Patents by Inventor Ying-Lin Hsu
Ying-Lin Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12087647Abstract: A compound closed-type metal lid for a semiconductor chip package is provided. The compound closed-type metal lid includes a cover plate, and a frame bottom board. The cover plate has a frame body, and a plurality of riveting holes. The riveting holes penetrate through the frame body and are distributed symmetrically on the frame body. The frame bottom board has a frame body, a plurality of riveting protrusions, and an opening. The riveting protrusions are distributed on an upper surface of the frame body. The cover plate is disposed on an upper surface of the frame bottom board. The riveting protrusions are correspondingly riveted in the riveting holes.Type: GrantFiled: February 18, 2022Date of Patent: September 10, 2024Assignee: HOJET TECHNOLOGY CO., LTD.Inventors: Ying-Lin Hsu, Juei-An Lo
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Patent number: 11935800Abstract: A compound metal lid for semiconductor chip package is provided. The compound metal lid includes a first cover and a second cover. The first cover has a first frame body, a plurality of riveting holes, and an upper opening. The riveting holes penetrate through the first frame body and are distributed symmetrically on the first frame body. The upper opening is formed at an inner part of the first frame body, and the riveting holes surround the upper opening. The second cover has a second frame body, a plurality of riveting protrusions, and a lower opening. The riveting protrusions are formed on the upper surface of the second frame body. The lower opening penetrates through the second frame body. The first cover is disposed on an upper surface of the second cover, and the riveting protrusions are correspondingly riveted in the riveting holes.Type: GrantFiled: January 27, 2022Date of Patent: March 19, 2024Assignee: HOJET TECHNOLOGY CO., LTD.Inventors: Ying-Lin Hsu, Juei-An Lo
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Patent number: 11915818Abstract: A system for assessing extubation includes a respiratory assistance device, an artificial intelligence platform, and a hospital information system. The respiratory assistance device is adapted to communicate with a trachea of a patient. The artificial intelligence platform includes a prediction module. A method for assessing extubation includes the following steps. Measured values of respiratory parameters of the patient are recorded by the respiratory assistance device. The recorded times and the measured values of the respiratory parameters corresponding to each of the recording times are transmitted to the artificial intelligence platform. The prediction module analyzes the measured values of respiratory parameters within a predetermined time period according to a prediction model to generate a prediction result. The prediction result is transmitted to the hospital information system and is recorded into a medical record of the patient.Type: GrantFiled: May 27, 2022Date of Patent: February 27, 2024Assignee: Changhua Christian Medical Foundation Changhua Christian HospitalInventors: Kuo-Yang Huang, Ying-Lin Hsu, Yin-Tzer Shih
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Publication number: 20230068670Abstract: A compound metal lid for semiconductor chip package is provided. The compound metal lid includes a first cover and a second cover. The first cover has a first frame body, a plurality of riveting holes, and an upper opening. The riveting holes penetrate through the first frame body and are distributed symmetrically on the first frame body. The upper opening is formed at an inner part of the first frame body, and the riveting holes surround the upper opening. The second cover has a second frame body, a plurality of riveting protrusions, and a lower opening. The riveting protrusions are formed on the upper surface of the second frame body. The lower opening penetrates through the second frame body. The first cover is disposed on an upper surface of the second cover, and the riveting protrusions are correspondingly riveted in the riveting holes.Type: ApplicationFiled: January 27, 2022Publication date: March 2, 2023Inventors: YING-LIN HSU, JUEI-AN LO
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Publication number: 20230062721Abstract: A compound closed-type metal lid for a semiconductor chip package is provided. The compound closed-type metal lid includes a cover plate, and a frame bottom board. The cover plate has a frame body, and a plurality of riveting holes. The riveting holes penetrate through the frame body and are distributed symmetrically on the frame body. The frame bottom board has a frame body, a plurality of riveting protrusions, and an opening. The riveting protrusions are distributed on an upper surface of the frame body. The cover plate is disposed on an upper surface of the frame bottom board. The riveting protrusions are correspondingly riveted in the riveting holes.Type: ApplicationFiled: February 18, 2022Publication date: March 2, 2023Inventors: YING-LIN HSU, JUEI-AN LO
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Publication number: 20220406436Abstract: A system for assessing extubation includes a respiratory assistance device, an artificial intelligence platform, and a hospital information system. The respiratory assistance device is adapted to communicate with a trachea of a patient. The artificial intelligence platform includes a prediction module. A method for assessing extubation includes the following steps. Measured values of respiratory parameters of the patient are recorded by the respiratory assistance device. The recorded times and the measured values of the respiratory parameters corresponding to each of the recording times are transmitted to the artificial intelligence platform. The prediction module analyzes the measured values of respiratory parameters within a predetermined time period according to a prediction model to generate a prediction result. The prediction result is transmitted to the hospital information system and is recorded into a medical record of the patient.Type: ApplicationFiled: May 27, 2022Publication date: December 22, 2022Applicants: Changhua Christian Medical Foundation Changhua Christian Hospital, National Chung Hsing UniversityInventors: KUO-YANG HUANG, Ying-Lin HSU, Yin-Tzer SHIH
