data wirelessly for more reliable communication includes at least one a camera module and at least one a processing module. The camera module includes a lens, an image sensor configured for converting the captured light into electrical signals and a first integrated unit. The at least one processing module includes a processor configured for generating signals of an image according to the electrical signals, and a second integrated unit. The first integrated unit and the second integrated unit establish a non-contact wireless communication connection therebetween, thereby realizing communicating between the camera module and the processing module.

Abstract: A laser color marking method for a semiconductor package has steps of: (a) providing a semiconductor element; (b) sputtering a metal layer on the semiconductor element; (c) obtaining a marking pattern; and (d) applying a laser light source on the marking region to form a mark according to the marking pattern. The mark is consisted of an optical oxide film converting ambient light to a corresponding color light, so a visible color mark is marked. Therefore, the present invention easily laser-marks the visible color mark on the semiconductor package.

Abstract: A method for manufacturing a chip package structure having a coating layer is provided. At least one chip package structure is mounted onto a terminal-protection film. The chip package structure has a top side, a back side opposite to the top side and a plurality of lateral sides. A plurality of terminals is disposed on the back side. The terminal-protection film at least partially seals the back side. A coating layer is formed over the top side, the lateral sides and a periphery region of the chip package structure, wherein the coating layer is not formed on the back side and the terminals. The terminal-protection film is debonded from the chip package structure.

Abstract: An apparatus includes a processing chamber having a plasma containing region, a dielectric plate secured on top of the processing chamber, a power source separated from the plasma containing region by the dielectric plate, and a chuck supported within the processing chamber. The chuck is operable and configured to move with respect to the power source.

Abstract: An exemplary method of making an FPC includes forming a substrate comprising metal foil layers interleaved with intervening layers by: (a) laminating intervening layers with metal foil layers; (b) adhering a covering film to outermost surfaces of the substrate; (c) defining a hole in one side of the substrate through the covering film and at least two metal foil layers and the intervening layer between the at least two metal foil layers by etching or laser technology; and (d) plating a portion of an inner wall of the hole with conductive material to form a via to electrically connect the at least two metal foil layers.

Abstract: A camera module includes a lens module, an image sensor, and a circuit board. The image sensor module is disposed in an image side of the lens module. The circuit board is electronically connected with the image sensor module. The circuit board includes a receiving chamber defined therein. The receiving chamber receives the image sensor module. The lens module is mounted on the circuit board and covers the receiving chamber. The image sensor module is fixed in the receiving chamber that is defined in the circuit board therein. Therefore, a thickness of the camera module along the axis of the camera module is decreased and a volume of the camera module becomes thinner compare with the conventional camera module.

Abstract: A method, computer program product, and system for managing row identifier (RID) list processing on an index are provided. The method, computer program product, and system provide for accessing one or more key values in the index based on one or more keys specified in a query, retrieving a plurality of row identifiers corresponding to the one or more key values from the index, and predicting an actual number of row identifiers to be retrieved from the index based on the one or more key values accessed and the plurality of row identifiers retrieved.

Abstract: A method, storage server, and computer readable medium for off-loading star-join operations from a host information processing system to a storage server. At least a first and second set of keys from a first and second dimension table, respectively are received from a host system. Each of the first and second set of keys is associated with at least one fact table. A set of locations associated with a set of foreign key indexes are received from the host system. A set of fact table indexes are traversed. At least a first set of Row Identifiers (“RIDs”) associated with the first set of keys and at least a second set of RIDs associated with the second set of keys are identified. An operation is performed on the first and second sets of RIDs to identify an intersecting set of RIDs. The intersecting set of RIDs are then stored.

Abstract: A adjustable upper coil or electrode for a reaction chamber apparatus useable in semiconductor processing, is constructed so that its shape may be selectively changed or so at least two portions thereof may be selectively driven at different power and/or frequencies. The adjustable upper coil or electrode, therefore, enables the plasma density distribution in the reaction chamber apparatus to be selectively controlled.

Abstract: A camera module includes a lens module, an image sensor, and a circuit board. The image sensor module is disposed in an image side of the lens module. The circuit board is electronically connected with the image sensor module. The circuit board includes a receiving chamber defined therein. The receiving chamber receives the image sensor module. The lens module is mounted on the circuit board and covers the receiving chamber. The image sensor module is fixed in the receiving chamber that is defined in the circuit board therein. Therefore, a thickness of the camera module along the axis of the camera module is decreased and a volume of the camera module becomes thinner compare with the conventional camera module.

Abstract: A method, storage server, and computer readable medium for off-loading star-join operations from a host information processing system to a storage server. At least a first and second set of keys from a first and second dimension table, respectively are received from a host system. Each of the first and second set of keys is associated with at least one fact table. A set of locations associated with a set of foreign key indexes are received from the host system. A set of fact table indexes are traversed. At least a first set of Row Identifiers (“RIDs”) associated with the first set of keys and at least a second set of RIDs associated with the second set of keys are identified. An operation is performed on the first and second sets of RIDs to identify an intersecting set of RIDs. The intersecting set of RIDs are then stored.

Abstract: An exemplary method of making an FPC includes forming a substrate comprising metal foil layers interleaved with intervening layers by: (a) laminating intervening layers with metal foil layers; (b) adhering a covering film to outermost surfaces of the substrate; (c) defining a hole in one side of the substrate through the covering film and at least two metal foil layers and the intervening layer between the at least two metal foil layers by etching or laser technology; and (d) plating a portion of an inner wall of the hole with conductive material to form a via to electrically connect the at least two metal foil layers.

Abstract: A camera module includes a lens module including a holder and configured for imaging, an image sensor module received in the holder of the lens module and configured for capturing images, and a protective film adhered to an outer surface of the lens module. Due to the protective film, the outer and inner screw threads of the barrel and the holder are insulated from the outside. As such, use of the protective film maintains the quality of image produced by the camera module.

Abstract: An exemplary camera module includes a lens module and a lens holder. The lens module is coupled with the lens holder using threads. The thread coupling section between the lens module and the lens holder is filled with a damping oil for sealing the thread coupling section.