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Publication number: 20110027038Abstract: A heat sink anchoring apparatus includes a bushing, an elastic element and an insertion rod. The bushing has a position end and a sleeve. The position end is latched on the baseboard to hold the bushing on the baseboard in an upright manner. The sleeve has an axle hole extended towards the position end and at least one track with a retaining notch formed on the inner edge of the axle hole. The elastic element and the anchoring leg are coupled on the sleeve at the outer edge. The insertion rod has at least one sliding portion to enter the track and a force applying portion at the other end. The force applying portion is compressible to compress the elastic element to form a retaining elastic force on the anchoring leg. The sliding portion is movable along the track and latchable on the retaining notch for positioning.Type: ApplicationFiled: July 28, 2009Publication date: February 3, 2011Inventors: Ying-Lin HSU, Yu-Cheng LIN, Pen-Chun YU
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Publication number: 20090135552Abstract: A heat dissipating device is disclosed. The heat dissipating device comprises a heat dissipating base, a frame and at least one resilient member. The heat dissipating base has a plate, and at least one hole is formed on the plate. The frame has at least one protruding column, and at least one side of the frame has a protrusion. The resilient member is put on the protruding column correspondingly. When the frame buckles an edge of the plate by the protrusion and be put on the heat dissipating base, the protruding column can pass through the hole on the plate to make the frame elastically associate with the heat dissipating base through the resilient member. Thus, the heat dissipating device makes the heat dissipating base keep closer contact with a chip, balances internal stresses, prevents hestsinks design from being restricted, and further lowers cost.Type: ApplicationFiled: November 5, 2008Publication date: May 28, 2009Applicant: COOLER MASTER CO., LTD.Inventors: Kun Feng Tu, Ying Lin Hsu, Tsung Hsi Yu
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Patent number: 7357174Abstract: A supporting seat includes a base adapted to be securely connected to the heat conductive plate, two arms extending obliquely from the base from two opposed sides of the base, two engagement plates each formed on a free end of a corresponding arm and adapted to engage with a bottom face of a lowermost one of the heat dissipating fins and multiple through holes defined through each of the two engagement plates for extension of the heat dissipating tubes. Weight of the heat dissipating fins is supported and deformation of the heat dissipating tubes is prevented.Type: GrantFiled: May 30, 2006Date of Patent: April 15, 2008Assignee: Cooler Master Co., Ltd.Inventors: Tsung-Jui Hsu, Ying-Lin Hsu
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Publication number: 20080066309Abstract: A fastening board for cooling fins includes a board body, a plurality of side boards, and a plurality of fasteners. The side boards are respectively located at the two opposite sides of the board body side. The fasteners are respectively located at the ends of the side boards. The fastening board for cooling fins is used for a tubular radiator to prevent the last cooling fin from coming off the pipe.Type: ApplicationFiled: September 5, 2007Publication date: March 20, 2008Inventors: Ying-Lin Hsu, Kun-Feng Tu
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Publication number: 20070254584Abstract: A heat dissipation structure including a wind cover, a heat sink and a wind-shielding plate is provided. The wind cover has an outlet and a fan connection portion corresponding to the outlet and having an inlet. In addition, the heat sink includes a base, multiple fins disposed in the wind cover, and at least a heat pipe passing through the fins and being fixed on the base. The wind-shielding plate is connected to a lowest one of the fins for leading an air flow to move around a heat source. Accordingly, the waste heat near the heat source can be taken away.Type: ApplicationFiled: October 6, 2006Publication date: November 1, 2007Applicant: COOLER MASTER CO., LTD.Inventors: Chun Po Chang, Ying Lin Hsu, Kun Feng Tu
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Publication number: 20070215328Abstract: A coated heat sink includes: a copper base seat, an aluminum heat-dissipating seat, a plurality of heat pipes, a solder, a heat-conducting adhesive glue, and a plurality of heat-dissipating fins. The aluminum heat-dissipating seat disposes on top of the copper base seat. The heat pipes dispose on the top of the copper base seat. The solder respectively forms on contact surfaces among the copper base seat and the heat pipes for joining the copper base seat and the heat pipes together. The glue respectively forms on contact surfaces between the copper base seat and the aluminum heat-dissipating seat and among the aluminum heat-dissipating seat and the heat pipes for joining the copper base seat and the aluminum heat-dissipating seat together, and the aluminum heat-dissipating seat and the heat pipes together. The fins dispose over the aluminum heat-dissipating seat, and the fins stack together and compactly joint with the heat pipes.Type: ApplicationFiled: February 5, 2007Publication date: September 20, 2007Inventors: Ying-Lin Hsu, Kun-Feng Tu
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Publication number: 20060272799Abstract: A supporting seat includes a base adapted to be securely connected to the heat conductive plate, two arms extending obliquely from the base from two opposed sides of the base, two engagement plates each formed on a free end of a corresponding arm and adapted to engage with a bottom face of a lowermost one of the heat dissipating fins and multiple through holes defined through each of the two engagement plates for extension of the heat dissipating tubes. Weight of the heat dissipating fins is supported and deformation of the heat dissipating tubes is prevented.Type: ApplicationFiled: May 30, 2006Publication date: December 7, 2006Applicant: COOLER MASTER CO., LTD.Inventors: Tsung-Jui Hsu, Ying-Lin Hsu